{"id":"https://openalex.org/W2546359773","doi":"https://doi.org/10.1109/issoc.2004.1411157","title":"SoC-mobinet: broadband transceiver design challenges","display_name":"SoC-mobinet: broadband transceiver design challenges","publication_year":2005,"publication_date":"2005-03-31","ids":{"openalex":"https://openalex.org/W2546359773","doi":"https://doi.org/10.1109/issoc.2004.1411157","mag":"2546359773"},"language":"en","primary_location":{"id":"doi:10.1109/issoc.2004.1411157","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issoc.2004.1411157","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074925682","display_name":"Franz Dielacher","orcid":"https://orcid.org/0000-0003-2720-2086"},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"F. Dielacher","raw_affiliation_strings":["Infineon Technologies, Germany"],"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Germany","institution_ids":["https://openalex.org/I137594350"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5074925682"],"corresponding_institution_ids":["https://openalex.org/I137594350"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.359375,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"93","last_page":"93"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9923999905586243,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9923999905586243,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9921000003814697,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9865000247955322,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reuse","display_name":"Reuse","score":0.6676899790763855},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6640245914459229},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.6550533175468445},{"id":"https://openalex.org/keywords/broadband","display_name":"Broadband","score":0.6054079532623291},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.6016395092010498},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.5800114870071411},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5779359936714172},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.5466582775115967},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.4582293629646301},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.41215047240257263},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.38950708508491516},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3836376965045929},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23867321014404297},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.188132643699646},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1311134397983551},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.08066129684448242}],"concepts":[{"id":"https://openalex.org/C206588197","wikidata":"https://www.wikidata.org/wiki/Q846574","display_name":"Reuse","level":2,"score":0.6676899790763855},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6640245914459229},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.6550533175468445},{"id":"https://openalex.org/C509933004","wikidata":"https://www.wikidata.org/wiki/Q194163","display_name":"Broadband","level":2,"score":0.6054079532623291},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.6016395092010498},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.5800114870071411},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5779359936714172},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.5466582775115967},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.4582293629646301},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.41215047240257263},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.38950708508491516},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3836376965045929},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23867321014404297},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.188132643699646},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1311134397983551},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.08066129684448242},{"id":"https://openalex.org/C548081761","wikidata":"https://www.wikidata.org/wiki/Q180388","display_name":"Waste management","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/issoc.2004.1411157","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issoc.2004.1411157","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.6000000238418579,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4254365700","https://openalex.org/W2081165985","https://openalex.org/W1966285216","https://openalex.org/W2742808714","https://openalex.org/W196928559","https://openalex.org/W2147178958","https://openalex.org/W2038859986","https://openalex.org/W2104315811","https://openalex.org/W2526261315","https://openalex.org/W2142217172"],"abstract_inverted_index":{"Summary":[0],"form":[1],"only":[2],"given.":[3],"Decreasing":[4],"feature":[5],"size":[6],"and":[7,37,56,85,88],"increasing":[8],"system":[9,21,30],"complexity":[10],"enables":[11],"to":[12],"map":[13],"complex":[14],"systems":[15],"onto":[16],"one":[17,26],"die":[18],"(SoC":[19],"-":[20,29],"on":[22],"chip)":[23],"or":[24],"into":[25],"package":[27],"(SiP":[28],"in":[31],"package).":[32],"This":[33,69],"reduces":[34],"development,":[35],"production":[36],"packaging":[38],"costs":[39],"of":[40,47,60,66,94],"the":[41,48,58,64,73,92,95],"integrated":[42],"circuit,":[43],"increases":[44],"integration":[45],"density":[46],"customer":[49],"products":[50],"by":[51,62,77],"consuming":[52],"less":[53],"board":[54],"space":[55],"optimizes":[57],"bill":[59],"material":[61],"reducing":[63],"number":[65],"external":[67],"components.":[68],"paper":[70],"looks":[71],"at":[72],"design":[74],"challenges":[75],"posed":[76],"broadband":[78],"transceiver":[79],"design,":[80,90],"including":[81],"hardware/software":[82],"reuse,":[83],"validation":[84],"verification":[86],"effort,":[87],"platform":[89],"using":[91],"context":[93],"SoC-Mobinet":[96],"research":[97],"project.":[98]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}