{"id":"https://openalex.org/W4408174477","doi":"https://doi.org/10.1109/isscc49661.2025.10904771","title":"37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6\u00d72.15mm<sup>2</sup> SoC and bySPI Chiplets","display_name":"37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6\u00d72.15mm<sup>2</sup> SoC and bySPI Chiplets","publication_year":2025,"publication_date":"2025-02-16","ids":{"openalex":"https://openalex.org/W4408174477","doi":"https://doi.org/10.1109/isscc49661.2025.10904771"},"language":"en","primary_location":{"id":"doi:10.1109/isscc49661.2025.10904771","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904771","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071412160","display_name":"Anjali Agrawal","orcid":"https://orcid.org/0000-0002-7653-7897"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anjali Agrawal","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100615273","display_name":"Zhenghong Chen","orcid":"https://orcid.org/0009-0008-9459-3789"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhenghong Chen","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116533063","display_name":"Braden E. Desman","orcid":"https://orcid.org/0000-0002-2836-168X"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Braden E. Desman","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101607891","display_name":"Jinhua Wang","orcid":"https://orcid.org/0000-0003-1376-8134"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jinhua Wang","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031650668","display_name":"Akiyoshi Tanaka","orcid":"https://orcid.org/0000-0001-8535-6513"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Akiyoshi Tanaka","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116533064","display_name":"Fahim Foysal","orcid":null},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Fahim Foysal","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Charlie D. Hess","orcid":null},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Charlie D. Hess","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043083129","display_name":"W. M. Farrell","orcid":"https://orcid.org/0000-0002-2284-7654"},"institutions":[{"id":"https://openalex.org/I4210103265","display_name":"Nautilus (United States)","ror":"https://ror.org/01d8jjd81","country_code":"US","type":"company","lineage":["https://openalex.org/I4210103265"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Will Farrell","raw_affiliation_strings":["Nautilus Defense LLC,Pawtucket,RI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nautilus Defense LLC,Pawtucket,RI","institution_ids":["https://openalex.org/I4210103265"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034530989","display_name":"Jim Owens","orcid":"https://orcid.org/0000-0003-4015-8075"},"institutions":[{"id":"https://openalex.org/I4210103265","display_name":"Nautilus (United States)","ror":"https://ror.org/01d8jjd81","country_code":"US","type":"company","lineage":["https://openalex.org/I4210103265"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jim Owens","raw_affiliation_strings":["Nautilus Defense LLC,Pawtucket,RI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nautilus Defense LLC,Pawtucket,RI","institution_ids":["https://openalex.org/I4210103265"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081774167","display_name":"Daniel S. Truesdell","orcid":"https://orcid.org/0000-0002-5723-0398"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Daniel S. Truesdell","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080557997","display_name":"Benton H. Calhoun","orcid":"https://orcid.org/0000-0002-3770-5050"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Benton H. Calhoun","raw_affiliation_strings":["University of Virginia,Charlottesville,VA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Virginia,Charlottesville,VA","institution_ids":["https://openalex.org/I51556381"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":24.0656,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.99537078,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"608","last_page":"610"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/yarn","display_name":"Yarn","score":0.8563604354858398},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.671252965927124},{"id":"https://openalex.org/keywords/wearable-computer","display_name":"Wearable