{"id":"https://openalex.org/W2541752504","doi":"https://doi.org/10.1109/issoc.2004.1411180","title":"A thermal-aware power management soft-IP for platform-based SoC designs","display_name":"A thermal-aware power management soft-IP for platform-based SoC designs","publication_year":2005,"publication_date":"2005-03-31","ids":{"openalex":"https://openalex.org/W2541752504","doi":"https://doi.org/10.1109/issoc.2004.1411180","mag":"2541752504"},"language":"en","primary_location":{"id":"doi:10.1109/issoc.2004.1411180","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issoc.2004.1411180","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5004461904","display_name":"Chinhung Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chinhung Chan","raw_affiliation_strings":["Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yucheng Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yucheng Chang","raw_affiliation_strings":["Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102247882","display_name":"Hsichi Ho","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hsichi Ho","raw_affiliation_strings":["Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5007306801","display_name":"Herming Chiueh","orcid":"https://orcid.org/0000-0002-4828-3316"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Herming Chiueh","raw_affiliation_strings":["Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Communication Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I148366613"],"apc_list":null,"apc_paid":null,"fwci":0.3635,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.70471734,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"181","last_page":"184"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.6815140247344971},{"id":"https://openalex.org/keywords/power-management","display_name":"Power management","score":0.6477864980697632},{"id":"https://openalex.org/keywords/power-management-system","display_name":"Power management system","score":0.6389563083648682},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.5848353505134583},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.5525760054588318},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.49750855565071106},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4659997224807739},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.39046335220336914},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3751286566257477},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24062469601631165}],"concepts":[{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.6815140247344971},{"id":"https://openalex.org/C2778774385","wikidata":"https://www.wikidata.org/wiki/Q4437810","display_name":"Power management","level":3,"score":0.6477864980697632},{"id":"https://openalex.org/C2778363213","wikidata":"https://www.wikidata.org/wiki/Q16938469","display_name":"Power management system","level":4,"score":0.6389563083648682},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.5848353505134583},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.5525760054588318},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.49750855565071106},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4659997224807739},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.39046335220336914},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3751286566257477},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24062469601631165},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/issoc.2004.1411180","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issoc.2004.1411180","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.46000000834465027,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321040","display_name":"National Science Council","ror":"https://ror.org/02kv4zf79"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1507848827","https://openalex.org/W1917644319","https://openalex.org/W2098143668","https://openalex.org/W2166219277","https://openalex.org/W2245359366","https://openalex.org/W4240280328","https://openalex.org/W4242812063","https://openalex.org/W6684385235"],"related_works":["https://openalex.org/W1976802810","https://openalex.org/W2171620613","https://openalex.org/W2098127345","https://openalex.org/W4245131997","https://openalex.org/W2626460730","https://openalex.org/W2013008415","https://openalex.org/W2064801950","https://openalex.org/W2100371213","https://openalex.org/W2068651210","https://openalex.org/W2532007349"],"abstract_inverted_index":{"A":[0],"novel":[1],"thermal-aware":[2,24],"power":[3,25,30,71],"management":[4,31,88,106],"(TAPM)":[5],"software":[6],"intellectual":[7],"property":[8],"(soft-IP)":[9],"for":[10,39],"modem":[11],"platform-based":[12],"SoC":[13],"designs":[14],"is":[15,49],"presented.":[16],"This":[17],"research":[18],"proposes":[19],"the":[20,40,46,55,75,101,137],"system-level":[21],"architecture":[22],"of":[23,45],"management,":[26],"which":[27,123],"includes":[28],"a":[29,52,120,127],"bus":[32],"(PMB),":[33],"TAPM":[34],"soft-IP":[35],"and":[36,66,73,86,93,111,117],"interface":[37],"circuitry":[38],"proposed":[41,47,109],"PMB.":[42],"Each":[43],"component":[44],"design":[48,82],"encapsulated":[50],"into":[51],"soft-IP.":[53],"With":[54],"above":[56],"design,":[57],"system":[58,77,91,110],"architects":[59],"are":[60,114],"able":[61],"to":[62,68,103],"incorporate":[63],"on-chip":[64],"power-controls":[65],"sensors":[67],"achieve":[69],"nominal":[70],"dissipation":[72],"ensure":[74],"targeted":[76],"works":[78],"within":[79],"specification.":[80],"The":[81,108],"yields":[83],"intricate":[84],"control":[85],"optimal":[87],"with":[89],"little":[90],"overhead":[92],"minimum":[94],"hardware":[95],"requirements,":[96],"as":[97,99],"well":[98],"providing":[100],"flexibility":[102],"support":[104],"different":[105],"schemes.":[107],"its":[112],"components":[113],"designed,":[115],"implemented":[116],"verified":[118],"by":[119],"prototype":[121],"chip,":[122],"was":[124],"fabricated":[125],"in":[126],"TSMC":[128],"0.25":[129],"/spl":[130],"mu/m":[131],"1P5M":[132],"standard":[133],"CMOS":[134],"technology":[135],"through":[136],"National":[138],"Chip":[139],"Implementation":[140],"Center":[141],"(CIC),":[142],"Taiwan.":[143]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2012,"cited_by_count":3}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}