{"id":"https://openalex.org/W3125270963","doi":"https://doi.org/10.1109/itc44778.2020.9325218","title":"MBIST Supported Multi Step Trim for Reliable eMRAM Sensing","display_name":"MBIST Supported Multi Step Trim for Reliable eMRAM Sensing","publication_year":2020,"publication_date":"2020-11-01","ids":{"openalex":"https://openalex.org/W3125270963","doi":"https://doi.org/10.1109/itc44778.2020.9325218","mag":"3125270963"},"language":"en","primary_location":{"id":"doi:10.1109/itc44778.2020.9325218","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc44778.2020.9325218","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102407572","display_name":"Jongsin Yun","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jongsin Yun","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080636005","display_name":"Benoit Nadeau-Dostie","orcid":null},"institutions":[{"id":"https://openalex.org/I2801914806","display_name":"Siemens (Canada)","ror":"https://ror.org/03cpzkh11","country_code":"CA","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I2801914806"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Benoit Nadeau-Dostie","raw_affiliation_strings":["Mentor, A Siemens Business, Ottawa, Canada"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Ottawa, Canada","institution_ids":["https://openalex.org/I2801914806"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019406427","display_name":"Martin Keim","orcid":"https://orcid.org/0000-0002-0029-135X"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Martin Keim","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013257426","display_name":"Lori Schramm","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lori Schramm","raw_affiliation_strings":["Mentor, A Siemens Business, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Atlanta, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020877380","display_name":"Cyrille Dray","orcid":null},"institutions":[{"id":"https://openalex.org/I4210150884","display_name":"Fondation Sophia Antipolis","ror":"https://ror.org/05nkcfv27","country_code":"FR","type":"other","lineage":["https://openalex.org/I4210150884"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Cyrille Dray","raw_affiliation_strings":["ARM, Sophia Antipolis, France"],"affiliations":[{"raw_affiliation_string":"ARM, Sophia Antipolis, France","institution_ids":["https://openalex.org/I4210150884"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081581719","display_name":"Mehdi Boujamaa","orcid":null},"institutions":[{"id":"https://openalex.org/I4210150884","display_name":"Fondation Sophia Antipolis","ror":"https://ror.org/05nkcfv27","country_code":"FR","type":"other","lineage":["https://openalex.org/I4210150884"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Mehdi Boujamaa","raw_affiliation_strings":["ARM, Sophia Antipolis, France"],"affiliations":[{"raw_affiliation_string":"ARM, Sophia Antipolis, France","institution_ids":["https://openalex.org/I4210150884"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083410430","display_name":"Khushal Gelda","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Khushal Gelda","raw_affiliation_strings":["ARM, Bangalore, India"],"affiliations":[{"raw_affiliation_string":"ARM, Bangalore, India","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5102407572"],"corresponding_institution_ids":["https://openalex.org/I4210137693"],"apc_list":null,"apc_paid":null,"fwci":0.5612,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.67363781,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10049","display_name":"Magnetic properties of thin films","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10049","display_name":"Magnetic properties of thin films","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/trim","display_name":"Trim","score":0.9676711559295654},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7199650406837463},{"id":"https://openalex.org/keywords/trimming","display_name":"Trimming","score":0.6874308586120605},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.5351959466934204},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.46193233132362366},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4488171637058258},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4456768035888672},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.42102542519569397},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4107191264629364},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.3786966800689697},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3261811137199402},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2183493971824646},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1576441526412964},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.11077234148979187},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1001991331577301}],"concepts":[{"id":"https://openalex.org/C88611116","wikidata":"https://www.wikidata.org/wiki/Q957004","display_name":"Trim","level":2,"score":0.9676711559295654},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7199650406837463},{"id":"https://openalex.org/C56951928","wikidata":"https://www.wikidata.org/wiki/Q3539213","display_name":"Trimming","level":2,"score":0.6874308586120605},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.5351959466934204},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.46193233132362366},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4488171637058258},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4456768035888672},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.42102542519569397},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4107191264629364},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.3786966800689697},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3261811137199402},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2183493971824646},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1576441526412964},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.11077234148979187},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1001991331577301},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/itc44778.2020.9325218","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc44778.2020.9325218","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5400000214576721,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1964504828","https://openalex.org/W1976903470","https://openalex.org/W2154157669","https://openalex.org/W2800126119","https://openalex.org/W2909308379","https://openalex.org/W3040591402","https://openalex.org/W3048858245"],"related_works":["https://openalex.org/W4205838487","https://openalex.org/W2467235537","https://openalex.org/W4243755427","https://openalex.org/W4320062971","https://openalex.org/W2048650805","https://openalex.org/W2052775810","https://openalex.org/W644125712","https://openalex.org/W571254925","https://openalex.org/W299881654","https://openalex.org/W1981845593"],"abstract_inverted_index":{"eMRAM":[0],"(embedded":[1],"Magnetoresistive":[2],"Random":[3],"Access":[4],"Memory)":[5],"has":[6,22],"many":[7],"attractive":[8],"properties":[9,159],"such":[10],"as":[11],"small":[12,25,33],"size,":[13],"fast":[14],"operation":[15],"speed,":[16],"and":[17,51,67,87,94,126,160],"good":[18],"endurance.":[19],"However,":[20],"MRAM":[21],"a":[23,32,39,64,96,150,168],"relatively":[24],"TMR":[26],"(Tunneling":[27],"Magnetoresistance)":[28],"ratio,":[29],"which":[30],"means":[31],"on-off":[34],"state":[35],"separation.":[36],"It":[37],"is":[38],"challenge":[40],"to":[41,47,62,92,129,155],"set":[42,162],"an":[43,100,141,174],"optimal":[44],"reference":[45,65,134],"resistance":[46],"reliably":[48],"differentiate":[49],"\u201c1\u201d":[50],"\u201c0\u201d":[52],"states.":[53],"Several":[54],"trimming":[55],"circuits":[56],"were":[57],"suggested":[58],"in":[59],"the":[60,110,171],"literature":[61],"adjust":[63],"value":[66],"its":[68],"search":[69,93],"range.":[70],"The":[71,145],"trim":[72,97,117,165],"setting":[73,98,135],"can":[74],"be":[75],"controlled":[76],"manually":[77],"by":[78],"user":[79],"input;":[80],"however,":[81],"it":[82],"consumes":[83],"huge":[84],"test":[85],"time":[86],"requires":[88],"off-chip":[89],"engineering":[90],"analysis":[91],"apply":[95],"for":[99,173],"individual":[101],"memory":[102],"array.":[103],"In":[104],"this":[105],"paper,":[106],"we":[107],"will":[108],"discuss":[109],"recent":[111],"silicon":[112],"results":[113],"of":[114,140,153],"fully":[115],"automated":[116],"process":[118],"leveraging":[119],"existing":[120,142],"MBIST":[121,143,147],"(Memory":[122],"Built-in":[123],"Self-Test)":[124],"resources":[125],"new":[127],"features":[128],"accommodate":[130],"more":[131],"complicated":[132,163],"multi-step":[133,164],"implementation":[136],"through":[137],"minor":[138],"update":[139],"circuit.":[144],"proposed":[146],"solution":[148],"uses":[149],"minimal":[151],"number":[152],"tests":[154],"analyze":[156],"massive":[157],"array":[158],"automatically":[161],"settings":[166],"within":[167],"chip":[169],"without":[170],"need":[172],"external":[175],"tester":[176],"or":[177],"manual":[178],"adjustments.":[179]},"counts_by_year":[{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
