{"id":"https://openalex.org/W2054262942","doi":"https://doi.org/10.1109/isscc.2013.6487605","title":"F6: Mixed-signal/RF design and modeling in next-generation CMOS","display_name":"F6: Mixed-signal/RF design and modeling in next-generation CMOS","publication_year":2013,"publication_date":"2013-02-01","ids":{"openalex":"https://openalex.org/W2054262942","doi":"https://doi.org/10.1109/isscc.2013.6487605","mag":"2054262942"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2013.6487605","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487605","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5029806914","display_name":"Boris Murmann","orcid":"https://orcid.org/0000-0003-3417-8782"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"B. Murmann","raw_affiliation_strings":["Stanford University Stanford, CA","Stanford University Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Stanford University Stanford, CA","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"Stanford University Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030960326","display_name":"Jafar Savoj","orcid":null},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Savoj","raw_affiliation_strings":["Xilinx, San Jose, CA","Xilinx, San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Xilinx, San Jose, CA","institution_ids":["https://openalex.org/I32923980"]},{"raw_affiliation_string":"Xilinx, San Jose, CA, USA","institution_ids":["https://openalex.org/I32923980"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059069030","display_name":"Piet Wambacq","orcid":"https://orcid.org/0000-0003-4388-7257"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I196972281","display_name":"Imec the Netherlands","ror":"https://ror.org/01ezq2j76","country_code":"NL","type":"facility","lineage":["https://openalex.org/I196972281"]}],"countries":["BE","NL"],"is_corresponding":false,"raw_author_name":"P. Wambacq","raw_affiliation_strings":["Imec, Heverlee, Belgium","Imec; Heverlee Belgium"],"affiliations":[{"raw_affiliation_string":"Imec, Heverlee, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec; Heverlee Belgium","institution_ids":["https://openalex.org/I196972281"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036666843","display_name":"Jieh-Tsorng Wu","orcid":"https://orcid.org/0000-0002-1749-4479"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jieh-Tsorng Wu","raw_affiliation_strings":["National Chiao-Tung University, Hsinchu, Taiwan","National Chiao\u2013Tung University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Chiao-Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"National Chiao\u2013Tung University, Hsinchu, Taiwan","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":4,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5029806914"],"corresponding_institution_ids":["https://openalex.org/I97018004"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.11295865,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"510","last_page":"511"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5777906179428101},{"id":"https://openalex.org/keywords/rfic","display_name":"RFIC","score":0.5718233585357666},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.531360387802124},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5099002122879028},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.487781822681427},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.4591403007507324},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.44389772415161133},{"id":"https://openalex.org/keywords/radio-frequency","display_name":"Radio frequency","score":0.4400542378425598},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.4224383234977722},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.42091917991638184},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3792749047279358},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3643217980861664},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3294585347175598},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.3102887272834778},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.25187766551971436}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5777906179428101},{"id":"https://openalex.org/C121152627","wikidata":"https://www.wikidata.org/wiki/Q6095735","display_name":"RFIC","level":3,"score":0.5718233585357666},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.531360387802124},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5099002122879028},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.487781822681427},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.4591403007507324},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.44389772415161133},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.4400542378425598},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.4224383234977722},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.42091917991638184},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3792749047279358},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3643217980861664},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3294585347175598},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.3102887272834778},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.25187766551971436},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2013.6487605","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487605","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4699999988079071,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2119240643","https://openalex.org/W2788887112","https://openalex.org/W2167191969","https://openalex.org/W2152560746","https://openalex.org/W4292862890","https://openalex.org/W2115196315","https://openalex.org/W2133496617","https://openalex.org/W2329802956","https://openalex.org/W2067164191","https://openalex.org/W2540076842"],"abstract_inverted_index":{"Technology":[0],"awareness":[1],"and":[2,11,22,34,47,60,88,160],"modeling":[3,129,144],"is":[4,146],"important":[5,28],"in":[6,30,36,108,122,137],"all":[7],"areas":[8],"of":[9,27,69,143],"mixed-signal":[10],"RF":[12,110],"design.":[13],"This":[14],"forum":[15],"intends":[16],"to":[17,98],"provide":[18],"a":[19,25,116],"holistic":[20],"overview":[21],"discussion":[23],"spanning":[24],"variety":[26],"topics":[29],"device":[31],"modeling,":[32],"reliability":[33],"simulation":[35],"next-generation":[37],"CMOS.":[38],"It":[39],"begins":[40],"with":[41],"an":[42],"analog/RF-centric":[43],"comparison":[44],"between":[45],"FinFET":[46],"ultra-thin-body":[48],"SOI":[49],"technology.":[50],"The":[51,75],"next":[52,113],"two":[53,67,150],"talks":[54,145],"then":[55],"venture":[56],"into":[57],"bias":[58],"stress":[59],"Electrostatic":[61],"Discharge":[62],"Protection":[63],"(ESD),":[64],"which":[65],"are":[66,135],"issues":[68],"ever-increasing":[70],"importance":[71],"for":[72,119],"future":[73,117],"scaling.":[74],"fourth":[76],"presentation":[77],"discusses":[78],"the":[79,83,99,112,158],"latest":[80],"developments":[81],"surrounding":[82],"popular":[84],"BSIM":[85],"transistor":[86],"model,":[87],"explains":[89],"how":[90],"this":[91,141],"new":[92],"model":[93],"can":[94],"be":[95],"efficiently":[96],"coupled":[97],"analog/RF":[100],"design":[101],"process.":[102],"Motivated":[103],"by":[104,149],"their":[105],"increasing":[106],"significance":[107],"integrated":[109],"transceivers,":[111],"talk":[114],"outlines":[115],"roadmap":[118],"passive":[120],"components":[121,134],"scaled":[123],"technologies.":[124],"Then,":[125],"we":[126],"expand":[127],"upon":[128],"challenges":[130,156],"that":[131,153],"arise":[132],"when":[133],"stacked":[136],"three":[138],"dimensions.":[139],"Finally,":[140],"series":[142],"rounded":[147],"up":[148],"comprehensive":[151],"presentations":[152],"summarize":[154],"key":[155],"from":[157],"foundry":[159],"EDA":[161],"tool":[162],"vendor":[163],"perspectives.":[164]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}