{"id":"https://openalex.org/W7133297891","doi":"https://doi.org/10.1109/isscc49663.2026.11409096","title":"15.4 A 16nm 168Mb Embedded STT-MRAM with 0.0249\u00b5m <sup>2</sup> Bit-Cell, Dual-Port Access, and 51.2Gb/s Read Throughput for Automotive and Edge AI Applications","display_name":"15.4 A 16nm 168Mb Embedded STT-MRAM with 0.0249\u00b5m <sup>2</sup> Bit-Cell, Dual-Port Access, and 51.2Gb/s Read Throughput for Automotive and Edge AI Applications","publication_year":2026,"publication_date":"2026-02-15","ids":{"openalex":"https://openalex.org/W7133297891","doi":"https://doi.org/10.1109/isscc49663.2026.11409096"},"language":null,"primary_location":{"id":"doi:10.1109/isscc49663.2026.11409096","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49663.2026.11409096","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084441459","display_name":"Po-Hao Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Po-Hao Lee","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5121462655","display_name":"Chia-Fu Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Fu Lee","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5127970477","display_name":"Hon-Jarn Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hon-Jarn Lin","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112705465","display_name":"C.W. Lu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Han Lu","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112395710","display_name":"Yen-An Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yen-An Chang","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047933555","display_name":"Pranata Sanjaya","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pranata W. Sanjaya","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090965442","display_name":"Chia-Jung Tsen","orcid":"https://orcid.org/0000-0002-9325-520X"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Jung Tsen","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010657993","display_name":"K. S. Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuan-Chun Chen","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100324183","display_name":"Ming Lin","orcid":"https://orcid.org/0000-0002-4622-2886"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ming-Chieh Lin","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100840589","display_name":"C. M. Hung","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chao-Jung Hung","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088982893","display_name":"Tan\u2010Li Chou","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tan-Li Chou","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054681803","display_name":"Chih-Hui Weng","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chih-Hui Weng","raw_affiliation_strings":["TSMC,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072278604","display_name":"Chia-Yu Wang","orcid":"https://orcid.org/0000-0002-9907-3132"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Yu Wang","raw_affiliation_strings":["TSMC,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5127942446","display_name":"J.J. Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"J.J. Wu","raw_affiliation_strings":["TSMC,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108409687","display_name":"Harry Chuang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Harry Chuang","raw_affiliation_strings":["TSMC,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5121503458","display_name":"Yih Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yih Wang","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109491324","display_name":"Yu-Der Chih","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Der Chih","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5114087240","display_name":"Tsung-Yung Jonathan Chang","orcid":"https://orcid.org/0009-0007-6505-5474"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tsung-Yung Jonathan Chang","raw_affiliation_strings":["TSMC Design Technology,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC Design Technology,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":18,"corresponding_author_ids":["https://openalex.org/A5084441459"],"corresponding_institution_ids":["https://openalex.org/I4210120917"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.39500081,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"260","last_page":"262"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.17339999973773956,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.17339999973773956,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12611","display_name":"Neural Networks and Reservoir Computing","score":0.0997999981045723,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.07609999924898148,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.6324999928474426},{"id":"https://openalex.org/keywords/interleaving","display_name":"Interleaving","score":0.6306999921798706},{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.5561000108718872},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.5067999958992004},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.47209998965263367},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4537999927997589}],"concepts":[{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.6324999928474426},{"id":"https://openalex.org/C28034677","wikidata":"https://www.wikidata.org/wiki/Q17092530","display_name":"Interleaving","level":2,"score":0.6306999921798706},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5806999802589417},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5640000104904175},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.5561000108718872},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.5067999958992004},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.47209998965263367},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4537999927997589},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.4300999939441681},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.42899999022483826},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.38589999079704285},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3723999857902527},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.2994999885559082},{"id":"https://openalex.org/C138236772","wikidata":"https://www.wikidata.org/wiki/Q25098575","display_name":"Edge device","level":3,"score":0.2888000011444092},{"id":"https://openalex.org/C98025372","wikidata":"https://www.wikidata.org/wiki/Q477538","display_name":"Systems architecture","level":3,"score":0.2734000086784363},{"id":"https://openalex.org/C115537543","wikidata":"https://www.wikidata.org/wiki/Q165596","display_name":"Cache","level":2,"score":0.2542000114917755},{"id":"https://openalex.org/C2994168587","wikidata":"https://www.wikidata.org/wiki/Q5295","display_name":"Random access memory","level":2,"score":0.25360000133514404}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc49663.2026.11409096","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49663.2026.11409096","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5905731320381165,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W4225769575","https://openalex.org/W4360605906","https://openalex.org/W4392745539","https://openalex.org/W4410395139"],"related_works":[],"abstract_inverted_index":{"A":[0],"16nm":[1,49],"168Mb":[2],"embedded":[3],"STT-MRAM":[4],"with":[5],"a":[6,27,33,43,48,55],"0.0249\u03bcm<sup":[7],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[8],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[9],"bit":[10],"cell":[11],"that":[12],"overcomes":[13],"density":[14],"and":[15,37,64,69],"performance":[16],"challenges":[17],"of":[18],"competing":[19],"NVM":[20],"technologies":[21],"is":[22,65],"presented.":[23],"The":[24],"design":[25],"features":[26],"modular":[28],"architecture":[29,41],"supporting":[30],"customizable":[31],"macros,":[32],"dual-port":[34],"access":[35],"scheme,":[36],"an":[38],"interleaving":[39],"read":[40],"achieving":[42],"51.2Gb/s":[44],"throughput.":[45],"Fabricated":[46],"in":[47],"FinFET":[50],"process,":[51],"the":[52],"chip":[53],"demonstrates":[54],"20-year":[56],"data":[57],"retention":[58],"at":[59],"150\u00b0C,":[60],"1M-cycle":[61],"write":[62],"endurance,":[63],"suitable":[66],"for":[67],"automotive":[68],"edge":[70],"AI":[71],"applications.":[72]},"counts_by_year":[],"updated_date":"2026-05-05T08:41:31.759640","created_date":"2026-03-04T00:00:00"}