{"id":"https://openalex.org/W1971046942","doi":"https://doi.org/10.1109/iwasi.2013.6576068","title":"BIST of interconnection lines in the pixel matrix of CMOS imagers","display_name":"BIST of interconnection lines in the pixel matrix of CMOS imagers","publication_year":2013,"publication_date":"2013-06-01","ids":{"openalex":"https://openalex.org/W1971046942","doi":"https://doi.org/10.1109/iwasi.2013.6576068","mag":"1971046942"},"language":"en","primary_location":{"id":"doi:10.1109/iwasi.2013.6576068","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iwasi.2013.6576068","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"5th IEEE International Workshop on Advances in Sensors and Interfaces IWASI","raw_type":"proceedings-article"},"type":"preprint","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016491223","display_name":"Richun Fei","orcid":null},"institutions":[{"id":"https://openalex.org/I4210131305","display_name":"Institut de Chimie Mol\u00e9culaire de Reims","ror":"https://ror.org/03c0nx407","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I4210128300","https://openalex.org/I4210131305","https://openalex.org/I96226040"]},{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"Richun Fei","raw_affiliation_strings":["STMicroelectronics, Crolles, FR","ICMR - Institut de Chimie Mol\u00e9culaire de Reims - UMR 7312 (UFR Sciences, BP1039, 51687 Reims Cedex 2 - France)","STMicroelectronics (France)"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, FR","institution_ids":[]},{"raw_affiliation_string":"ICMR - Institut de Chimie Mol\u00e9culaire de Reims - UMR 7312 (UFR Sciences, BP1039, 51687 Reims Cedex 2 - France)","institution_ids":["https://openalex.org/I4210131305"]},{"raw_affiliation_string":"STMicroelectronics (France)","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111535674","display_name":"Jocelyn Moreau","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},{"id":"https://openalex.org/I4210131305","display_name":"Institut de Chimie Mol\u00e9culaire de Reims","ror":"https://ror.org/03c0nx407","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I4210128300","https://openalex.org/I4210131305","https://openalex.org/I96226040"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Jocelyn Moreau","raw_affiliation_strings":["STMicroelectronics, Grenoble, France","ICMR - Institut de Chimie Mol\u00e9culaire de Reims - UMR 7312 (UFR Sciences, BP1039, 51687 Reims Cedex 2 - France)","STMicroelectronics (France)"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Grenoble, France","institution_ids":["https://openalex.org/I4210104693"]},{"raw_affiliation_string":"ICMR - Institut de Chimie Mol\u00e9culaire de Reims - UMR 7312 (UFR Sciences, BP1039, 51687 Reims Cedex 2 - France)","institution_ids":["https://openalex.org/I4210131305"]},{"raw_affiliation_string":"STMicroelectronics (France)","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061963866","display_name":"Salvador Mir","orcid":"https://orcid.org/0000-0001-9911-8946"},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210087012","display_name":"Techniques of Informatics and Microelectronics for Integrated Systems Architecture","ror":"https://ror.org/000063q30","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I4210087012","https://openalex.org/I4210159245","https://openalex.org/I899635006","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},{"id":"https://openalex.org/I177483745","display_name":"Universit\u00e9 Joseph Fourier","ror":"https://ror.org/02aj0kh94","country_code":"FR","type":"education","lineage":["https://openalex.org/I177483745"]},{"id":"https://openalex.org/I1294671590","display_name":"Centre National de la Recherche Scientifique","ror":"https://ror.org/02feahw73","country_code":"FR","type":"funder","lineage":["https://openalex.org/I1294671590"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Salvador Mir","raw_affiliation_strings":["TIMA Laboratory (CNRS, Grenoble INP), UJF, Grenoble, France","TIMA - Techniques de l'Informatique et de la Micro\u00e9lectronique pour l'Architecture des syst\u00e8mes int\u00e9gr\u00e9s (46 avenue F\u00e9lix Viallet\r\n38031 GRENOBLE Cedex 1 - France)"],"affiliations":[{"raw_affiliation_string":"TIMA Laboratory (CNRS, Grenoble INP), UJF, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210087012","https://openalex.org/I177483745","https://openalex.org/I899635006","https://openalex.org/I1294671590"]},{"raw_affiliation_string":"TIMA - Techniques de l'Informatique et de la Micro\u00e9lectronique pour l'Architecture des syst\u00e8mes int\u00e9gr\u00e9s (46 avenue F\u00e9lix Viallet\r\n38031 GRENOBLE Cedex 1 - France)","institution_ids":["https://openalex.org/I4210087012"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5016491223"],"corresponding_institution_ids":["https://openalex.org/I4210104693","https://openalex.org/I4210131305"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.05122423,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"174","last_page":"177"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/pixel","display_name":"Pixel","score":0.8162529468536377},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6656954288482666},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5751670002937317},{"id":"https://openalex.org/keywords/built-in-self-test","display_name":"Built-in self-test","score":0.5733364224433899},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.553903341293335},{"id":"https://openalex.org/keywords/residual","display_name":"Residual","score":0.4714542329311371},{"id":"https://openalex.org/keywords/fault-coverage","display_name":"Fault