{"id":"https://openalex.org/W4360605769","doi":"https://doi.org/10.1109/isscc42615.2023.10067442","title":"1.3 EU Ships Act Drives Pan-European Full-Stack Innovation Partnerships","display_name":"1.3 EU Ships Act Drives Pan-European Full-Stack Innovation Partnerships","publication_year":2023,"publication_date":"2023-02-19","ids":{"openalex":"https://openalex.org/W4360605769","doi":"https://doi.org/10.1109/isscc42615.2023.10067442"},"language":"en","primary_location":{"id":"doi:10.1109/isscc42615.2023.10067442","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc42615.2023.10067442","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Solid- State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113128687","display_name":"Jo De Boeck","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Jo De Boeck","raw_affiliation_strings":["imec and KU Leuven,Leuven,Belgium","imec and KU Leuven, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec and KU Leuven,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974","https://openalex.org/I99464096"]},{"raw_affiliation_string":"imec and KU Leuven, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974","https://openalex.org/I99464096"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008817603","display_name":"Jean-Ren\u00e9 L\u00e8quepeys","orcid":null},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Jean-Ren\u00e9 L\u00e8quepeys","raw_affiliation_strings":["CEA-Leti and Université Grenoble Alpes,Grenoble,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CEA-Leti and Université Grenoble Alpes,Grenoble,France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I4210150049"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5004211018","display_name":"Christoph Kutter","orcid":"https://orcid.org/0000-0002-9605-1878"},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Christoph Kutter","raw_affiliation_strings":["Fraunhofer EMFT and Universität der Bundeswehr,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer EMFT and Universität der Bundeswehr,Munich,Germany","institution_ids":["https://openalex.org/I4210128143"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"26","last_page":"32"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11948","display_name":"Machine Learning in Materials Science","score":0.9165999889373779,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11948","display_name":"Machine Learning in Materials Science","score":0.9165999889373779,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/supply-chain","display_name":"Supply chain","score":0.5643427968025208},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.5593384504318237},{"id":"https://openalex.org/keywords/industrial-organization","display_name":"Industrial organization","score":0.5212186574935913},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4798957109451294},{"id":"https://openalex.org/keywords/incentive","display_name":"Incentive","score":0.4627072811126709},{"id":"https://openalex.org/keywords/original-equipment-manufacturer","display_name":"Original equipment manufacturer","score":0.4544336199760437},{"id":"https://openalex.org/keywords/value-chain","display_name":"Value chain","score":0.4235311448574066},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4055666923522949},{"id":"https://openalex.org/keywords/marketing","display_name":"Marketing","score":0.3095420002937317},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2643142342567444},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22965127229690552},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19971635937690735},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.19097968935966492},{"id":"https://openalex.org/keywords/economics","display_name":"Economics","score":0.17424994707107544}],"concepts":[{"id":"https://openalex.org/C108713360","wikidata":"https://www.wikidata.org/wiki/Q1824206","display_name":"Supply chain","level":2,"score":0.5643427968025208},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.5593384504318237},{"id":"https://openalex.org/C40700","wikidata":"https://www.wikidata.org/wiki/Q1411783","display_name":"Industrial organization","level":1,"score":0.5212186574935913},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4798957109451294},{"id":"https://openalex.org/C29122968","wikidata":"https://www.wikidata.org/wiki/Q1414816","display_name":"Incentive","level":2,"score":0.4627072811126709},{"id":"https://openalex.org/C68694590","wikidata":"https://www.wikidata.org/wiki/Q267558","display_name":"Original equipment manufacturer","level":2,"score":0.4544336199760437},{"id":"https://openalex.org/C107666737","wikidata":"https://www.wikidata.org/wiki/Q646107","display_name":"Value