{"id":"https://openalex.org/W4408183535","doi":"https://doi.org/10.1109/isscc49661.2025.10904719","title":"8.8 Fine-Grained Spatial and Temporal Thermal Profiling of a 16nm CMOS Buck Converter and SoC Load-Current Emulator Using Low-Voltage Micron-Scale Thermal Sensors","display_name":"8.8 Fine-Grained Spatial and Temporal Thermal Profiling of a 16nm CMOS Buck Converter and SoC Load-Current Emulator Using Low-Voltage Micron-Scale Thermal Sensors","publication_year":2025,"publication_date":"2025-02-16","ids":{"openalex":"https://openalex.org/W4408183535","doi":"https://doi.org/10.1109/isscc49661.2025.10904719"},"language":"en","primary_location":{"id":"doi:10.1109/isscc49661.2025.10904719","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904719","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109690980","display_name":"Zakir K. Ahmed","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Zakir Ahmed","raw_affiliation_strings":["Intel,Hillsboro,OR"],"affiliations":[{"raw_affiliation_string":"Intel,Hillsboro,OR","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045294207","display_name":"Suhwan Kim","orcid":"https://orcid.org/0000-0002-0875-1218"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Suhwan Kim","raw_affiliation_strings":["Intel,Hillsboro,OR"],"affiliations":[{"raw_affiliation_string":"Intel,Hillsboro,OR","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085682261","display_name":"Charles Augustine","orcid":"https://orcid.org/0000-0001-8892-6286"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Charles Augustine","raw_affiliation_strings":["Intel,Hillsboro,OR"],"affiliations":[{"raw_affiliation_string":"Intel,Hillsboro,OR","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043243464","display_name":"Harish K. Krishnamurthy","orcid":"https://orcid.org/0000-0001-5927-8339"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Harish K. Krishnamurthy","raw_affiliation_strings":["Intel,Hillsboro,OR"],"affiliations":[{"raw_affiliation_string":"Intel,Hillsboro,OR","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061932619","display_name":"Krishnan Ravichandran","orcid":"https://orcid.org/0000-0003-2271-4314"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krishnan Ravichandran","raw_affiliation_strings":["Intel,Hillsboro,OR"],"affiliations":[{"raw_affiliation_string":"Intel,Hillsboro,OR","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067753561","display_name":"James Tschanz","orcid":"https://orcid.org/0000-0003-0317-4332"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"James W. Tschanz","raw_affiliation_strings":["Intel,Hillsboro,OR"],"affiliations":[{"raw_affiliation_string":"Intel,Hillsboro,OR","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076642880","display_name":"Vivek De","orcid":"https://orcid.org/0000-0001-5207-1079"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vivek De","raw_affiliation_strings":["Intel,Hillsboro,OR"],"affiliations":[{"raw_affiliation_string":"Intel,Hillsboro,OR","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5109690980"],"corresponding_institution_ids":["https://openalex.org/I1343180700"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0340448,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"172","last_page":"174"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/profiling","display_name":"Profiling (computer programming)","score":0.6536053419113159},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.6270207166671753},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5999814867973328},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5303103923797607},{"id":"https://openalex.org/keywords/current","display_name":"Current (fluid)","score":0.5253348350524902},{"id":"https://openalex.org/keywords/buck-converter","display_name":"Buck converter","score":0.4556872844696045},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.4165569543838501},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.39525818824768066},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3734245300292969},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3670593500137329},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.33297666907310486},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.189153254032135},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17841145396232605},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1524602472782135},{"id":"https://openalex.org/keywords/cartography","display_name":"Cartography","score":0.08806174993515015},{"id":"https://openalex.org/keywords/geography","display_name":"Geography","score":0.06706893444061279},{"id":"https://openalex.org/keywords/meteorology","display_name":"Meteorology","score":0.0644541084766388}],"concepts":[{"id":"https://openalex.org/C187191949","wikidata":"https://www.wikidata.org/wiki/Q1138496","display_name":"Profiling (computer programming)","level":2,"score":0.6536053419113159},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.6270207166671753},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5999814867973328},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5303103923797607},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.5253348350524902},{"id":"https://openalex.org/C150818752","wikidata":"https://www.wikidata.org/wiki/Q83804","display_name":"Buck converter","level":3,"score":0.4556872844696045},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.4165569543838501},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.39525818824768066},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3734245300292969},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3670593500137329},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.33297666907310486},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.189153254032135},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17841145396232605},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1524602472782135},{"id":"https://openalex.org/C58640448","wikidata":"https://www.wikidata.org/wiki/Q42515","display_name":"Cartography","level":1,"score":0.08806174993515015},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.06706893444061279},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0644541084766388},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc49661.2025.10904719","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904719","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8700000047683716,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W2098335003","https://openalex.org/W2565179045","https://openalex.org/W2787275496","https://openalex.org/W2790039338","https://openalex.org/W2990976435","https://openalex.org/W3189388905","https://openalex.org/W4220777582","https://openalex.org/W4360605895","https://openalex.org/W4375802119"],"related_works":["https://openalex.org/W3014521742","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W4386230336","https://openalex.org/W4306968100","https://openalex.org/W2161444195","https://openalex.org/W2464627195","https://openalex.org/W2171986175","https://openalex.org/W2985540061","https://openalex.org/W2089791793"],"abstract_inverted_index":{"Localized":[0],"hotspots":[1],"across":[2,29,74,108],"high-power-density":[3],"monolithic":[4],"systems-on-chip":[5],"(SoCs)":[6],"and":[7,21,43,48,76,126],"heterogenous":[8],"3D":[9,84],"SoCs":[10],"with":[11],"integrated":[12],"voltage":[13],"regulators":[14],"(IVR)":[15],"pose":[16],"major":[17],"bottlenecks":[18],"to":[19,36,53,95],"performance":[20,56],"reliability,":[22],"especially":[23],"as":[24,120,122],"demand":[25,58],"for":[26,46,59],"compute":[27],"density":[28],"a":[30,60,109],"wide":[31],"range":[32],"of":[33,62],"applications":[34],"continues":[35],"grow":[37],"unabated":[38],"[1]\u2013[2].":[39],"Floating":[40],"point":[41],"units":[42],"matrix/vector":[44],"multipliers":[45],"AI/ML":[47],"other":[49],"special-purpose":[50],"accelerators,":[51],"designed":[52],"deliver":[54],"extreme":[55],"on":[57],"variety":[61],"workloads,":[63],"generate":[64],"localized":[65,103],"thermal":[66,97,118,124],"hotspot":[67],"profiles":[68],"at":[69],"fine":[70],"granularity":[71],"that":[72],"vary":[73],"time":[75],"workloads":[77],"[3]\u2013[4].":[78],"This":[79],"is":[80],"further":[81],"aggravated":[82],"in":[83,101],"integration":[85],"since":[86],"heat":[87],"dissipation":[88],"occurs":[89],"vertically":[90],"through":[91],"the":[92],"thinner":[93],"dies":[94],"improved":[96],"interface":[98],"materials,":[99],"resulting":[100],"larger":[102],"temperature":[104],"gradients":[105],"(>":[106],"10\u00b0C)":[107],"few":[110],"<tex":[111],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[112],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$100\\mu":[113],"\\mathrm{m}$</tex>":[114],"[5].":[115],"Therefore,":[116],"fine-grained":[117],"profiling":[119],"well":[121],"runtime":[123],"monitoring":[125],"management":[127],"are":[128],"essential.":[129]},"counts_by_year":[],"updated_date":"2025-12-21T01:58:51.020947","created_date":"2025-10-10T00:00:00"}