{"id":"https://openalex.org/W2291976223","doi":"https://doi.org/10.1109/isscc.2016.7417967","title":"10.1 A pin-efficient 20.83Gb/s/wire 0.94pJ/bit forwarded clock CNRZ-5-coded SerDes up to 12mm for MCM packages in 28nm CMOS","display_name":"10.1 A pin-efficient 20.83Gb/s/wire 0.94pJ/bit forwarded clock CNRZ-5-coded SerDes up to 12mm for MCM packages in 28nm CMOS","publication_year":2016,"publication_date":"2016-01-01","ids":{"openalex":"https://openalex.org/W2291976223","doi":"https://doi.org/10.1109/isscc.2016.7417967","mag":"2291976223"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2016.7417967","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2016.7417967","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://infoscience.epfl.ch/record/223393","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058641647","display_name":"Amin Shokrollahi","orcid":"https://orcid.org/0000-0001-7938-7022"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Amin Shokrollahi","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025489660","display_name":"Dario Albino Carnelli","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dario Carnelli","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061122211","display_name":"John Fox","orcid":null},"institutions":[{"id":"https://openalex.org/I35870678","display_name":"University of Northampton","ror":"https://ror.org/04jp2hx10","country_code":"GB","type":"education","lineage":["https://openalex.org/I35870678"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"John Fox","raw_affiliation_strings":["Kandou Bus, Northampton, United Kingdom"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Northampton, United Kingdom","institution_ids":["https://openalex.org/I35870678"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079645522","display_name":"Klaas L. Hofstra","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Klaas Hofstra","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081871177","display_name":"Brian Holden","orcid":"https://orcid.org/0000-0002-5633-6107"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Brian Holden","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085950460","display_name":"Ali Hormati","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ali Hormati","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069886531","display_name":"P.C. Hunt","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Peter Hunt","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112051857","display_name":"Margaret J. Johnston","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Margaret Johnston","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064909701","display_name":"John Keay","orcid":null},"institutions":[{"id":"https://openalex.org/I35870678","display_name":"University of Northampton","ror":"https://ror.org/04jp2hx10","country_code":"GB","type":"education","lineage":["https://openalex.org/I35870678"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"John Keay","raw_affiliation_strings":["Kandou Bus, Northampton, United Kingdom"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Northampton, United Kingdom","institution_ids":["https://openalex.org/I35870678"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054933881","display_name":"Sergio Pesenti","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Sergio Pesenti","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089407916","display_name":"R. S. Simpson","orcid":null},"institutions":[{"id":"https://openalex.org/I35870678","display_name":"University of Northampton","ror":"https://ror.org/04jp2hx10","country_code":"GB","type":"education","lineage":["https://openalex.org/I35870678"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Richard Simpson","raw_affiliation_strings":["Kandou Bus, Northampton, United Kingdom"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Northampton, United Kingdom","institution_ids":["https://openalex.org/I35870678"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033352663","display_name":"D. Stauffer","orcid":"https://orcid.org/0000-0002-3812-6464"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"David Stauffer","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085286244","display_name":"Andrew Stewart","orcid":null},"institutions":[{"id":"https://openalex.org/I35870678","display_name":"University of Northampton","ror":"https://ror.org/04jp2hx10","country_code":"GB","type":"education","lineage":["https://openalex.org/I35870678"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Andrew Stewart","raw_affiliation_strings":["Kandou Bus, Northampton, United Kingdom"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Northampton, United Kingdom","institution_ids":["https://openalex.org/I35870678"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031665355","display_name":"Giuseppe Surace","orcid":null},"institutions":[{"id":"https://openalex.org/I35870678","display_name":"University of Northampton","ror":"https://ror.org/04jp2hx10","country_code":"GB","type":"education","lineage":["https://openalex.org/I35870678"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Giuseppe Surace","raw_affiliation_strings":["Kandou Bus, Northampton, United Kingdom"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Northampton, United Kingdom","institution_ids":["https://openalex.org/I35870678"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052867620","display_name":"Armin Tajalli","orcid":"https://orcid.org/0000-0002-0222-3561"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Armin Tajalli","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074135138","display_name":"Omid Talebi Amiri","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Omid Talebi Amiri","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039508446","display_name":"Anton Tschank","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Anton Tschank","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104042685","display_name":"Roger Ulrich","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Roger Ulrich","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039544789","display_name":"Christoph Walter","orcid":"https://orcid.org/0000-0003-2714-3725"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Christoph Walter","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017408277","display_name":"Fabio Licciardello","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Fabio Licciardello","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049726741","display_name":"Yohann Mogentale","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yohann Mogentale","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111905760","display_name":"Anant Singh","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Anant Singh","raw_affiliation_strings":["Kandou Bus, Lausanne, Switzerland"],"affiliations":[{"raw_affiliation_string":"Kandou