{"id":"https://openalex.org/W3133563952","doi":"https://doi.org/10.1109/isscc42613.2021.9365823","title":"Session 11 Overview: Advanced Wireline Links and Techniques","display_name":"Session 11 Overview: Advanced Wireline Links and Techniques","publication_year":2021,"publication_date":"2021-02-13","ids":{"openalex":"https://openalex.org/W3133563952","doi":"https://doi.org/10.1109/isscc42613.2021.9365823","mag":"3133563952"},"language":"en","primary_location":{"id":"doi:10.1109/isscc42613.2021.9365823","is_oa":true,"landing_page_url":"https://doi.org/10.1109/isscc42613.2021.9365823","pdf_url":"https://ieeexplore.ieee.org/ielx7/9365732/9365735/09365823.pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/9365732/9365735/09365823.pdf","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5091748833","display_name":"Mike Shuo\u2010Wei Chen","orcid":"https://orcid.org/0000-0001-7033-272X"},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mike Shuo-Wei Chen","raw_affiliation_strings":["University of Southern California,Los Angeles,CA","University of Southern California, Los Angeles, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Southern California,Los Angeles,CA","institution_ids":["https://openalex.org/I1174212"]},{"raw_affiliation_string":"University of Southern California, Los Angeles, CA","institution_ids":["https://openalex.org/I1174212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042049354","display_name":"Wei\u2010Zen Chen","orcid":"https://orcid.org/0000-0003-2840-0754"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wei-Zen Chen","raw_affiliation_strings":["National Chiao Tung University,Hsinchu,Taiwan","National Chiao Tung University, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Chiao Tung University,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5012382547","display_name":"Amir Amirkhany","orcid":"https://orcid.org/0000-0002-4377-6947"},"institutions":[{"id":"https://openalex.org/I4210101778","display_name":"Samsung (United States)","ror":"https://ror.org/01bfbvm65","country_code":"US","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4210101778"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Amir Amirkhany","raw_affiliation_strings":["Samsung Electronics,San Jose,CA","Samsung Electronics, San Jose, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Samsung Electronics,San Jose,CA","institution_ids":["https://openalex.org/I4210101778"]},{"raw_affiliation_string":"Samsung Electronics, San Jose, CA","institution_ids":["https://openalex.org/I4210101778"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.407,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.4227009,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"178","last_page":"179"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10232","display_name":"Optical Network Technologies","score":0.9907000064849854,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.989799976348877,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wireline","display_name":"Wireline","score":0.930138111114502},{"id":"https://openalex.org/keywords/serdes","display_name":"SerDes","score":0.8030388355255127},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6300635933876038},{"id":"https://openalex.org/keywords/session","display_name":"Session (web analytics)","score":0.5306301116943359},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.5258867144584656},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.4565025269985199},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.45068731904029846},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.4238317608833313},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4189731478691101},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.41732507944107056},{"id":"https://openalex.org/keywords/efficient-energy-use","display_name":"Efficient energy use","score":0.41478103399276733},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.324396550655365},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.302724152803421},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27839988470077515},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.16985949873924255}],"concepts":[{"id":"https://openalex.org/C2776951270","wikidata":"https://www.wikidata.org/wiki/Q8026910","display_name":"Wireline","level":3,"score":0.930138111114502},{"id":"https://openalex.org/C19707634","wikidata":"https://www.wikidata.org/wiki/Q6510662","display_name":"SerDes","level":2,"score":0.8030388355255127},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6300635933876038},{"id":"https://openalex.org/C2779182362","wikidata":"https://www.wikidata.org/wiki/Q17126187","display_name":"Session (web analytics)","level":2,"score":0.5306301116943359},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.5258867144584656},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.4565025269985199},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.45068731904029846},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.4238317608833313},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4189731478691101},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.41732507944107056},{"id":"https://openalex.org/C2742236","wikidata":"https://www.wikidata.org/wiki/Q924713","display_name":"Efficient energy use","level":2,"score":0.41478103399276733},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.324396550655365},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.302724152803421},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27839988470077515},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.16985949873924255},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc42613.2021.9365823","is_oa":true,"landing_page_url":"https://doi.org/10.1109/isscc42613.2021.9365823","pdf_url":"https://ieeexplore.ieee.org/ielx7/9365732/9365735/09365823.pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1109/isscc42613.2021.9365823","is_oa":true,"landing_page_url":"https://doi.org/10.1109/isscc42613.2021.9365823","pdf_url":"https://ieeexplore.ieee.org/ielx7/9365732/9365735/09365823.pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"sustainable_development_goals":[{"score":0.8999999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3133563952.pdf","grobid_xml":"https://content.openalex.org/works/W3133563952.grobid-xml"},"referenced_works_count":1,"referenced_works":["https://openalex.org/W3133563952"],"related_works":["https://openalex.org/W2130047965","https://openalex.org/W3145088891","https://openalex.org/W3087888791","https://openalex.org/W2957422867","https://openalex.org/W2527653927","https://openalex.org/W2143950660","https://openalex.org/W3160420002","https://openalex.org/W4221085856","https://openalex.org/W2382232495","https://openalex.org/W2324994223"],"abstract_inverted_index":{"High-performance":[0],"SerDes":[1,45],"with":[2],"both":[3,70],"high":[4,37,40],"area":[5],"efficiency":[6,10],"(mm2/lane)":[7],"and":[8,20,30,39,58,72,79,93,130,136],"energy":[9],"(pJ/b)":[11],"are":[12],"driven":[13],"by":[14,53],"the":[15,55,88,116,137],"ever-increasing":[16],"demands":[17],"of":[18,87,115],"bandwidth":[19],"capacity":[21],"in":[22,96],"data":[23,74],"centers.":[24],"They":[25],"also":[26],"enable":[27,123],"chiplets,":[28],"multi-die,":[29],"silicon-photonics":[31],"integration":[32],"for":[33,60,108,139],"a":[34],"low":[35],"cost,":[36],"yield,":[38],"throughput":[41],"solution.":[42],"Besides,":[43],"low-power":[44,105],"is":[46],"essential":[47],"to":[48,122],"overall":[49],"system":[50],"power":[51,56,134],"savings":[52],"reducing":[54],"overhead":[57],"cost":[59],"cooling.":[61],"This":[62],"session":[63,89,117],"introduces":[64],"advanced":[65],"wireline":[66],"techniques":[67],"that":[68],"support":[69],"high-speed":[71,109,125],"energy-efficient":[73],"transmission":[75],"over":[76,144],"electrical,":[77],"fiber,":[78],"dielectric":[80,131],"waveguide":[81],"channels.":[82,146],"The":[83,101,111],"first":[84],"three":[85],"papers":[86,114],"describe":[90,104],"short-reach":[91],"power-":[92],"density-optimized":[94],"transceivers":[95],"state-of-the-art":[97],"7nm":[98],"FinFET":[99],"technology.":[100],"next":[102],"two":[103],"clock":[106],"generators":[107],"transceivers.":[110],"remaining":[112],"four":[113],"focus":[118],"on":[119],"design":[120],"solutions":[121],"future":[124],"link":[126],"scaling,":[127],"including":[128],"optical":[129],"waveguides,":[132],"ultra-low":[133],"CDRs,":[135],"potential":[138],">50Gb/s":[140],"simultaneous,":[141],"bidirectional":[142],"signaling":[143],"high-loss":[145]},"counts_by_year":[{"year":2021,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}