{"id":"https://openalex.org/W3124032009","doi":"https://doi.org/10.1109/itc44778.2020.9325235","title":"Cost-Effective Test Method for screening out Unexpected Failure in High Speed Serial Interface IPs","display_name":"Cost-Effective Test Method for screening out Unexpected Failure in High Speed Serial Interface IPs","publication_year":2020,"publication_date":"2020-11-01","ids":{"openalex":"https://openalex.org/W3124032009","doi":"https://doi.org/10.1109/itc44778.2020.9325235","mag":"3124032009"},"language":"en","primary_location":{"id":"doi:10.1109/itc44778.2020.9325235","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc44778.2020.9325235","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5066530065","display_name":"Sang-Uck Ahn","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Sang-Uck Ahn","raw_affiliation_strings":["Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea"],"affiliations":[{"raw_affiliation_string":"Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102386305","display_name":"Beom-Kyu Seo","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Beom-Kyu Seo","raw_affiliation_strings":["IP development Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea"],"affiliations":[{"raw_affiliation_string":"IP development Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100330185","display_name":"Hyunwoo Kim","orcid":"https://orcid.org/0000-0001-7588-3723"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyun-Woo Kim","raw_affiliation_strings":["Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea"],"affiliations":[{"raw_affiliation_string":"Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018283383","display_name":"Yeoun-Sook Shin","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yeoun-Sook Shin","raw_affiliation_strings":["Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea"],"affiliations":[{"raw_affiliation_string":"Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103230828","display_name":"Hyung\u2010Tae Kim","orcid":"https://orcid.org/0000-0001-5711-551X"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyung-Tae Kim","raw_affiliation_strings":["Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea"],"affiliations":[{"raw_affiliation_string":"Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049444932","display_name":"Ghil-Geun Oh","orcid":"https://orcid.org/0000-0002-4063-3369"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ghil-Geun Oh","raw_affiliation_strings":["Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea"],"affiliations":[{"raw_affiliation_string":"Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101681633","display_name":"Youngdae Kim","orcid":"https://orcid.org/0000-0001-9392-6192"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Young-Dae Kim","raw_affiliation_strings":["Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea"],"affiliations":[{"raw_affiliation_string":"Product and Test Engineering Team Samsung Foundry (Samsung Electronics Co. Ltd), Hwasung-si, Korea","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5066530065"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":0.231,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.5246806,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.6376065611839294},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6139523983001709},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5284278988838196},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5250841379165649},{"id":"https://openalex.org/keywords/degradation","display_name":"Degradation (telecommunications)","score":0.44813239574432373},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3693140149116516},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.16780352592468262},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07923346757888794}],"concepts":[{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.6376065611839294},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6139523983001709},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5284278988838196},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5250841379165649},{"id":"https://openalex.org/C2779679103","wikidata":"https://www.wikidata.org/wiki/Q5251805","display_name":"Degradation (telecommunications)","level":2,"score":0.44813239574432373},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3693140149116516},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.16780352592468262},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07923346757888794},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/itc44778.2020.9325235","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc44778.2020.9325235","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1553932161","https://openalex.org/W1597062741","https://openalex.org/W3006907251"],"related_works":["https://openalex.org/W2534928293","https://openalex.org/W2150099345","https://openalex.org/W3004580327","https://openalex.org/W3012501961","https://openalex.org/W1490077415","https://openalex.org/W1979131826","https://openalex.org/W2370066713","https://openalex.org/W1984979050","https://openalex.org/W2978161533","https://openalex.org/W2379338802"],"abstract_inverted_index":{"In":[0],"High-Speed":[1],"Serial":[2],"Interface":[3],"(HSSI)":[4],"IP":[5],"using":[6],"AC":[7,13],"coupled":[8,14],"configuration,":[9,15],"due":[10],"to":[11,34],"the":[12,36,43],"it":[16],"can":[17,66],"cause":[18],"unexpected":[19,68],"issues":[20],"that":[21],"cannot":[22],"screen":[23,67],"fail":[24,37],"chips.":[25],"That":[26],"is,":[27],"external":[28],"loopback":[29],"test":[30,64,81],"is":[31,49],"not":[32],"able":[33],"reject":[35],"chip,":[38],"even":[39],"if":[40],"one":[41],"of":[42],"differential":[44],"positive":[45],"and":[46,79],"negative":[47],"signals":[48],"abnormal":[50],"status,":[51],"such":[52],"as":[53],"pin":[54],"floating":[55],"or":[56],"open.":[57],"This":[58],"paper":[59],"proposes":[60],"a":[61],"cost":[62],"effective":[63],"method":[65],"failure":[69],"without":[70],"measurement":[71],"performance":[72],"degradation":[73],"assisted":[74],"by":[75],"simple":[76],"circuit":[77],"modification":[78],"additional":[80],"sequence.":[82]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}