{"id":"https://openalex.org/W2789835581","doi":"https://doi.org/10.1109/isscc.2018.8310181","title":"A 2\u00d720W 0.0013% THD+N Class-D audio amplifier with consistent performance up to maximum power level","display_name":"A 2\u00d720W 0.0013% THD+N Class-D audio amplifier with consistent performance up to maximum power level","publication_year":2018,"publication_date":"2018-02-01","ids":{"openalex":"https://openalex.org/W2789835581","doi":"https://doi.org/10.1109/isscc.2018.8310181","mag":"2789835581"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2018.8310181","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2018.8310181","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE International Solid - State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085301475","display_name":"Eric Cope","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Eric Cope","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016890125","display_name":"Julian Aschieri","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Julian Aschieri","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027545310","display_name":"Tony Lai","orcid":"https://orcid.org/0000-0001-9761-0072"},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tony Lai","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058152415","display_name":"Franklin Zhao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Franklin Zhao","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016228478","display_name":"Walter Grandfield","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Walter Grandfield","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067944293","display_name":"Michael Clifford","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Clifford","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060515093","display_name":"Pete Rathfelder","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pete Rathfelder","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100735687","display_name":"Qiyuan Liu","orcid":"https://orcid.org/0000-0001-5605-3409"},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Qiyuan Liu","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059254668","display_name":"Siddartha Kavilipati","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Siddartha Kavilipati","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010520931","display_name":"Aaron Vandergriff","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aaron Vandergriff","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5046818068","display_name":"Gerald Miaille","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gerald Miaille","raw_affiliation_strings":["Qualcomm, Tempe, AZ"],"affiliations":[{"raw_affiliation_string":"Qualcomm, Tempe, AZ","institution_ids":["https://openalex.org/I4210087596"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":11,"corresponding_author_ids":["https://openalex.org/A5085301475"],"corresponding_institution_ids":["https://openalex.org/I4210087596"],"apc_list":null,"apc_paid":null,"fwci":0.8717,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.70937495,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"49","issue":null,"first_page":"56","last_page":"58"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11248","display_name":"Advanced Power Amplifier Design","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/amplifier","display_name":"Amplifier","score":0.756737470626831},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6301087141036987},{"id":"https://openalex.org/keywords/audio-power-amplifier","display_name":"Audio power amplifier","score":0.5535424947738647},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5034787058830261},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3373742699623108},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20718011260032654},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.16195321083068848},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.13996180891990662}],"concepts":[{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.756737470626831},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6301087141036987},{"id":"https://openalex.org/C131289371","wikidata":"https://www.wikidata.org/wiki/Q27094","display_name":"Audio power amplifier","level":4,"score":0.5535424947738647},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5034787058830261},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3373742699623108},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20718011260032654},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.16195321083068848},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.13996180891990662}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2018.8310181","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2018.8310181","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE International Solid - State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8399999737739563,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1985184250","https://openalex.org/W2051651485","https://openalex.org/W2593218813","https://openalex.org/W6646589973","https://openalex.org/W6663417932"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W3093253184","https://openalex.org/W2053214877","https://openalex.org/W2135814299","https://openalex.org/W2560037639","https://openalex.org/W2966333412","https://openalex.org/W1500356083","https://openalex.org/W2917354759","https://openalex.org/W26247187"],"abstract_inverted_index":{"Conventional":[0,61],"Class-D":[1,37,46,147],"amplifiers,":[2,9],"although":[3],"more":[4],"power":[5,25,53,176],"efficient":[6],"than":[7],"Class-AB":[8],"typically":[10],"do":[11],"not":[12],"deliver":[13],"the":[14,23,29,49,52,67,77,82,100,108,112,124,128,136,139,166,174],"same":[15],"audio":[16,78],"quality.":[17],"The":[18],"non-ideal":[19],"switching":[20],"behavior":[21],"of":[22,36,51,96,99,138,156,162],"output":[24,69,126],"stages":[26],"can":[27],"degrade":[28],"linearity,":[30],"noise":[31],"and":[32,56,70,103],"power-supply-rejection-ratio":[33],"(PSRR)":[34],"performance":[35,59,171],"amplifiers":[38,47,54,64,90],"if":[39],"employed":[40],"in":[41,81,107,127],"open-loop":[42],"configurations":[43],"[1].":[44],"Closed-loop":[45],"shape":[48],"non-idealities":[50,133],"(PAs)":[55],"provide":[57],"improved":[58,97],"[2].":[60],"analog":[62,83],"feedback":[63,89,129],"(AFAs)":[65],"sense":[66],"PA":[68,125],"feed":[71],"it":[72],"back":[73],"to":[74,122,168,173],"compare":[75],"with":[76,86,94,152],"input":[79],"signal":[80],"domain.":[84,110],"Compared":[85],"AFAs,":[87],"digital":[88,109,148],"(DFAs)":[91],"have":[92],"emerged":[93],"benefits":[95],"control":[98],"loop":[101],"filter":[102],"pulse-width":[104],"modulation":[105],"(PWM)":[106],"However,":[111],"DFA":[113],"architecture":[114],"usually":[115],"demands":[116],"a":[117,145,153],"high-performance":[118],"analog-to-digital":[119],"converter":[120],"(ADC)":[121],"digitize":[123],"path;":[130],"This":[131],"ADC's":[132],"may":[134],"become":[135],"bottleneck":[137],"system":[140],"[3].":[141],"In":[142],"this":[143],"paper,":[144],"2-channel":[146],"error-feedback":[149],"amplifier":[150],"(DEFA)":[151],"peak":[154],"THD+N":[155],"0.0013%":[157],"is":[158],"presented.":[159],"A":[160],"series":[161],"proposed":[163],"techniques":[164],"enable":[165],"DEFA":[167],"maintain":[169],"its":[170],"up":[172],"maximum":[175],"level":[177],"available.":[178]},"counts_by_year":[{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":6},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}