{"id":"https://openalex.org/W4388117468","doi":"https://doi.org/10.1109/itc-asia58802.2023.10301169","title":"Generating Test Patterns for Chiplet Interconnects: Achieving Optimal Effectiveness and Efficiency","display_name":"Generating Test Patterns for Chiplet Interconnects: Achieving Optimal Effectiveness and Efficiency","publication_year":2023,"publication_date":"2023-09-12","ids":{"openalex":"https://openalex.org/W4388117468","doi":"https://doi.org/10.1109/itc-asia58802.2023.10301169"},"language":"en","primary_location":{"id":"doi:10.1109/itc-asia58802.2023.10301169","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc-asia58802.2023.10301169","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Test Conference in Asia (ITC-Asia)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016515404","display_name":"Po-Yao Chuang","orcid":"https://orcid.org/0000-0001-7325-8836"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]},{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE","TW"],"is_corresponding":false,"raw_author_name":"Po-Yao Chuang","raw_affiliation_strings":["IMEC,3001 Leuven,Belgium","National Tsing-Hua University, 30013 Hsinchu, Taiwan","IMEC, 3001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC,3001 Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"National Tsing-Hua University, 30013 Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"IMEC, 3001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070342895","display_name":"Francesco Lorenzelli","orcid":"https://orcid.org/0000-0001-6465-7157"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Francesco Lorenzelli","raw_affiliation_strings":["IMEC,3001 Leuven,Belgium","IMEC, 3001 Leuven, Belgium","KU Leuven, 3001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC,3001 Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, 3001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"KU Leuven, 3001 Leuven, Belgium","institution_ids":["https://openalex.org/I99464096"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5044629739","display_name":"Erik Jan Marinissen","orcid":"https://orcid.org/0000-0002-5058-8303"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I83019370","display_name":"Eindhoven University of Technology","ror":"https://ror.org/02c2kyt77","country_code":"NL","type":"education","lineage":["https://openalex.org/I83019370"]}],"countries":["BE","NL"],"is_corresponding":false,"raw_author_name":"Erik Jan Marinissen","raw_affiliation_strings":["IMEC,3001 Leuven,Belgium","TU Eindhoven, 5612 AZ Eindhoven, the Netherlands","IMEC, 3001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC,3001 Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"TU Eindhoven, 5612 AZ Eindhoven, the Netherlands","institution_ids":["https://openalex.org/I83019370"]},{"raw_affiliation_string":"IMEC, 3001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.8716,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.85236093,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.6768994331359863},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6473032236099243},{"id":"https://openalex.org/keywords/decoupling","display_name":"Decoupling (probability)","score":0.5835204124450684},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.560542106628418},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5515010952949524},{"id":"https://openalex.org/keywords/hexagonal-crystal-system","display_name":"Hexagonal crystal system","score":0.471217542886734},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.35378938913345337},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3313341736793518},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.27527448534965515},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.22248923778533936},{"id":"https://openalex.org/keywords/combinatorics","display_name":"Combinatorics","score":0.19176346063613892},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1783296763896942},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.12107470631599426},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08134746551513672}],"concepts":[{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.6768994331359863},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6473032236099243},{"id":"https://openalex.org/C205606062","wikidata":"https://www.wikidata.org/wiki/Q5249645","display_name":"Decoupling (probability)","level":2,"score":0.5835204124450684},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.560542106628418},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5515010952949524},{"id":"https://openalex.org/C128765274","wikidata":"https://www.wikidata.org/wiki/Q663314","display_name":"Hexagonal crystal system","level":2,"score":0.471217542886734},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.35378938913345337},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3313341736793518},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.27527448534965515},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.22248923778533936},{"id":"https://openalex.org/C114614502","wikidata":"https://www.wikidata.org/wiki/Q76592","display_name":"Combinatorics","level":1,"score":0.19176346063613892},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1783296763896942},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.12107470631599426},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08134746551513672},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.0},{"id":"https://openalex.org/C8010536","wikidata":"https://www.wikidata.org/wiki/Q160398","display_name":"Crystallography","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/itc-asia58802.2023.10301169","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc-asia58802.2023.10301169","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Test