{"id":"https://openalex.org/W2003273813","doi":"https://doi.org/10.1109/iwasi.2013.6576100","title":"Thin film technology flexible thermoelectric generator and dedicated ASIC for energy harvesting applications","display_name":"Thin film technology flexible thermoelectric generator and dedicated ASIC for energy harvesting applications","publication_year":2013,"publication_date":"2013-06-01","ids":{"openalex":"https://openalex.org/W2003273813","doi":"https://doi.org/10.1109/iwasi.2013.6576100","mag":"2003273813"},"language":"en","primary_location":{"id":"doi:10.1109/iwasi.2013.6576100","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iwasi.2013.6576100","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"5th IEEE International Workshop on Advances in Sensors and Interfaces IWASI","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058005631","display_name":"Luca Francioso","orcid":"https://orcid.org/0000-0002-4500-0421"},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"L. Francioso","raw_affiliation_strings":["CNR-IMM, Institute for Microelectronics and Microsystems, Leece, Italy","IMM, Institute for Microelectronics and Microsystems, Consiglio Nazionale delle Ricerche, Lecce, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CNR-IMM, Institute for Microelectronics and Microsystems, Leece, Italy","institution_ids":["https://openalex.org/I4210165120"]},{"raw_affiliation_string":"IMM, Institute for Microelectronics and Microsystems, Consiglio Nazionale delle Ricerche, Lecce, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051845018","display_name":"Chiara De Pascali","orcid":"https://orcid.org/0000-0002-2673-4593"},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"C. De Pascali","raw_affiliation_strings":["CNR-IMM, Institute for Microelectronics and Microsystems, Leece, Italy","IMM, Institute for Microelectronics and Microsystems, Consiglio Nazionale delle Ricerche, Lecce, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CNR-IMM, Institute for Microelectronics and Microsystems, Leece, Italy","institution_ids":["https://openalex.org/I4210165120"]},{"raw_affiliation_string":"IMM, Institute for Microelectronics and Microsystems, Consiglio Nazionale delle Ricerche, Lecce, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073091905","display_name":"Pietro Siciliano","orcid":"https://orcid.org/0000-0002-1312-4593"},"institutions":[{"id":"https://openalex.org/I4210165120","display_name":"Institute for Microelectronics and Microsystems","ror":"https://ror.org/05vk2g845","country_code":"IT","type":"facility","lineage":["https://openalex.org/I4210155236","https://openalex.org/I4210165120"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"P. Siciliano","raw_affiliation_strings":["CNR-IMM, Institute for Microelectronics and Microsystems, Leece, Italy","IMM, Institute for Microelectronics and Microsystems, Consiglio Nazionale delle Ricerche, Lecce, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CNR-IMM, Institute for Microelectronics and Microsystems, Leece, Italy","institution_ids":["https://openalex.org/I4210165120"]},{"raw_affiliation_string":"IMM, Institute for Microelectronics and Microsystems, Consiglio Nazionale delle Ricerche, Lecce, Italy","institution_ids":["https://openalex.org/I4210165120"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085090066","display_name":"Arturo de Risi","orcid":"https://orcid.org/0000-0003-0437-4512"},"institutions":[{"id":"https://openalex.org/I142910587","display_name":"University of Salento","ror":"https://ror.org/03fc1k060","country_code":"IT","type":"education","lineage":["https://openalex.org/I142910587"]},{"id":"https://openalex.org/I4210096856","display_name":"Innovation Engineering (Italy)","ror":"https://ror.org/00sxjp357","country_code":"IT","type":"company","lineage":["https://openalex.org/I4210096856"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"A. De Risi","raw_affiliation_strings":["Department of Innovation Engineering, University of Salento, Leece, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Innovation Engineering, University of Salento, Leece, Italy","institution_ids":["https://openalex.org/I4210096856","https://openalex.org/I142910587"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040110283","display_name":"S. D\u2019Amico","orcid":"https://orcid.org/0000-0003-2886-2166"},"institutions":[{"id":"https://openalex.org/I142910587","display_name":"University of Salento","ror":"https://ror.org/03fc1k060","country_code":"IT","type":"education","lineage":["https://openalex.org/I142910587"]},{"id":"https://openalex.org/I4210096856","display_name":"Innovation Engineering (Italy)","ror":"https://ror.org/00sxjp357","country_code":"IT","type":"company","lineage":["https://openalex.org/I4210096856"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"S. D'Amico","raw_affiliation_strings":["Department of Innovation Engineering, University of Salento, Leece, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Innovation Engineering, University of Salento, Leece, Italy","institution_ids":["https://openalex.org/I4210096856","https://openalex.org/I142910587"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026580415","display_name":"C. Veri","orcid":"https://orcid.org/0000-0001-9251-4604"},"institutions":[{"id":"https://openalex.org/I142910587","display_name":"University of Salento","ror":"https://ror.org/03fc1k060","country_code":"IT","type":"education","lineage":["https://openalex.org/I142910587"]},{"id":"https://openalex.org/I4210096856","display_name":"Innovation Engineering (Italy)","ror":"https://ror.org/00sxjp357","country_code":"IT","type":"company","lineage":["https://openalex.org/I4210096856"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"C. Veri","raw_affiliation_strings":["Department of Innovation Engineering, University of Salento, Leece, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Innovation Engineering, University of Salento, Leece, Italy","institution_ids":["https://openalex.org/I4210096856","https://openalex.org/I142910587"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5086476561","display_name":"Mirko Pasca","orcid":null},"institutions":[{"id":"https://openalex.org/I142910587","display_name":"University of Salento","ror":"https://ror.org/03fc1k060","country_code":"IT","type":"education","lineage":["https://openalex.org/I142910587"]},{"id":"https://openalex.org/I4210096856","display_name":"Innovation Engineering (Italy)","ror":"https://ror.org/00sxjp357","country_code":"IT","type":"company","lineage":["https://openalex.org/I4210096856"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"M. Pasca","raw_affiliation_strings":["Department of Innovation Engineering, University of Salento, Leece, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Innovation Engineering, University of Salento, Leece, Italy","institution_ids":["https://openalex.org/I4210096856","https://openalex.org/I142910587"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.3813,"has_fulltext":false,"cited_by_count":27,"citation_normalized_percentile":{"value":0.7960438,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"104","last_page":"107"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11230","display_name":"Innovative Energy Harvesting Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","score":0.9847000241279602,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoelectric-generator","display_name":"Thermoelectric generator","score":0.7234334945678711},{"id":"https://openalex.org/keywords/energy-harvesting","display_name":"Energy harvesting","score":0.6790668964385986},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.6463638544082642},{"id":"https://openalex.org/keywords/thermoelectric-effect","display_name":"Thermoelectric effect","score":0.46508166193962097},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.45238426327705383},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.44650036096572876},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4445640742778778},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.44016045331954956},{"id":"https://openalex.org/keywords/thermocouple","display_name":"Thermocouple","score":0.42451053857803345},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"Flexible electronics","score":0.41133370995521545},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.3951084315776825},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.36676472425460815},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.27338188886642456},{"id":"https://openalex.org/keywords/energy","display_name":"Energy (signal processing)","score":0.20910999178886414},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20817041397094727}],"concepts":[{"id":"https://openalex.org/C117127486","wikidata":"https://www.wikidata.org/wiki/Q11569191","display_name":"Thermoelectric generator","level":3,"score":0.7234334945678711},{"id":"https://openalex.org/C101518730","wikidata":"https://www.wikidata.org/wiki/Q930236","display_name":"Energy