{"id":"https://openalex.org/W4408181586","doi":"https://doi.org/10.1109/isscc49661.2025.10904819","title":"37.4 SHINSAI: A 586mm<sup>2</sup> Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory","display_name":"37.4 SHINSAI: A 586mm<sup>2</sup> Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory","publication_year":2025,"publication_date":"2025-02-16","ids":{"openalex":"https://openalex.org/W4408181586","doi":"https://doi.org/10.1109/isscc49661.2025.10904819"},"language":"en","primary_location":{"id":"doi:10.1109/isscc49661.2025.10904819","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904819","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079670597","display_name":"Bo Jiao","orcid":"https://orcid.org/0000-0002-8173-8060"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Jiao","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037971089","display_name":"Haozhe Zhu","orcid":"https://orcid.org/0000-0002-6412-3996"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haozhe Zhu","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103058722","display_name":"Yu Zeng","orcid":"https://orcid.org/0000-0003-4432-6443"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuman Zeng","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103280126","display_name":"Yong\u2010Jiang Li","orcid":"https://orcid.org/0000-0002-4678-9209"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yongjiang Li","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018860020","display_name":"Jie Liao","orcid":"https://orcid.org/0000-0002-6697-8998"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Liao","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Siyao Jia","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Siyao Jia","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116535142","display_name":"Mochen Tian","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mochen Tian","raw_affiliation_strings":["Kiwimoore Semiconductors,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Kiwimoore Semiconductors,Shanghai,China","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"Zexing Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zexing Chen","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101960346","display_name":"Jundong Zhu","orcid":"https://orcid.org/0000-0002-0104-2507"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jundong Zhu","raw_affiliation_strings":["Kiwimoore Semiconductors,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Kiwimoore Semiconductors,Shanghai,China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111248827","display_name":"D.S. Wen","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dexin Wen","raw_affiliation_strings":["Kiwimoore Semiconductors,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Kiwimoore Semiconductors,Shanghai,China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100322712","display_name":"Yan Wang","orcid":"https://orcid.org/0000-0002-5344-1884"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yan Wang","raw_affiliation_strings":["Kiwimoore Semiconductors,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Kiwimoore Semiconductors,Shanghai,China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100445148","display_name":"Yu Wang","orcid":"https://orcid.org/0000-0002-0597-3544"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yu Wang","raw_affiliation_strings":["Kiwimoore Semiconductors,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Kiwimoore Semiconductors,Shanghai,China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023446509","display_name":"Jian Xu","orcid":"https://orcid.org/0000-0003-2542-1971"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jian Xu","raw_affiliation_strings":["Kiwimoore Semiconductors,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Kiwimoore Semiconductors,Shanghai,China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100431433","display_name":"Feng Wang","orcid":"https://orcid.org/0009-0003-1688-6205"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Feng Wang","raw_affiliation_strings":["Kiwimoore Semiconductors,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Kiwimoore Semiconductors,Shanghai,China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062927280","display_name":"Jun Tao","orcid":"https://orcid.org/0000-0001-8742-687X"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Tao","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051205321","display_name":"Chixiao Chen","orcid":"https://orcid.org/0000-0002-5980-4236"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chixiao Chen","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100453158","display_name":"Qi Liu","orcid":"https://orcid.org/0000-0001-7062-831X"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qi Liu","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110532530","display_name":"Ming Liu","orcid":"https://orcid.org/0000-0002-3419-4400"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Liu","raw_affiliation_strings":["Fudan University,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fudan