Bus, Lausanne, Switzerland","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":22,"corresponding_author_ids":["https://openalex.org/A5058641647"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.3077,"has_fulltext":false,"cited_by_count":55,"citation_normalized_percentile":{"value":0.92402976,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"182","last_page":"183"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9855999946594238,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/serdes","display_name":"SerDes","score":0.9210543632507324},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.8020534515380859},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.7253650426864624},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6406784057617188},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5817660689353943},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.5318065881729126},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.5309963226318359},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.47272080183029175},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45927247405052185},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4384115934371948},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.4380406439304352},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4218823313713074},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.41705191135406494},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3381926417350769},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.32455164194107056},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3005964159965515},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.2006310522556305},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1618521511554718},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.12542623281478882}],"concepts":[{"id":"https://openalex.org/C19707634","wikidata":"https://www.wikidata.org/wiki/Q6510662","display_name":"SerDes","level":2,"score":0.9210543632507324},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.8020534515380859},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.7253650426864624},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6406784057617188},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5817660689353943},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5318065881729126},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.5309963226318359},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47272080183029175},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45927247405052185},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4384115934371948},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4380406439304352},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4218823313713074},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.41705191135406494},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3381926417350769},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.32455164194107056},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3005964159965515},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.2006310522556305},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1618521511554718},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12542623281478882},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isscc.2016.7417967","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2016.7417967","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","raw_type":"proceedings-article"},{"id":"pmh:oai:infoscience.epfl.ch:223393","is_oa":true,"landing_page_url":"http://infoscience.epfl.ch/record/223393","pdf_url":null,"source":{"id":"https://openalex.org/S4306400487","display_name":"Infoscience (Ecole Polytechnique F\u00e9d\u00e9rale de Lausanne)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Text"}],"best_oa_location":{"id":"pmh:oai:infoscience.epfl.ch:223393","is_oa":true,"landing_page_url":"http://infoscience.epfl.ch/record/223393","pdf_url":null,"source":{"id":"https://openalex.org/S4306400487","display_name":"Infoscience (Ecole Polytechnique F\u00e9d\u00e9rale de Lausanne)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Text"},"sustainable_development_goals":[{"score":0.5699999928474426,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320307791","display_name":"Cisco Systems","ror":"https://ror.org/03yt1ez60"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1982388664","https://openalex.org/W2101132714","https://openalex.org/W2144558071","https://openalex.org/W2169403445","https://openalex.org/W2285290242"],"related_works":["https://openalex.org/W2048019328","https://openalex.org/W2130047965","https://openalex.org/W3145088891","https://openalex.org/W3087888791","https://openalex.org/W2957422867","https://openalex.org/W3160420002","https://openalex.org/W2382232495","https://openalex.org/W2734818042","https://openalex.org/W3048212214","https://openalex.org/W2131433104"],"abstract_inverted_index":{"High-speed":[0],"signaling":[1,113,136],"over":[2],"package":[3],"substrates":[4,76],"is":[5,114,119,150,156],"key":[6],"to":[7,25,36,44,125,139],"delivering":[8],"the":[9],"promise":[10],"of":[11,22,33,52,130,141,148],"2.5D":[12],"integration.":[13],"Applications":[14],"abound":[15],"and":[16,28,60,86,95,127,145],"include":[17],"high-density":[18,84],"memory":[19],"interfaces,":[20],"sub-division":[21,32],"large":[23],"dies":[24],"increase":[26],"yield":[27],"lower":[29],"development":[30],"time,":[31],"a":[34,67,128,146],"die":[35],"achieve":[37],"upward":[38],"or":[39,42,48,78],"downward":[40],"scalability,":[41],"connecting":[43],"an":[45],"off-chip":[46],"SerDes":[47],"optics":[49],"engine.":[50],"Each":[51],"these":[53],"in-package":[54],"applications":[55],"typically":[56],"has":[57],"high":[58,93],"throughput":[59],"onerously":[61],"low":[62,87],"power":[63,88],"constraints":[64],"along":[65],"with":[66],"low-loss":[68],"channel.":[69],"Several":[70],"solutions":[71],"have":[72],"been":[73],"proposed.":[74],"Interposer":[75],"[1],":[77],"Chip-on-Substrate-on-Wafer":[79],"[2]":[80],"allow":[81],"for":[82,101,121],"very":[83],"wiring":[85],"using":[89,109,134],"CMOS":[90],"transceivers.":[91],"Their":[92],"manufacturing":[94],"testing":[96],"cost":[97],"makes":[98],"them":[99],"prohibitive":[100],"anything":[102],"but":[103],"high-end":[104],"applications.":[105],"A":[106,154],"different":[107],"approach":[108,133],"high-speed":[110],"ground-referenced":[111],"single-ended":[112],"reported":[115,151],"in":[116,152,158],"[3],":[117],"which":[118],"intended":[120],"shorter":[122],"channels":[123],"up":[124,138],"4.5mm":[126],"BER":[129,147],"1e-12.":[131],"An":[132],"differential":[135],"on":[137],"0.75\"":[140],"Megtron":[142],"6":[143],"material":[144],"1e-9":[149],"[4].":[153],"comparison":[155],"given":[157],"Fig.":[159],"10.1.1.":[160]},"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":14},{"year":2020,"cited_by_count":8},{"year":2019,"cited_by_count":6},{"year":2018,"cited_by_count":8},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}