{"id":"https://openalex.org/W2014929828","doi":"https://doi.org/10.1109/isscc.2013.6487620","title":"Continuing to shrink: Next-generation lithography - Progress and prospects","display_name":"Continuing to shrink: Next-generation lithography - Progress and prospects","publication_year":2013,"publication_date":"2013-02-01","ids":{"openalex":"https://openalex.org/W2014929828","doi":"https://doi.org/10.1109/isscc.2013.6487620","mag":"2014929828"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2013.6487620","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487620","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112988429","display_name":"M. van den Brink","orcid":null},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I4210122849","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":true,"raw_author_name":"M. van den Brink","raw_affiliation_strings":["ASML, Veldhoven, Netherlands","ASML, Veldhoven, Netherlands#TAB#"],"affiliations":[{"raw_affiliation_string":"ASML, Veldhoven, Netherlands","institution_ids":["https://openalex.org/I927257375"]},{"raw_affiliation_string":"ASML, Veldhoven, Netherlands#TAB#","institution_ids":["https://openalex.org/I927257375"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5112988429"],"corresponding_institution_ids":["https://openalex.org/I927257375"],"apc_list":null,"apc_paid":null,"fwci":0.9609,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.7827166,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"8326","issue":null,"first_page":"20","last_page":"25"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.8895000219345093,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.8895000219345093,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.819599986076355,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/extreme-ultraviolet-lithography","display_name":"Extreme ultraviolet lithography","score":0.9148027300834656},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.806876540184021},{"id":"https://openalex.org/keywords/immersion-lithography","display_name":"Immersion lithography","score":0.7934221625328064},{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.5750369429588318},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5739925503730774},{"id":"https://openalex.org/keywords/next-generation-lithography","display_name":"Next-generation lithography","score":0.5703374147415161},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4977893829345703},{"id":"https://openalex.org/keywords/computational-lithography","display_name":"Computational lithography","score":0.4939125180244446},{"id":"https://openalex.org/keywords/cost-reduction","display_name":"Cost reduction","score":0.48768413066864014},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.4513019621372223},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.42579221725463867},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.423349529504776},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3943692743778229},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.3605836033821106},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.33602458238601685},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.3197757601737976},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3144465684890747},{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.21226471662521362},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.20812109112739563},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.1904352307319641}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.9148027300834656},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.806876540184021},{"id":"https://openalex.org/C94263209","wikidata":"https://www.wikidata.org/wiki/Q1076175","display_name":"Immersion lithography","level":4,"score":0.7934221625328064},{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.5750369429588318},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5739925503730774},{"id":"https://openalex.org/C163581340","wikidata":"https://www.wikidata.org/wiki/Q1983848","display_name":"Next-generation lithography","level":5,"score":0.5703374147415161},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4977893829345703},{"id":"https://openalex.org/C182873914","wikidata":"https://www.wikidata.org/wiki/Q5157329","display_name":"Computational lithography","level":5,"score":0.4939125180244446},{"id":"https://openalex.org/C2778820799","wikidata":"https://www.wikidata.org/wiki/Q3454688","display_name":"Cost reduction","level":2,"score":0.48768413066864014},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.4513019621372223},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.42579221725463867},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.423349529504776},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3943692743778229},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3605836033821106},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.33602458238601685},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.3197757601737976},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3144465684890747},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.21226471662521362},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.20812109112739563},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.1904352307319641},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2013.6487620","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487620","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1990718413","https://openalex.org/W2156035604","https://openalex.org/W2162517322","https://openalex.org/W6682823878"],"related_works":["https://openalex.org/W2115795789","https://openalex.org/W1967752359","https://openalex.org/W1991236041","https://openalex.org/W2025251804","https://openalex.org/W2606576291","https://openalex.org/W2032413298","https://openalex.org/W1975854055","https://openalex.org/W1988961408","https://openalex.org/W2062836254","https://openalex.org/W2023112358"],"abstract_inverted_index":{"Chip":[0],"makers":[1],"are":[2],"increasingly":[3],"concerned":[4],"about":[5],"the":[6],"shrink":[7],"and":[8],"cost.":[9],"This":[10],"concern":[11],"drives":[12],"different":[13,17],"lithography":[14],"solutions":[15],"for":[16],"products.":[18],"Two":[19],"major":[20],"trends":[21],"can":[22],"be":[23,38],"observed:":[24],"aggressive":[25,30],"adoption":[26],"of":[27,32],"EUV,":[28],"or":[29],"extension":[31],"immersion.":[33],"Further":[34],"cost":[35],"reduction":[36],"could":[37],"achieved":[39],"by":[40],"introducing":[41],"450mm":[42],"wafers.":[43]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}