computer","score":0.6540810465812683},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.5512807369232178},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.46594536304473877},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.38942861557006836},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27688679099082947},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.23357897996902466},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.16776973009109497},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.13284584879875183}],"concepts":[{"id":"https://openalex.org/C2778787235","wikidata":"https://www.wikidata.org/wiki/Q49007","display_name":"Yarn","level":2,"score":0.8563604354858398},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.671252965927124},{"id":"https://openalex.org/C150594956","wikidata":"https://www.wikidata.org/wiki/Q1334829","display_name":"Wearable computer","level":2,"score":0.6540810465812683},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.5512807369232178},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46594536304473877},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.38942861557006836},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27688679099082947},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.23357897996902466},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.16776973009109497},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13284584879875183},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc49661.2025.10904771","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904771","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G6622503737","display_name":null,"funder_award_id":"N66001-23-C-4512","funder_id":"https://openalex.org/F4320333051","funder_display_name":"Intelligence Advanced Research Projects Activity"}],"funders":[{"id":"https://openalex.org/F4320312530","display_name":"Office of the Director of National Intelligence","ror":"https://ror.org/01v3fsc55"},{"id":"https://openalex.org/F4320333051","display_name":"Intelligence Advanced Research Projects Activity","ror":"https://ror.org/01v3fsc55"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W1965973573","https://openalex.org/W2035179348","https://openalex.org/W2097502965","https://openalex.org/W2144371247","https://openalex.org/W2734446745","https://openalex.org/W2792260701","https://openalex.org/W2796075095","https://openalex.org/W2898646670","https://openalex.org/W2953133689","https://openalex.org/W3015690986","https://openalex.org/W3018778368","https://openalex.org/W3080474852","https://openalex.org/W3083154738","https://openalex.org/W3108879573","https://openalex.org/W3164403439","https://openalex.org/W4206944723","https://openalex.org/W4281787370","https://openalex.org/W4360605522","https://openalex.org/W4383895104","https://openalex.org/W4390905274","https://openalex.org/W4390970741","https://openalex.org/W4391565674","https://openalex.org/W4392127956","https://openalex.org/W4394579527","https://openalex.org/W4401880214"],"related_works":["https://openalex.org/W2078851640","https://openalex.org/W2381070915","https://openalex.org/W2352481835","https://openalex.org/W2392493391","https://openalex.org/W4200164335","https://openalex.org/W2109471562","https://openalex.org/W2378508949","https://openalex.org/W3199747891","https://openalex.org/W2370334853","https://openalex.org/W3194197694"],"abstract_inverted_index":{"This":[0,420],"paper":[1],"proposes":[2],"a":[3,28,84,130,135,182,196,237,279,285,321,326,372,377,387],"scalable,":[4],"2-dimensional":[5],"network-on-textiles":[6],"(kNOT)":[7],"comprised":[8,359],"of":[9,20,40,86,240,265,296,306,330,337,342,360,436],"systems-on-chip":[10],"(SoCs)":[11],"and":[12,27,38,54,74,101,120,168,192,254,287,315,319,364,380,404,417],"\u201cbySPI\u201d":[13],"networking":[14,244],"chiplets":[15,246,349],"that":[16,173],"are":[17,215,350,358,411],"jointly":[18],"capable":[19,336],"supporting":[21],"heterogeneous":[22],"programming,":[23],"multiple":[24],"sensing":[25,132],"modalities,":[26],"distributed":[29,238],"memory":[30,234],"system.":[31],"Emerging":[32],"e-textiles":[33],"must":[34,107],"retain":[35],"the":[36,98,141,148,178,263,293,331,393,402,405,434],"flexibility":[37],"comfort":[39],"their":[41,223],"host":[42],"garment":[43],"to":[44,165,222,276,339,353,397,414],"be":[45,109,117,121],"viable":[46],"in":[47,127,186],"wearable":[48,205],"applications":[49,206],"for":[50,104,217],"healthcare,":[51],"virtual":[52],"reality,":[53],"sports":[55],"[1]\u2013[4].":[56