{"id":"https://openalex.org/W3015439375","doi":"https://doi.org/10.1109/isscc19947.2020.9062924","title":"5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7\u00b5m Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology","display_name":"5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7\u00b5m Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology","publication_year":2020,"publication_date":"2020-02-01","ids":{"openalex":"https://openalex.org/W3015439375","doi":"https://doi.org/10.1109/isscc19947.2020.9062924","mag":"3015439375"},"language":"en","primary_location":{"id":"doi:10.1109/isscc19947.2020.9062924","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc19947.2020.9062924","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Solid- State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100601077","display_name":"Hyunchul Kim","orcid":"https://orcid.org/0000-0002-8006-9504"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"HyunChul Kim","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101701221","display_name":"Jong\u2010Eun Park","orcid":"https://orcid.org/0000-0002-5108-2881"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jongeun Park","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085410198","display_name":"In-Sung Joe","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Insung Joe","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078042616","display_name":"Doowon Kwon","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Doowon Kwon","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046791700","display_name":"Joo Hyoung Kim","orcid":"https://orcid.org/0000-0002-4893-3761"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joo Hyoung Kim","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065851754","display_name":"Cho Dongsuk","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dongsuk Cho","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100624384","display_name":"Taehun Lee","orcid":"https://orcid.org/0000-0002-5435-5910"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taehun Lee","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101695646","display_name":"Changkyu Lee","orcid":"https://orcid.org/0009-0000-0538-1568"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Changkyu Lee","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027729360","display_name":"Haeyong Park","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Haeyong Park","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021672018","display_name":"Soojin Hong","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Soojin Hong","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102390832","display_name":"Chongkwang Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Chongkwang Chang","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040634937","display_name":"Jin\u2010Gyun Kim","orcid":"https://orcid.org/0000-0002-2146-7609"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jingyun Kim","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081465224","display_name":"Hanjin Lim","orcid":"https://orcid.org/0000-0003-4171-6622"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hanjin Lim","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080576369","display_name":"Youngsun Oh","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youngsun Oh","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yitae Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yitae Kim","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071568561","display_name":"Seungjoo Nah","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seungjoo Nah","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101084801","display_name":"Jung Sangill","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sangill Jung","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102811223","display_name":"Jae-Kyu Lee","orcid":"https://orcid.org/0000-0001-8437-041X"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaekyu Lee","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102604026","display_name":"JungChak Ahn","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JungChak Ahn","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086909882","display_name":"Hyeongsun Hong","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyeongsun Hong","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103702433","display_name":"Kyupil Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kyupil Lee","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110081101","display_name":"Ho-Kyu Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ho-Kyu Kang","raw_affiliation_strings":["Samsung Electronics, Hwaseong, Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, Korea","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":22,"corresponding_author_ids":["https://openalex.org/A5100601077"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":2.1841,"has_fulltext":false,"cited_by_count":33,"citation_normalized_percentile":{"value":0.8783402,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"104","last_page":"106"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12153","display_name":"Advanced Optical Sensing Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/pixel","display_name":"Pixel","score":0.883972704410553},{"id":"https://openalex.org/keywords/image-sensor","display_name":"Image sensor","score":0.5921056270599365},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5669206976890564},{"id":"https://openalex.org/keywords/shallow-trench-isolation","display_name":"Shallow trench isolation","score":0.5466625094413757},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5249124765396118},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.518592357635498},{"id":"https://openalex.org/keywords/photodiode","display_name":"Photodiode","score":0.5049715638160706},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.49267202615737915},{"id":"https://openalex.org/keywords/display-resolution","display_name":"Display