{"id":"https://openalex.org/W3121313763","doi":"https://doi.org/10.1109/itc44778.2020.9325280","title":"Memory repair logic sharing techniques and their impact on yield","display_name":"Memory repair logic sharing techniques and their impact on yield","publication_year":2020,"publication_date":"2020-11-01","ids":{"openalex":"https://openalex.org/W3121313763","doi":"https://doi.org/10.1109/itc44778.2020.9325280","mag":"3121313763"},"language":"en","primary_location":{"id":"doi:10.1109/itc44778.2020.9325280","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc44778.2020.9325280","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080636005","display_name":"Benoit Nadeau-Dostie","orcid":null},"institutions":[{"id":"https://openalex.org/I2801914806","display_name":"Siemens (Canada)","ror":"https://ror.org/03cpzkh11","country_code":"CA","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I2801914806"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Benoit Nadeau-Dostie","raw_affiliation_strings":["Mentor, A Siemens Business, Ottawa, Canada"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Ottawa, Canada","institution_ids":["https://openalex.org/I2801914806"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5062014302","display_name":"Luc Romain","orcid":null},"institutions":[{"id":"https://openalex.org/I2801914806","display_name":"Siemens (Canada)","ror":"https://ror.org/03cpzkh11","country_code":"CA","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I2801914806"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Luc Romain","raw_affiliation_strings":["Mentor, A Siemens Business, Ottawa, Canada"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Ottawa, Canada","institution_ids":["https://openalex.org/I2801914806"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5080636005"],"corresponding_institution_ids":["https://openalex.org/I2801914806"],"apc_list":null,"apc_paid":null,"fwci":0.2055,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.53374384,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cluster-analysis","display_name":"Cluster analysis","score":0.6005217432975769},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.6003453135490417},{"id":"https://openalex.org/keywords/logic-gate","display_name":"Logic gate","score":0.5773217678070068},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5710666179656982},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5072750449180603},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.41707855463027954},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.28193971514701843},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1993577778339386},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.14129552245140076},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.12719252705574036},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.11187049746513367}],"concepts":[{"id":"https://openalex.org/C73555534","wikidata":"https://www.wikidata.org/wiki/Q622825","display_name":"Cluster analysis","level":2,"score":0.6005217432975769},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.6003453135490417},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.5773217678070068},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5710666179656982},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5072750449180603},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.41707855463027954},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.28193971514701843},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1993577778339386},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.14129552245140076},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.12719252705574036},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.11187049746513367},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/itc44778.2020.9325280","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc44778.2020.9325280","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.44999998807907104,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1943460993","https://openalex.org/W1994359746","https://openalex.org/W2110881464","https://openalex.org/W2136132716","https://openalex.org/W2146999492","https://openalex.org/W2570086276","https://openalex.org/W6655490732"],"related_works":["https://openalex.org/W4298130764","https://openalex.org/W2804364458","https://openalex.org/W2132641928","https://openalex.org/W4310225030","https://openalex.org/W2090259340","https://openalex.org/W1926736923","https://openalex.org/W2158836806","https://openalex.org/W2393816671","https://openalex.org/W2083665254","https://openalex.org/W2386800167"],"abstract_inverted_index":{"Techniques":[0],"for":[1],"sharing":[2],"memory":[3],"repair":[4,20],"logic":[5],"amongst":[6],"memories":[7],"are":[8],"described.":[9],"The":[10,25],"techniques":[11],"allows":[12],"reducing":[13],"silicon":[14,43],"area":[15],"and":[16,39],"loading":[17],"time":[18],"of":[19],"information":[21],"upon":[22],"power":[23],"up.":[24],"impact":[26],"on":[27,36],"yield":[28],"is":[29],"predicted":[30],"using":[31],"two":[32],"different":[33],"methods":[34],"based":[35],"defect":[37],"density":[38],"clustering":[40],"or":[41],"past":[42],"experience.":[44]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}