],"Prior":[57],"integration":[58,106,220,273],"efforts":[59],"have":[60],"demonstrated":[61],"textile":[62,219,272],"computing":[63,281],"by":[64,231],"weaving":[65],"flexible":[66],"filament":[67],"circuits":[68],"[5]\u2013[7],":[69],"embroidering":[70],"conductive":[71],"yarns":[72,363],"[8],":[73],"fabricating":[75],"electronic":[76],"fibers":[77],"[9]\u2013[10].":[78],"Still,":[79],"these":[80,245],"works":[81],"suffer":[82],"from":[83,153],"combination":[85],"bulky,":[87],"rigid":[88],"components,":[89],"high":[90],"cost,":[91],"or":[92],"1-dimensionality":[93],"(Fig.":[94,441],"37.2.1).":[95,442],"To":[96],"preserve":[97],"textile's":[99],"look":[100],"feel,":[102],"SoCs":[103],"fabric":[105,280],"also":[108,207],"highly":[110],"miniaturized,":[111],"feature":[112],"minimal":[113],"area-hungry":[114],"IO":[115,161],"interfaces,":[116],"easily":[118],"programmable,":[119],"fully":[122,156],"integrable.":[123],"The":[124,151,348,409],"e-textile":[125,184],"system":[126,185],"[11]":[128],"integrated":[129,202],"health":[131],"chip":[133,149],"onto":[134,195],"planar":[136],"fashionable":[137],"circuit":[138],"board,":[139],"yet":[140,212],"board":[142,286],"(25\u00d725mm2)":[143],"is":[144,155,163,174,325,374,383,391,395,407,424],"40\u00d7":[145],"larger":[146,176],"than":[147,177],"itself.":[150],"System-in-Fiber":[152],"[12]":[154],"autonomous":[157],"but":[158,198,268],"has":[159],"many":[160],"pads,":[162,308],"limited":[164],"1D":[166],"networks,":[167],"requires":[169],"an":[170,193,201,301,304],"interposer":[171],"(4.7\u00d73.7mm2)":[172],"3.8\u00d7":[175],"die.":[179],"Most":[180],"recently,":[181],"battery-less":[183],"[13]":[187],"integrates":[188],"cm-scale":[189],"harvesting":[190],"tiles":[191],"inductor":[194],"shirt,":[197],"it":[199],"lacks":[200],"SoC.":[203],"Many":[204],"demand":[208],"substantial":[209],"on-garment":[210],"storage,":[211],"large":[213],"memories":[214],"unsuited":[216],"comfortable":[218],"due":[221],"sizable":[224],"footprint.":[225],"Our":[226],"kNOT":[227,290],"solution":[228],"addresses":[229],"this":[230],"replacing":[232],"monolithic":[233],"units":[235],"with":[236,292,303,401,426],"set":[239],"smaller":[241],"memories.":[242],"However,":[243],"via":[247],"existing":[248],"bus":[249],"standards":[250],"incurs":[251],"significant":[252],"area":[253],"power":[255],"penalties":[256],"[14].":[257],"Existing":[258],"Body":[259],"Area":[260],"Networks":[261],"highlight":[262],"potential":[264],"multi-chip":[266],"solutions,":[267],"they":[269],"lack":[270],"seamless":[271],"[15]\u2013[17].":[274],"Hence,":[275],"truly":[277],"realize":[278],"system,":[282],"we":[283],"propose":[284],"interposer-free":[288],"2D":[289],"built":[291],"direct-die":[294],"attachment":[295],"two":[297],"miniaturized":[298],"chiplets:":[299],"1)":[300],"SoC":[302],"array":[305],"reconfigurable":[307],"fault-tolerant":[309],"global":[310],"bootup,":[311],"SoC-to-SoC":[312],"clock":[313],"synchronization,":[314],"dynamic":[316],"network":[317],"configuration;":[318],"2)":[320],"bySPI":[322],"chiplet":[323,394],"which":[324,357],"COTS-compatible,":[327],"reduced-wire":[328],"enhancement":[329],"bypass-SPI":[332],"(bySPI)":[333],"protocol":[334],"[14]":[335],"connecting":[338],"any":[340],"number":[341],"receivers":[343],"(RXs)":[344],"using":[345,386],"three":[346],"wires.":[347],"directly":[351],"interconnected":[352],"braided":[354],"composite":[355],"yarns,":[356,403],"para-aramid":[361],"structural":[362],"insulated":[365],"25\u03bcm-diameter":[366],"conductors":[367],"[26].":[368],"For":[369],"each":[370],"pad,":[371],"yarn":[373],"embroidered":[375],"into":[376],"cotton":[378],"substrate":[379],"its":[381,399],"insulation":[382],"selectively":[384],"ablated":[385],"laser.":[388],"Solder":[389],"paste":[390],"deposited,":[392],"placed":[396],"align":[398],"pads":[400],"solder":[406],"reflowed.":[408],"interconnections":[410],"then":[412],"encapsulated":[413],"provide":[415],"mechanical":[416],"environmental":[418],"protection.":[419],"textile-chiplet":[421],"interconnection":[422],"approach":[423],"compatible":[425],"automated":[427],"high-throughput":[428],"2.5D":[429],"electronics":[430],"manufacturing":[431],"methods,":[432],"enabling":[433],"production":[435],"textile-integrated":[437],"systems":[438],"at":[439],"scale":[440]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":4}],"updated_date":"2026-08-12T21:12:35.861297","created_date":"2025-10-10T00:00:00"}