{"id":"https://openalex.org/W4248716645","doi":"https://doi.org/10.1109/isscc.2013.6487789","title":"A 0.54pJ/b 20Gb/s ground-referenced single-ended short-haul serial link in 28nm CMOS for advanced packaging applications","display_name":"A 0.54pJ/b 20Gb/s ground-referenced single-ended short-haul serial link in 28nm CMOS for advanced packaging applications","publication_year":2013,"publication_date":"2013-02-01","ids":{"openalex":"https://openalex.org/W4248716645","doi":"https://doi.org/10.1109/isscc.2013.6487789"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2013.6487789","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487789","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5087355604","display_name":"John W. Poulton","orcid":"https://orcid.org/0000-0002-1722-7637"},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. W. Poulton","raw_affiliation_strings":["Nvidia, Durham, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nvidia, Durham, NC, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084342236","display_name":"William J. Dally","orcid":"https://orcid.org/0000-0003-4632-2876"},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W. J. Dally","raw_affiliation_strings":["Nvidia, Santa Clara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nvidia, Santa Clara, CA, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100329931","display_name":"Xi Chen","orcid":"https://orcid.org/0000-0002-3135-4114"},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xi Chen","raw_affiliation_strings":["Nvidia, Santa Clara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nvidia, Santa Clara, CA, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072213924","display_name":"John Eyles","orcid":null},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. G. Eyles","raw_affiliation_strings":["Nvidia, Durham, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nvidia, Durham, NC, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109172662","display_name":"Thomas H. Greer","orcid":null},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. H. Greer","raw_affiliation_strings":["Nvidia, Durham, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nvidia, Durham, NC, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102966476","display_name":"Stephen G. Tell","orcid":"https://orcid.org/0000-0002-2166-1452"},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. G. Tell","raw_affiliation_strings":["Nvidia, Durham, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nvidia, Durham, NC, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5069026297","display_name":"C. Thomas Gray","orcid":"https://orcid.org/0000-0002-5137-5617"},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. T. Gray","raw_affiliation_strings":["Nvidia, Durham, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nvidia, Durham, NC, USA","institution_ids":["https://openalex.org/I4210127875"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210127875"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":29,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"404","last_page":"405"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.836927056312561},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.6428834199905396},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6204394698143005},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6072567701339722},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5924026966094971},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5815786123275757},{"id":"https://openalex.org/keywords/package-on-package","display_name":"Package on package","score":0.5300272107124329},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5051057934761047},{"id":"https://openalex.org/keywords/transmitter","display_name":"Transmitter","score":0.4933399260044098},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.4921859800815582},{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.43879976868629456},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4253579080104828},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.3573375344276428},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25330865383148193},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2119859755039215},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.19076085090637207},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.11677354574203491}],"concepts":[{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.836927056312561},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.6428834199905396},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6204394698143005},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6072567701339722},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5924026966094971},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5815786123275757},{"id":"https://openalex.org/C184788189","wikidata":"https://www.wikidata.org/wiki/Q130652","display_name":"Package on package","level":4,"score":0.5300272107124329},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5051057934761047},{"id":"https://openalex.org/C47798520","wikidata":"https://www.wikidata.org/wiki/Q190157","display_name":"Transmitter","level":3,"score":0.4933399260044098},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.4921859800815582},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.43879976868629456},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4253579080104828},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.3573375344276428},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25330865383148193},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2119859755039215},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.19076085090637207},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.11677354574203491},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2013.6487789","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487789","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8199999928474426,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2020711756","https://openalex.org/W2058075984","https://openalex.org/W2142850400","https://openalex.org/W2166984288"],"related_works":["https://openalex.org/W2319086470","https://openalex.org/W2263926683","https://openalex.org/W2539834997","https://openalex.org/W1999811912","https://openalex.org/W4234040762","https://openalex.org/W1891490252","https://openalex.org/W2002099348","https://openalex.org/W1997600377","https://openalex.org/W1983742508","https://openalex.org/W4385893391"],"abstract_inverted_index":{"Laminated":[0],"packages,":[1],"silicon":[2,14],"interposer":[3],"substrates,":[4],"and":[5,25,48,66],"special-purpose":[6],"package-to-package":[7],"interconnect,":[8],"together":[9],"with":[10,18,61],"3D":[11],"stacking":[12],"of":[13],"components":[15],"enable":[16],"systems":[17],"greatly":[19],"improved":[20],"computational":[21],"power,":[22],"memory":[23],"capacity":[24],"bandwidth.":[26],"These":[27],"package":[28,60],"options":[29],"offer":[30],"very":[31],"high-bandwidth":[32],"channels":[33],"between":[34,55],"chips":[35,57],"on":[36,58],"the":[37],"same":[38],"substrate.":[39],"We":[40],"employ":[41],"ground-referenced":[42],"single-ended":[43],"signaling,":[44],"a":[45,49],"charge-pump":[46],"transmitter,":[47],"co-designed":[50],"channel":[51],"to":[52],"provide":[53],"communication":[54],"multiple":[56],"one":[59],"high":[62],"bandwidth":[63],"per":[64,69],"pin":[65],"low":[67],"energy":[68],"bit.":[70]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":3}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}