{"id":"https://openalex.org/W4408183639","doi":"https://doi.org/10.1109/isscc49661.2025.10904693","title":"Skin-Inspired Electronics: An Emerging Sensing and Computing Platform","display_name":"Skin-Inspired Electronics: An Emerging Sensing and Computing Platform","publication_year":2025,"publication_date":"2025-02-16","ids":{"openalex":"https://openalex.org/W4408183639","doi":"https://doi.org/10.1109/isscc49661.2025.10904693"},"language":"en","primary_location":{"id":"doi:10.1109/isscc49661.2025.10904693","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904693","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5116535683","display_name":"Margherita Ronchini","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Margherita Ronchini","raw_affiliation_strings":["Stanford University,Stanford,CA"],"affiliations":[{"raw_affiliation_string":"Stanford University,Stanford,CA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100685801","display_name":"Weichen Wang","orcid":"https://orcid.org/0000-0001-7891-4089"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Weichen Wang","raw_affiliation_strings":["Stanford University,Stanford,CA"],"affiliations":[{"raw_affiliation_string":"Stanford University,Stanford,CA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080365891","display_name":"Yuya Nishio","orcid":"https://orcid.org/0000-0002-0028-5507"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuya Nishio","raw_affiliation_strings":["Stanford University,Stanford,CA"],"affiliations":[{"raw_affiliation_string":"Stanford University,Stanford,CA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002439526","display_name":"Yating Yao","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yating Yao","raw_affiliation_strings":["Stanford University,Stanford,CA"],"affiliations":[{"raw_affiliation_string":"Stanford University,Stanford,CA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100384245","display_name":"Zhenan Bao","orcid":"https://orcid.org/0000-0002-0972-1715"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhenan Bao","raw_affiliation_strings":["Stanford University,Stanford,CA"],"affiliations":[{"raw_affiliation_string":"Stanford University,Stanford,CA","institution_ids":["https://openalex.org/I97018004"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5116535683"],"corresponding_institution_ids":["https://openalex.org/I97018004"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.03897656,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6327022314071655},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5787927508354187},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23865154385566711},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.21482783555984497}],"concepts":[{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6327022314071655},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5787927508354187},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23865154385566711},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.21482783555984497}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isscc49661.2025.10904693","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc49661.2025.10904693","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},{"id":"pmh:oai:pure.atira.dk:publications/ef88760d-b96a-40a6-adea-19e5f3de237b","is_oa":false,"landing_page_url":"https://pure.au.dk/portal/en/publications/ef88760d-b96a-40a6-adea-19e5f3de237b","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Ronchini, M, Wang, W, Nishio, Y, Yao, Y & Bao, Z 2025, Skin-Inspired Electronics : An Emerging Sensing and Computing Platform. in 2025 IEEE International Solid-State Circuits Conference (ISSCC). IEEE, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, pp. 232-234, 72nd IEEE International Solid-State Circuits Conference, ISSCC 2025, San Francisco, United States, 16/02/2025. https://doi.org/10.1109/ISSCC49661.2025.10904693","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4300000071525574,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W2074200107","https://openalex.org/W2157426451","https://openalex.org/W2212410734","https://openalex.org/W2468965001","https://openalex.org/W2552460226","https://openalex.org/W2571051306","https://openalex.org/W2739842895","https://openalex.org/W2788045153","https://openalex.org/W2807551379","https://openalex.org/W2940199329","https://openalex.org/W2986738714","https://openalex.org/W3124604975","https://openalex.org/W3173205213","https://openalex.org/W4213373925","https://openalex.org/W4220843382","https://openalex.org/W4292156427","https://openalex.org/W4377013998","https://openalex.org/W4392739873","https://openalex.org/W4399743225"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"Skin":[0],"is":[1],"the":[2,8,20,58,74,96],"interface":[3],"between":[4],"our":[5,36],"body":[6],"and":[7,13,30,41,61,81,102,114,118],"environment.":[9],"Its":[10],"unique":[11],"properties":[12],"sensing":[14,71,101],"capabilities":[15],"allow":[16],"us":[17],"to":[18,38,55,86,91],"perceive":[19],"world":[21],"around":[22],"us.":[23],"Information":[24],"about":[25],"shape,":[26],"texture,":[27],"stiffness,":[28],"temperature,":[29],"pain":[31],"conveyed":[32],"by":[33],"touch":[34],"facilitates":[35],"ability":[37],"perform":[39],"tasks":[40],"manipulate":[42],"objects":[43],"dexterously":[44],"[1].":[45],"Adding":[46],"sensory":[47],"feedback":[48],"in":[49,73],"prosthetic":[50,93],"limbs":[51],"will":[52],"enable":[53],"users":[54],"interact":[56],"with":[57],"environment":[59],"naturally":[60],"effectively,":[62],"instead":[63],"of":[64,76],"relying":[65],"solely":[66],"on":[67],"visual":[68],"cues.":[69],"Tactile":[70],"technologies,":[72],"form":[75],"highly":[77],"dense":[78],"sensor":[79],"arrays":[80],"neuromorphic":[82],"encoding":[83],"circuits":[84],"coupled":[85],"a":[87,100,109],"neuromodulator,":[88],"are":[89],"poised":[90],"revolutionize":[92],"devices.":[94],"On":[95],"other":[97],"hand,":[98],"such":[99],"signal":[103],"computing":[104],"system":[105],"architecture":[106],"can":[107],"provide":[108],"general":[110],"platform":[111],"for":[112],"seamless":[113],"minimally":[115],"invasive":[116],"wearable":[117],"implantable":[119],"devices":[120],"(Fig.":[121],"12.4.1).":[122]},"counts_by_year":[],"updated_date":"2026-03-12T08:34:05.389933","created_date":"2025-10-10T00:00:00"}