{"id":"https://openalex.org/W7133346633","doi":"https://doi.org/10.1109/isscc49663.2026.11409073","title":"A 3nm, 400TOPS, 1080k DMIPS SoC with Chiplet Support for ASIL D Automotive Cross-Domain Applications","display_name":"A 3nm, 400TOPS, 1080k DMIPS SoC with Chiplet Support for ASIL D Automotive Cross-Domain Applications","publication_year":2026,"publication_date":"2026-02-15","ids":{"openalex":"https://openalex.org/W7133346633","doi":"https://doi.org/10.1109/isscc49663.2026.11409073"},"language":null,"primary_location":{"id":"doi:10.1109/isscc49663.2026.11409073","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49663.2026.11409073","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5091566404","display_name":"Shiro Machida","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Shiro Machida","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108238395","display_name":"Kazuki Fukuoka","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kazuki Fukuoka","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048885582","display_name":"Tomoya Onda","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tomoya Onda","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5127974106","display_name":"Nobuhiro Yada","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Nobuhiro Yada","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020321683","display_name":"Hiroyuki Nakano","orcid":"https://orcid.org/0000-0003-0316-4820"},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroyuki Nakano","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5127978799","display_name":"Sho Yamanaka","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Sho Yamanaka","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5128026262","display_name":"Hung Van Cao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095603","display_name":"Vietnam Posts and Telecommunications Group (Vietnam)","ror":"https://ror.org/00q0e7f94","country_code":"VN","type":"company","lineage":["https://openalex.org/I4210095603"]}],"countries":["VN"],"is_corresponding":false,"raw_author_name":"Hung Van Cao","raw_affiliation_strings":["Renesas Design Vietnam,Ho Chi Minh,Vietnam"],"affiliations":[{"raw_affiliation_string":"Renesas Design Vietnam,Ho Chi Minh,Vietnam","institution_ids":["https://openalex.org/I4210095603"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022968824","display_name":"Yusaku Hara","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yusaku Hara","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112263774","display_name":"Takahiro Irita","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takahiro Irita","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036611320","display_name":"Kohei Wakahara","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kohei Wakahara","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5128022972","display_name":"Cyril Cordoba","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Cyril Cordoba","raw_affiliation_strings":["Renesas Electronics Europe,Paris,France"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics Europe,Paris,France","institution_ids":["https://openalex.org/I75636454","https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5128004834","display_name":"Tatsuya Kamei","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tatsuya Kamei","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5127959823","display_name":"Yasuhisa Shimazaki","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yasuhisa Shimazaki","raw_affiliation_strings":["Renesas Electronics,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"Renesas Electronics,Tokyo,Japan","institution_ids":["https://openalex.org/I4210153176"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":13,"corresponding_author_ids":["https://openalex.org/A5091566404"],"corresponding_institution_ids":["https://openalex.org/I4210153176"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.90784236,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"168","last_page":"170"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.28130000829696655,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.28130000829696655,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.16930000483989716,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.08990000188350677,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.536300003528595},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.49000000953674316},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4702000021934509},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.43540000915527344},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.4343999922275543},{"id":"https://openalex.org/keywords/automotive-electronics","display_name":"Automotive electronics","score":0.3352999985218048}],"concepts":[{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.6169000267982483},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.536300003528595},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.49000000953674316},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.47620001435279846},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4702000021934509},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.43540000915527344},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.4343999922275543},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4000999927520752},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37929999828338623},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3596000075340271},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.34540000557899475},{"id":"https://openalex.org/C2778520156","wikidata":"https://www.wikidata.org/wiki/Q449343","display_name":"Automotive electronics","level":3,"score":0.3352999985218048},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.29809999465942383},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.29589998722076416},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.28850001096725464},{"id":"https://openalex.org/C516807790","wikidata":"https://www.wikidata.org/wiki/Q193075","display_name":"Hybrid vehicle","level":3,"score":0.2703999876976013},{"id":"https://openalex.org/C45882903","wikidata":"https://www.wikidata.org/wiki/Q5042317","display_name":"Fuel efficiency","level":2,"score":0.26989999413490295},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.2599000036716461}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc49663.2026.11409073","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49663.2026.11409073","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4506259858608246,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2067570668","https://openalex.org/W3015461743","https://openalex.org/W4297097469"],"related_works":[],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,21],"3":[4],"nm":[5],"SoC,":[6],"designed":[7],"for":[8,15],"software":[9],"defined":[10],"vehicles,":[11],"integrating":[12],"various":[13],"functions":[14],"zone-based":[16],"computing.":[17],"The":[18,72],"chip":[19,73],"includes":[20],"<tex":[22,30,54],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[23,31,55],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$1,080":[24],"\\text{kDMIPS}$</tex>":[25],"APU,":[26],"400TOPS":[27],"NPU":[28],"and":[29,63,80],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$51.2":[32],"\\text{GB}":[33],"/":[34],"\\mathrm{s}$</tex>":[35],"inter-chip":[36],"bandwidth.":[37],"Functional":[38],"safety":[39],"is":[40,49],"ensured":[41],"by":[42],"RegionID-based":[43],"FFI":[44],"over":[45],"UCle.":[46],"Power":[47],"efficiency":[48],"achieved":[50],"with":[51,59],"fine-gating":[52],"across":[53],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$90+$</tex>":[56],"power":[57],"domains":[58],"enhanced":[60],"IR-drop":[61],"control":[62],"ASIL":[64],"D-compliant":[65],"DCLS.":[66],"Hierarchical":[67],"mCPGs":[68],"reduce":[69],"clock":[70],"latency.":[71],"supports":[74],"low-power":[75],"modes":[76],"such":[77],"as":[78],"Sentry":[79],"CPD.":[81]},"counts_by_year":[],"updated_date":"2026-03-05T07:30:30.508283","created_date":"2026-03-04T00:00:00"}