{"id":"https://openalex.org/W7131290694","doi":"https://doi.org/10.1109/itc-asia67627.2025.00009","title":"Descriptive Language For 3D IC Die-to-Die Interconnect Repair For IEEE P3405 Standard","display_name":"Descriptive Language For 3D IC Die-to-Die Interconnect Repair For IEEE P3405 Standard","publication_year":2025,"publication_date":"2025-12-16","ids":{"openalex":"https://openalex.org/W7131290694","doi":"https://doi.org/10.1109/itc-asia67627.2025.00009"},"language":null,"primary_location":{"id":"doi:10.1109/itc-asia67627.2025.00009","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc-asia67627.2025.00009","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Test Conference in Asia (ITC-Asia)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5001552971","display_name":"Ashish Reddy Bommana","orcid":"https://orcid.org/0000-0001-6321-6544"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ashish Reddy Bommana","raw_affiliation_strings":["Siemens EDA,Fremont,USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA,Fremont,USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041100073","display_name":"Anshuman Chandra","orcid":"https://orcid.org/0000-0002-2686-3918"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anshuman Chandra","raw_affiliation_strings":["Siemens EDA,Fremont,USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA,Fremont,USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074939528","display_name":"M. Zeeshan Khan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Moiz Khan","raw_affiliation_strings":["Siemens EDA,Fremont,USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA,Fremont,USA","institution_ids":["https://openalex.org/I4210137693"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210137693"],"apc_list":null,"apc_paid":null,"fwci":6.9549,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.9758929,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.7067000269889832,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.7067000269889832,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.05620000138878822,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.042100001126527786,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.698199987411499},{"id":"https://openalex.org/keywords/json","display_name":"JSON","score":0.5681999921798706},{"id":"https://openalex.org/keywords/descriptive-statistics","display_name":"Descriptive statistics","score":0.46950000524520874},{"id":"https://openalex.org/keywords/transfer","display_name":"Transfer (computing)","score":0.4106000065803528},{"id":"https://openalex.org/keywords/descriptive-geometry","display_name":"Descriptive geometry","score":0.3849000036716461},{"id":"https://openalex.org/keywords/standard-language","display_name":"Standard language","score":0.3765000104904175}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.698199987411499},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6664000153541565},{"id":"https://openalex.org/C2780416260","wikidata":"https://www.wikidata.org/wiki/Q2063","display_name":"JSON","level":2,"score":0.5681999921798706},{"id":"https://openalex.org/C39896193","wikidata":"https://www.wikidata.org/wiki/Q380344","display_name":"Descriptive statistics","level":2,"score":0.46950000524520874},{"id":"https://openalex.org/C2776175482","wikidata":"https://www.wikidata.org/wiki/Q1195816","display_name":"Transfer (computing)","level":2,"score":0.4106000065803528},{"id":"https://openalex.org/C2780507150","wikidata":"https://www.wikidata.org/wiki/Q638755","display_name":"Descriptive geometry","level":2,"score":0.3849000036716461},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.383899986743927},{"id":"https://openalex.org/C2775957009","wikidata":"https://www.wikidata.org/wiki/Q399495","display_name":"Standard language","level":2,"score":0.3765000104904175},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.36880001425743103},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.3628000020980835},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3522999882698059},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3499000072479248},{"id":"https://openalex.org/C50831359","wikidata":"https://www.wikidata.org/wiki/Q165436","display_name":"Assembly language","level":3,"score":0.3375999927520752},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.3230000138282776},{"id":"https://openalex.org/C177454536","wikidata":"https://www.wikidata.org/wiki/Q578290","display_name":"Emphasis (telecommunications)","level":2,"score":0.28519999980926514},{"id":"https://openalex.org/C142546437","wikidata":"https://www.wikidata.org/wiki/Q2661195","display_name":"Descriptive research","level":2,"score":0.28459998965263367},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.2825999855995178},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.26969999074935913},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.266400009393692}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/itc-asia67627.2025.00009","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc-asia67627.2025.00009","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Test Conference in Asia (ITC-Asia)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W4301217393","https://openalex.org/W4399120098","https://openalex.org/W4400034228"],"related_works":[],"abstract_inverted_index":{"For":[0],"any":[1],"unambiguous":[2],"transfer":[3,34],"of":[4,14,59,88],"information":[5],"it":[6],"is":[7,53],"critical":[8],"to":[9,31,67,75],"provide":[10,27],"a":[11,22,28,41,93],"comprehensive":[12],"description":[13],"components,":[15],"operations,":[16],"procedures,":[17],"methodology":[18],"etc.":[19],"defined":[20],"by":[21],"technical":[23],"standard.":[24,62],"Many":[25],"standards":[26,78],"descriptive":[29,42,113],"language":[30,43,114],"capture":[32],"and":[33,50,72,82,105],"information.":[35],"In":[36],"this":[37],"paper":[38],"we":[39],"present":[40],"model":[44],"for":[45],"Die-to-Die":[46],"(D2D)":[47],"interconnect":[48,77],"test":[49],"repair,":[51],"which":[52,100],"under":[54],"development":[55],"in":[56,92,115],"the":[57,86,97,102,111],"framework":[58],"IEEE":[60],"P3405":[61],"We":[63,84],"show":[64],"its":[65,73],"capability":[66],"describe":[68],"interconnect,":[69],"repair":[70,94,103,108],"scheme,":[71],"application":[74],"existing":[76],"like":[79],"UCIe,":[80],"AIB":[81],"HBM.":[83],"report":[85],"impact":[87],"various":[89],"design":[90],"parameters":[91],"IP":[95],"on":[96],"algorithm\u2019s":[98],"runtime,":[99],"extracts":[101],"algorithm":[104],"generates":[106],"valid":[107],"solutions":[109],"from":[110],"given":[112],"JSON":[116],"format.":[117]},"counts_by_year":[{"year":2026,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2026-02-25T00:00:00"}