coverage","score":0.46960175037384033},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4558166563510895},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3904774487018585},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.33087900280952454},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2977398633956909},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.22603416442871094},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.21401256322860718},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.18125951290130615},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.15347793698310852},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11865529417991638}],"concepts":[{"id":"https://openalex.org/C160633673","wikidata":"https://www.wikidata.org/wiki/Q355198","display_name":"Pixel","level":2,"score":0.8162529468536377},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6656954288482666},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5751670002937317},{"id":"https://openalex.org/C2780980493","wikidata":"https://www.wikidata.org/wiki/Q181142","display_name":"Built-in self-test","level":2,"score":0.5733364224433899},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.553903341293335},{"id":"https://openalex.org/C155512373","wikidata":"https://www.wikidata.org/wiki/Q287450","display_name":"Residual","level":2,"score":0.4714542329311371},{"id":"https://openalex.org/C126953365","wikidata":"https://www.wikidata.org/wiki/Q5438152","display_name":"Fault coverage","level":3,"score":0.46960175037384033},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4558166563510895},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3904774487018585},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.33087900280952454},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2977398633956909},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.22603416442871094},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.21401256322860718},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.18125951290130615},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.15347793698310852},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11865529417991638}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/iwasi.2013.6576068","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iwasi.2013.6576068","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"5th IEEE International Workshop on Advances in Sensors and Interfaces IWASI","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:hal-01017962v1","is_oa":false,"landing_page_url":"https://hal.science/hal-01017962","pdf_url":null,"source":{"id":"https://openalex.org/S4406922461","display_name":"SPIRE - Sciences Po Institutional REpository","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"5th International Workshop on Advances in Sensors and Interfaces (IWASI), Jun 2013, Bari, Italy. pp.174-177, ⟨10.1109/IWASI.2013.6576068⟩","raw_type":"Conference papers"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.44999998807907104,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2038860063","https://openalex.org/W2117936236","https://openalex.org/W2133986248","https://openalex.org/W2153839509","https://openalex.org/W2161358183","https://openalex.org/W2164704391","https://openalex.org/W6679851222","https://openalex.org/W6921413617"],"related_works":["https://openalex.org/W2989159162","https://openalex.org/W2153201966","https://openalex.org/W2122754719","https://openalex.org/W2139513292","https://openalex.org/W1982569681","https://openalex.org/W776711554","https://openalex.org/W1874778078","https://openalex.org/W2536854812","https://openalex.org/W2005858638","https://openalex.org/W3147816099"],"abstract_inverted_index":{"Interconnection":[0],"lines":[1,20,90],"in":[2,18,40,72,133],"the":[3,25,53,70,73,112,134,140],"sensors":[4],"of":[5,24,44,66,115,146,150],"CMOS":[6],"imagers":[7],"are":[8,47,60,111],"used":[9],"for":[10,99,118],"pixel":[11,26,74,135],"bias,":[12],"addressing":[13],"and":[14,31,38,58,109,153],"readout.":[15],"Catastrophic":[16],"faults":[17,78,108],"these":[19,76,131],"can":[21,104],"cause":[22,114],"parts":[23],"matrix":[27],"to":[28,50,129],"operate":[29],"incorrectly":[30],"produce":[32],"image":[33,45,54,100],"defects":[34,46,71,103,132],"like":[35],"residual":[36],"stripes":[37],"bands":[39],"images.":[41],"These":[42,102],"kinds":[43],"often":[48],"difficult":[49],"remove":[51],"by":[52],"processing":[55],"correction":[56],"algorithm,":[57],"they":[59,110],"clearly":[61],"visible":[62],"as":[63],"a":[64],"sort":[65],"noise":[67],"pattern.":[68],"Among":[69],"array,":[75,136],"catastrophic":[77,107],"have":[79],"most":[80],"important":[81],"influence":[82],"on":[83,94],"yield.":[84],"In":[85],"addition,":[86],"partially":[87],"degraded":[88],"metal":[89],"cannot":[91],"be":[92],"detected":[93],"todays'":[95],"standard":[96],"industrial":[97,141],"testers":[98],"sensors.":[101],"evolve":[105],"into":[106,138],"main":[113],"customer":[116],"returns":[117],"many":[119],"products.":[120],"This":[121],"paper":[122],"proposes":[123],"two":[124],"built-in":[125],"self-test":[126],"(BIST)":[127],"solutions":[128],"catch":[130],"taking":[137],"account":[139],"test":[142,151,154],"constraints,":[143],"namely":[144],"increase":[145],"fault":[147],"coverage,":[148],"decrease":[149],"time":[152],"cost":[155],"minimization.":[156]},"counts_by_year":[{"year":2021,"cited_by_count":1}],"updated_date":"2026-03-28T08:17:26.163206","created_date":"2025-10-10T00:00:00"}