Conference in Asia (ITC-Asia)","raw_type":"proceedings-article"},{"id":"pmh:oai:pure.tue.nl:publications/23a8774e-e745-4b53-bbff-399da0d9ffc7","is_oa":false,"landing_page_url":"https://research.tue.nl/en/publications/23a8774e-e745-4b53-bbff-399da0d9ffc7","pdf_url":null,"source":{"id":"https://openalex.org/S4406922641","display_name":"TU/e Research Portal","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Chuang, P-Y, Lorenzelli, F & Marinissen, E J 2023, Generating Test Patterns for Chiplet Interconnects : Achieving Optimal Effectiveness and Efficiency. in 2023 IEEE International Test Conference in Asia, ITC-Asia 2023., 10301169, Institute of Electrical and Electronics Engineers, 7th IEEE International Test Conference in Asia, ITC-Asia 2023, Matsue, Japan, 13/09/23. https://doi.org/10.1109/ITC-Asia58802.2023.10301169","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:lirias2repo.kuleuven.be:20.500.12942/748002","is_oa":false,"landing_page_url":"https://lirias.kuleuven.be/handle/20.500.12942/748002","pdf_url":null,"source":{"id":"https://openalex.org/S7407055369","display_name":"Lirias","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"7th IEEE International Test Conference in Asia (ITC-Asia), JAPAN, Matsue, 12-15 September 2023","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/16","score":0.5299999713897705,"display_name":"Peace, Justice and strong institutions"},{"id":"https://metadata.un.org/sdg/10","score":0.46000000834465027,"display_name":"Reduced inequalities"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W128123307","https://openalex.org/W1979477906","https://openalex.org/W1991398325","https://openalex.org/W2011039300","https://openalex.org/W2096691973","https://openalex.org/W2106746132","https://openalex.org/W2114853176","https://openalex.org/W2399801569","https://openalex.org/W2505380261","https://openalex.org/W3047683882","https://openalex.org/W4238078154","https://openalex.org/W4282983237","https://openalex.org/W4285103103","https://openalex.org/W6605234255"],"related_works":["https://openalex.org/W2152950565","https://openalex.org/W4254560580","https://openalex.org/W2131559056","https://openalex.org/W2127167802","https://openalex.org/W1617565119","https://openalex.org/W2080984854","https://openalex.org/W160381218","https://openalex.org/W2323083271","https://openalex.org/W2512958550","https://openalex.org/W2019500818"],"abstract_inverted_index":{"Chiplet-based":[0],"multi-die":[1],"packages":[2],"(a.k.a.":[3],"2.5D-":[4],"and":[5,55,105,125,130,174],"3D-ICs)":[6],"implement":[7],"large":[8,25,171],"amounts":[9],"of":[10,84,128,146],"inter-die":[11],"interconnects":[12,31],"with":[13,58],"micro-bumps.":[14],"To":[15],"achieve":[16],"uniform":[17],"heights,":[18],"these":[19],"micro-bumps":[20],"are":[21,32,91],"typically":[22],"placed":[23],"in":[24],"rectangular":[26],"or":[27],"hexagonal":[28],"arrays.":[29],"These":[30],"subject":[33],"to":[34,177],"manufacturing":[35],"defects.":[36,132],"Traditional":[37],"interconnect":[38,107],"automatic":[39],"test":[40,59,108,119,136,159],"pattern":[41,60],"generation":[42],"(I-ATPG)":[43],"methods,":[44],"such":[45],"as":[46],"the":[47,73,118,135,165],"True/Complement":[48],"Algorithm":[49],"[1],":[50],"focus":[51],"on":[52,167],"hard":[53,124],"open":[54,129],"short":[56,79,131],"defects":[57,80],"count":[61],"2":[62],"\u00d7":[63,151],"\u2308log":[64,152],"<inf":[65,153],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[66,111,154],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</inf>":[67,155],"(k)\u2309":[68],"for":[69,88],"k":[70],"interconnects.":[71,144],"However,":[72],"traditional":[74],"I-ATPG":[75],"methods":[76],"indiscriminately":[77],"cover":[78],"between":[81,142],"all":[82],"pairs":[83],"interconnects,":[85],"including":[86],"those":[87],"which":[89,169],"shorts":[90,141],"unrealistic":[92],"given":[93],"their":[94],"relative":[95],"layout":[96],"positions.":[97],"In":[98],"this":[99],"paper":[100],"we":[101],"propose":[102],"an":[103],"effective":[104],"efficient":[106],"(E":[109],"<sup":[110],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[112],"ITEST).":[113],"The":[114],"proposed":[115],"method":[116],"improves":[117,134],"effectiveness":[120],"by":[121,138],"covering":[122],"both":[123],"weak":[126],"variants":[127],"It":[133],"efficiency":[137],"considering":[139],"only":[140,175],"adjacent":[143],"Because":[145],"this,":[147],"it":[148,163],"requires":[149],"8":[150],"(4)\u2309":[156],"=":[157],"16":[158],"patterns,":[160],"thereby":[161],"decoupling":[162],"from":[164],"dependency":[166],"k,":[168],"is":[170],"already":[172],"today":[173],"expected":[176],"grow.":[178]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":5}],"updated_date":"2026-07-02T09:51:11.867554","created_date":"2025-10-10T00:00:00"}