{"id":"https://openalex.org/W2029364622","doi":"https://doi.org/10.1109/issrew.2013.6688903","title":"Use software reliability growth models wisely","display_name":"Use software reliability growth models wisely","publication_year":2013,"publication_date":"2013-11-01","ids":{"openalex":"https://openalex.org/W2029364622","doi":"https://doi.org/10.1109/issrew.2013.6688903","mag":"2029364622"},"language":"en","primary_location":{"id":"doi:10.1109/issrew.2013.6688903","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issrew.2013.6688903","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Symposium on Software Reliability Engineering Workshops (ISSREW)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5015210646","display_name":"Yuan Wei","orcid":"https://orcid.org/0000-0002-8709-8252"},"institutions":[{"id":"https://openalex.org/I4210115667","display_name":"Dermira (United States)","ror":"https://ror.org/02ac14420","country_code":"US","type":"company","lineage":["https://openalex.org/I4210115667"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yuan Wei","raw_affiliation_strings":["Hospira, Inc","Hospira Inc"],"affiliations":[{"raw_affiliation_string":"Hospira, Inc","institution_ids":["https://openalex.org/I4210115667"]},{"raw_affiliation_string":"Hospira Inc","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5015210646"],"corresponding_institution_ids":["https://openalex.org/I4210115667"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.15187835,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"243","last_page":"262"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12423","display_name":"Software Reliability and Analysis Research","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/1712","display_name":"Software"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12423","display_name":"Software Reliability and Analysis Research","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/1712","display_name":"Software"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.710620641708374},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5166252255439758},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4706166088581085},{"id":"https://openalex.org/keywords/software-quality","display_name":"Software quality","score":0.44585418701171875},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.42077159881591797},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3945009410381317},{"id":"https://openalex.org/keywords/software-development","display_name":"Software development","score":0.20999619364738464},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.10903218388557434},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.0818164050579071}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.710620641708374},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5166252255439758},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4706166088581085},{"id":"https://openalex.org/C117447612","wikidata":"https://www.wikidata.org/wiki/Q1412670","display_name":"Software quality","level":4,"score":0.44585418701171875},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.42077159881591797},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3945009410381317},{"id":"https://openalex.org/C529173508","wikidata":"https://www.wikidata.org/wiki/Q638608","display_name":"Software development","level":3,"score":0.20999619364738464},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.10903218388557434},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0818164050579071},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/issrew.2013.6688903","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issrew.2013.6688903","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Symposium on Software Reliability Engineering Workshops (ISSREW)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4300000071525574,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2033512842","https://openalex.org/W4322734194","https://openalex.org/W4233600955","https://openalex.org/W2913665393","https://openalex.org/W2369695847","https://openalex.org/W3005535424","https://openalex.org/W2994319598","https://openalex.org/W2047067935","https://openalex.org/W1607054433","https://openalex.org/W2110842462"],"abstract_inverted_index":{"Presents":[0],"a":[1],"collection":[2],"of":[3,32],"slides":[4],"covering":[5],"the":[6],"following":[7],"topics:":[8],"what":[9,13],"are":[10],"SRGMs":[11],"and":[12,25,30],"can":[14],"they":[15],"do;":[16],"general":[17],"SRGM":[18],"process;":[19],"current":[20],"situations":[21],"for":[22],"SRGMs;":[23,29],"assumptions":[24],"easy-made":[26],"mistakes":[27],"in":[28],"applications":[31],"SRGM.":[33]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}