harvesting","level":3,"score":0.6790668964385986},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.6463638544082642},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.46508166193962097},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.45238426327705383},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.44650036096572876},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4445640742778778},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.44016045331954956},{"id":"https://openalex.org/C168068576","wikidata":"https://www.wikidata.org/wiki/Q190241","display_name":"Thermocouple","level":2,"score":0.42451053857803345},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.41133370995521545},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.3951084315776825},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.36676472425460815},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.27338188886642456},{"id":"https://openalex.org/C186370098","wikidata":"https://www.wikidata.org/wiki/Q442787","display_name":"Energy (signal processing)","level":2,"score":0.20910999178886414},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20817041397094727},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iwasi.2013.6576100","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iwasi.2013.6576100","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"5th IEEE International Workshop on Advances in Sensors and Interfaces IWASI","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.800000011920929,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1976516445","https://openalex.org/W2038511975","https://openalex.org/W2045841718","https://openalex.org/W2053548271","https://openalex.org/W2082404621","https://openalex.org/W2102109582","https://openalex.org/W2170116904","https://openalex.org/W2273787505","https://openalex.org/W4285719527","https://openalex.org/W6693919286"],"related_works":["https://openalex.org/W2966484342","https://openalex.org/W1992175215","https://openalex.org/W2026588589","https://openalex.org/W2025486907","https://openalex.org/W2027878388","https://openalex.org/W2106391930","https://openalex.org/W3216017874","https://openalex.org/W2089713851","https://openalex.org/W2074638727","https://openalex.org/W2097565870"],"abstract_inverted_index":{"In":[0],"this":[1],"work":[2],"we":[3],"present":[4],"a":[5,12,21,70,78,209],"thermoelectric":[6,17],"energy":[7,30],"harvesting":[8],"system":[9],"consisting":[10],"of":[11,54,90,171,189],"miniaturized":[13],"and":[14,20,28,56,65,93,126,139,181,213,221],"wearable":[15,105],"flexible":[16,43,79],"generator":[18],"(TEG)":[19],"dedicated":[22],"ASIC,":[23,195],"finalized":[24],"to":[25,60,69,82,119,123,133,143,161,166,175,184,202,207],"efficiently":[26],"recover":[27],"manage":[29],"from":[31,136],"heat":[32],"dispersed":[33],"into":[34],"the":[35,83,97,113,130,163,169,177,190,203],"environment.":[36],"The":[37],"proposed":[38],"TEG":[39,98,204],"was":[40,99,151,200],"realized":[41],"on":[42,153,197],"Kapton":[44],"substrate,":[45,73],"which":[46],"is":[47],"particularly":[48],"appreciated":[49],"for":[50,104,168,218],"its":[51,124],"optimum":[52],"properties":[53],"chemical":[55],"physical":[57],"stability,":[58],"permeability":[59],"atmospheric":[61],"agents":[62],"(humidity,":[63],"oxygen)":[64],"thermal":[66],"conductivity.":[67],"Contrary":[68],"conventional":[71],"rigid":[72],"like":[74],"glass":[75],"or":[76],"silicon,":[77],"one":[80],"adds":[81],"device":[84,114],"lighter":[85],"weight,":[86],"increased":[87],"robustness,":[88],"freedom":[89],"shape,":[91],"compactness,":[92],"low":[94],"cost.":[95],"Although":[96],"designed":[100,194],"as":[101],"\"electronic":[102],"garment\"":[103],"use":[106,167],"in":[107,159,205],"Ambient":[108],"Assisted":[109],"Living":[110],"(AAL)":[111],"applications,":[112],"can":[115],"be":[116],"easily":[117],"adapted":[118],"different":[120,155],"contexts":[121],"thanks":[122],"flexibility":[125],"design":[127],"that":[128],"extend":[129],"application":[131],"range":[132],"various":[134],"sectors,":[135],"home":[137],"automation":[138],"structural":[140],"health":[141],"monitoring":[142],"biotechnology.":[144],"A":[145,192],"Transfer":[146],"Length":[147],"Method":[148],"(TLM)":[149],"analysis":[150],"performed":[152],"three":[154],"multi-layer":[156],"contact":[157,182],"schemes":[158],"order":[160,206],"select":[162],"best":[164],"solution":[165,217],"deposition":[170],"both":[172],"embedded":[173],"thermometers":[174],"monitor":[176],"thermocouples":[178],"junctions":[179],"temperature":[180],"pads":[183],"electrically":[185],"test":[186],"single":[187],"partitions":[188],"array.":[191],"custom":[193],"based":[196],"step-up":[198],"principle":[199],"coupled":[201],"ensure":[208],"1.2":[210],"V":[211],"output":[212],"complete":[214],"power":[215],"management":[216],"wireless":[219],"sensing":[220],"data":[222],"acquisition.":[223]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":8},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":8}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}