resolution","score":0.43582600355148315},{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.3940568268299103},{"id":"https://openalex.org/keywords/computer-graphics","display_name":"Computer graphics (images)","score":0.36620384454727173},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3576398491859436},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27000272274017334},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.26044750213623047},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.19778302311897278},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16517305374145508},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.16177764534950256},{"id":"https://openalex.org/keywords/display-device","display_name":"Display device","score":0.16071224212646484}],"concepts":[{"id":"https://openalex.org/C160633673","wikidata":"https://www.wikidata.org/wiki/Q355198","display_name":"Pixel","level":2,"score":0.883972704410553},{"id":"https://openalex.org/C76935873","wikidata":"https://www.wikidata.org/wiki/Q209121","display_name":"Image sensor","level":2,"score":0.5921056270599365},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5669206976890564},{"id":"https://openalex.org/C105066941","wikidata":"https://www.wikidata.org/wiki/Q1424524","display_name":"Shallow trench isolation","level":4,"score":0.5466625094413757},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5249124765396118},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.518592357635498},{"id":"https://openalex.org/C751236","wikidata":"https://www.wikidata.org/wiki/Q175943","display_name":"Photodiode","level":2,"score":0.5049715638160706},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.49267202615737915},{"id":"https://openalex.org/C71597744","wikidata":"https://www.wikidata.org/wiki/Q12538706","display_name":"Display resolution","level":3,"score":0.43582600355148315},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.3940568268299103},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.36620384454727173},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3576398491859436},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27000272274017334},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.26044750213623047},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.19778302311897278},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16517305374145508},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.16177764534950256},{"id":"https://openalex.org/C164597639","wikidata":"https://www.wikidata.org/wiki/Q327065","display_name":"Display device","level":2,"score":0.16071224212646484},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc19947.2020.9062924","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc19947.2020.9062924","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Solid- State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.44999998807907104,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1997913942","https://openalex.org/W2033901409","https://openalex.org/W2045501150","https://openalex.org/W2133789320","https://openalex.org/W2774118109","https://openalex.org/W2792301974"],"related_works":["https://openalex.org/W2006928005","https://openalex.org/W2119814266","https://openalex.org/W2749871982","https://openalex.org/W2104314732","https://openalex.org/W2140756430","https://openalex.org/W2188624265","https://openalex.org/W1992381812","https://openalex.org/W1869246841","https://openalex.org/W2006469970","https://openalex.org/W1507517533"],"abstract_inverted_index":{"As":[0],"the":[1,10],"smart":[2],"mobile":[3,30],"device":[4,15,31],"market":[5],"continues":[6],"to":[7,90,131,163],"grow":[8],"and":[9,47,77,101,138,150],"number":[11],"of":[12,83,122],"cameras":[13,32,60,70,85],"per":[14],"rapidly":[16],"increases,":[17],"demand":[18],"for":[19,51],"CMOS":[20],"image":[21,53],"sensors":[22],"(CIS)":[23],"also":[24,171],"increases.":[25],"Two":[26],"major":[27],"trends":[28],"in":[29,115],"are:":[33],"(1)":[34],"adopting":[35],"smaller":[36,65,76],"pixels":[37,50,183],"that":[38],"enable":[39],"greater":[40,112],"pixel":[41,113,123],"count":[42,114],"at":[43],"similar":[44],"optical":[45,81,142,151],"format,":[46],"(2)":[48],"bigger":[49,78],"higher":[52,98],"quality.":[54],"To":[55,110,145],"be":[56],"more":[57],"specific,":[58],"front-facing":[59,84],"have":[61,71],"a":[62,72,116,178],"trend":[63,73],"towards":[64,74],"pixels,":[66],"while":[67,140],"rear":[68],"main":[69,128],"both":[75,148],"pixels.":[79],"The":[80,127],"format":[82],"is":[86,108,125,170,187],"especially":[87],"limited":[88,117],"due":[89],"existing":[91],"bezel-less":[92],"or":[93],"border-less":[94],"display":[95],"designs,":[96],"yet":[97],"resolution":[99],"still-shot":[100],"video":[102],"(such":[103],"as":[104],"4K":[105],"UHD)":[106],"recording":[107],"desired.":[109],"implement":[111],"camera":[118],"module":[119],"size,":[120],"scaling":[121],"size":[124],"required.":[126],"challenges":[129],"are":[130],"maintain":[132],"acceptable":[133],"photodiode":[134],"full-well":[135],"capacity":[136],"(FWC)":[137],"sensitivity,":[139],"suppressing":[141],"crosstalk":[143],"[1].":[144],"completely":[146],"eliminate":[147],"electrical":[149],"crosstalk,":[152],"deep-trench":[153],"isolation":[154],"(DTI)":[155],"has":[156],"evolved":[157],"from":[158],"early":[159],"BDTI":[160],"(Back-side":[161],"DTI)":[162,167],"current":[164],"FDTI":[165],"(Front-side":[166],"technology,":[168],"which":[169],"called":[172],"full-depth":[173,185],"DTI.":[174],"In":[175],"this":[176],"paper,":[177],"44Mpixel":[179],"CIS":[180],"with":[181],"0.7\u03bcm":[182],"using":[184],"DTI":[186],"demonstrated.":[188]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":10},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":7},{"year":2021,"cited_by_count":7},{"year":2020,"cited_by_count":2}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}