University,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"01","last_page":"03"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9919000267982483,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9890000224113464,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.8818562030792236},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7508236765861511},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4802168309688568},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4466474652290344},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.4308925271034241},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3538269102573395},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.18689605593681335},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0809088945388794}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.8818562030792236},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7508236765861511},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4802168309688568},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4466474652290344},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.4308925271034241},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3538269102573395},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.18689605593681335},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0809088945388794},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc49661.2025.10904819","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904819","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3865280386","display_name":null,"funder_award_id":"62322404","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1554938446","https://openalex.org/W2980104813","https://openalex.org/W2996407519","https://openalex.org/W2999356938","https://openalex.org/W3111684448","https://openalex.org/W3161299939","https://openalex.org/W3195213649","https://openalex.org/W4221013705","https://openalex.org/W4221089937","https://openalex.org/W4289538996","https://openalex.org/W4297097386","https://openalex.org/W4312121019","https://openalex.org/W4391932394","https://openalex.org/W4392746549","https://openalex.org/W4400314928","https://openalex.org/W4401881660"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2037416628","https://openalex.org/W2073725000","https://openalex.org/W2789752821","https://openalex.org/W2205502757","https://openalex.org/W2235483886","https://openalex.org/W1480508001","https://openalex.org/W2097812662","https://openalex.org/W2528892790","https://openalex.org/W2117988687"],"abstract_inverted_index":{"As":[0],"high-density":[1],"3D":[2,105,177,256],"integration":[3,170],"technology":[4,69],"progresses,":[5],"active":[6,33,62,112,162,210],"TSV":[7],"interposers":[8],"are":[9,141,222],"emerging":[10],"as":[11,38,88,176,213],"a":[12,89,110,208,250],"critical":[13],"component":[14],"in":[15,117,146,152,215],"More-than-Moore":[16],"strategies":[17],"[1],,[3],":[18],"enabling":[19],"the":[20,81,96,101,129,137,157,160,165,169,181,184,188,195,259],"transformation":[21],"of":[22,104,164,171],"traditional":[23],"multicore":[24],"monolithic":[25],"systems":[26],"into":[27],"compact":[28],"two-layer":[29],"stacking":[30],"architectures.":[31],"These":[32],"interposers,":[34],"often":[35],"referred":[36],"to":[37,79,94,150,194,265],"base":[39,262],"dies,":[40,127,263],"typically":[41],"occupy":[42],"several":[43],"hundred":[44],"square":[45],"millimeters":[46],"and":[47,57,76,99,139,187,261],"provide":[48],"advantages,":[49],"facilitating":[50],"integrated":[51,106],"power":[52],"management,":[53],"mature-technology-friendly":[54],"system":[55],"10s,":[56],"efficient":[58],"inter-chiplet":[59],"communication":[60],"through":[61],"buffers.":[63],"Developing":[64],"large-area":[65],"silicon":[66],"with":[67,132,228],"TSV/bumping":[68],"for":[70,143,168,245],"dedicated":[71],"designs":[72],"is":[73],"both":[74],"costly":[75],"inefficient,":[77],"analogous":[78],"reinventing":[80],"wheel.":[82],"Reusable":[83],"2.5D/3D":[84],"components":[85],"have":[86],"emerged":[87],"promising":[90],"solution":[91],"[4],,":[92],"[6]":[93],"reduce":[95],"NRE":[97],"costs":[98],"simplify":[100],"design":[102],"complexity":[103],"systems.":[107],"For":[108],"example,":[109],"single":[111],"interposer":[113,166],"can":[114],"be":[115],"configured":[116],"two":[118,133],"different":[119,147,199],"schemes":[120],"[3]:":[121],"one":[122],"supports":[123],"three":[124],"CPU":[125],"top":[126,185,260],"while":[128],"other":[130],"operates":[131],"domain-specific":[134],"accelerators.":[135],"However,":[136,180],"interconnect":[138,247],"interfaces":[140],"customized":[142],"specific":[144],"chiplets":[145],"configurations,":[148],"leading":[149],"challenges":[151,192],"reusing":[153],"signal":[154],"links":[155],"on":[156,269],"interposer.":[158],"Moreover,":[159],"expansive":[161],"area":[163],"allows":[167],"considerable":[172],"on-interposer":[173],"memory,":[174],"known":[175,212],"underdeck":[178,189,230],"memory.":[179],"orchestration":[182],"between":[183],"dies":[186],"memory":[190],"poses":[191],"due":[193],"diverse":[196],"requirements":[197],"across":[198],"tasks.":[200],"To":[201],"address":[202],"these":[203],"issues,":[204],"this":[205],"paper":[206],"presents":[207],"reusable":[209],"TSV-interposer,":[211],"SHINSAI,":[214],"28nm-CMOS/TSV-middle/micro-bump":[216],"(\u03bcbump)":[217],"technology.":[218],"The":[219],"key":[220],"contributions":[221],"1)":[223],"heterogeneous":[224],"dual-layer":[225],"network-on-active-interposer":[226],"(NoAI)":[227],"512Mb":[229],"SRAM;":[231],"2)":[232],"programmable":[233],"horizontal":[234],"(2.5D)":[235],"die-to":[236],"die":[237],"link":[238,253],"(H-Link)":[239],"fabric,":[240],"achieving":[241],"independent":[242],"\u03bcbump-to-\u03bcbump":[243],"routing":[244],"various":[246],"topologies;":[248],"3)":[249],"reconfigurable":[251],"vertical":[252],"(V-Link)":[254],"bridging":[255],"NoC":[257],"among":[258],"adaptable":[264],"varying":[266],"up/down-stream":[267],"bandwidth":[268],"stacked":[270],"interfaces.":[271]},"counts_by_year":[{"year":2026,"cited_by_count":4},{"year":2025,"cited_by_count":4}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}