chain","level":3,"score":0.4235311448574066},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4055666923522949},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.3095420002937317},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2643142342567444},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22965127229690552},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19971635937690735},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.19097968935966492},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.17424994707107544},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C175444787","wikidata":"https://www.wikidata.org/wiki/Q39072","display_name":"Microeconomics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/isscc42615.2023.10067442","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc42615.2023.10067442","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Solid- State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:cea-04750279v1","is_oa":false,"landing_page_url":"https://cea.hal.science/cea-04750279","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"2023 IEEE International Solid- State Circuits Conference (ISSCC), Feb 2023, San Francisco, United States. pp.26-32, ⟨10.1109/ISSCC42615.2023.10067442⟩","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:publica.fraunhofer.de:publica/448633","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/448633","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/17","display_name":"Partnerships for the goals","score":0.5299999713897705}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1832906682","https://openalex.org/W2063514135","https://openalex.org/W2080236506","https://openalex.org/W2920934338","https://openalex.org/W3106859121","https://openalex.org/W3135291752","https://openalex.org/W3139076594","https://openalex.org/W3146294934","https://openalex.org/W4211238337","https://openalex.org/W4284963920","https://openalex.org/W4286571784","https://openalex.org/W4317792928"],"related_works":["https://openalex.org/W2949536330","https://openalex.org/W2125856283","https://openalex.org/W4213224946","https://openalex.org/W2366593851","https://openalex.org/W2378471676","https://openalex.org/W2370523177","https://openalex.org/W2267813399","https://openalex.org/W2516133753","https://openalex.org/W2519519554","https://openalex.org/W2356502588"],"abstract_inverted_index":{"In":[0],"every":[1],"aspect":[2],"of":[3,58,63,133,183,204,212,225],"our":[4],"life":[5],"and":[6,13,30,44,93,100,117,136,142,157,166,180,208],"society,":[7],"semiconductors":[8],"play":[9],"a":[10,60,72,85,104],"major":[11],"role":[12],"that":[14,37,89],"impact":[15],"is":[16,70,87],"set":[17],"to":[18,40,78,193,199],"increase":[19,75],"even":[20],"further.":[21],"The":[22,51,176,197],"pandemic":[23],"in":[24,46,91,147,201,228],"conjunction":[25],"with":[26,76],"supply":[27,107],"chain":[28,207],"hiccups":[29],"geopolitical":[31],"tensions":[32],"made":[33],"all":[34,202,210],"regions":[35,227],"realize":[36],"they":[38],"need":[39],"revisit":[41],"their":[42],"position":[43,132,224],"potential":[45],"the":[47,56,79,150,181,195,205,221],"semiconductor":[48,65,115,174],"value":[49,206],"chain.":[50,108],"European":[52],"Commission":[53],"expressed":[54],"[1]":[55],"ambition":[57],"achieving":[59],"20%":[61],"share":[62],"global":[64],"production":[66],"by":[67],"2030.":[68],"This":[69],"roughly":[71],"\u2018times":[73],"four\u2019":[74],"respect":[77],"situation":[80],"today.":[81],"To":[82],"achieve":[83],"that,":[84],"plan":[86],"proposed":[88],"invests":[90],"research":[92],"development,":[94],"promotes":[95],"larger":[96],"incentives":[97],"for":[98,103,114,160,172,218],"manufacturing,":[99,235],"indicates":[101],"measures":[102],"more":[105],"stable":[106],"Worldwide":[109],"ambitious":[110],"investments":[111],"are":[112,190],"planned":[113],"R&D":[116,148],"manufacturing.":[118],"Europe":[119],"should":[120],"leverage":[121],"its":[122,130],"existing":[123,158],"strengths":[124],"(see":[125],"Figure":[126],"1.3.1)":[127],"such":[128,186],"as":[129,168,170,187],"unique":[131],"certain":[134,229],"materials":[135],"equipment":[137],"companies":[138],"(ASML,":[139],"SOITEC,":[140],"ASM-l,":[141],"so":[143],"on),":[144],"leadership":[145],"positions":[146],"on":[149],"industrial300mm":[151],"wafer":[152],"standard":[153],"(imec,":[154],"CEAlLeti,":[155],"Fraunhofer),":[156],"ecosystems":[159],"chip":[161,234],"manufacturing":[162],"embracing":[163],"mature":[164],"nodes":[165],"specialties,":[167],"well":[169],"partnerships":[171,200],"advanced":[173],"fabrication.":[175],"high-quality":[177],"educational":[178],"system":[179],"presence":[182],"strong":[184,223],"OEMs,":[185],"automotive":[188],"companies,":[189],"key":[191],"assets":[192],"drive":[194],"demand.":[196],"openness":[198],"layers":[203],"at":[209],"levels":[211],"technology":[213],"maturity":[214],"will":[215],"be":[216],"essential":[217],"success,":[219],"given":[220],"very":[222],"other":[226],"domains":[230],"(EDA,":[231],"leading-edge":[232],"node":[233],"packaging,":[236],"memory).":[237]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2023-03-24T00:00:00"}