{"id":"https://openalex.org/W2042203182","doi":"https://doi.org/10.1109/isscc.2013.6487598","title":"ES3: High-speed communications on 4 wheels: What's in your next car?","display_name":"ES3: High-speed communications on 4 wheels: What's in your next car?","publication_year":2013,"publication_date":"2013-02-01","ids":{"openalex":"https://openalex.org/W2042203182","doi":"https://doi.org/10.1109/isscc.2013.6487598","mag":"2042203182"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2013.6487598","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487598","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111819598","display_name":"Nicola Da Dalt","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]},{"id":"https://openalex.org/I4210131793","display_name":"Infineon Technologies (Austria)","ror":"https://ror.org/03msng824","country_code":"AT","type":"company","lineage":["https://openalex.org/I137594350","https://openalex.org/I4210131793"]}],"countries":["AT","DE"],"is_corresponding":false,"raw_author_name":"Nicola Da Dalt","raw_affiliation_strings":["Infineon Technologies, Villach, Austria","Infineon Technologies, Villach,Austria"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Villach, Austria","institution_ids":["https://openalex.org/I4210131793"]},{"raw_affiliation_string":"Infineon Technologies, Villach,Austria","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5082643370","display_name":"A. Amerasekera","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ajith Amerasekera","raw_affiliation_strings":["Texas Instruments, Dallas, TX","**Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, TX","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"**Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.24,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.61082454,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"515","last_page":"515"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9847000241279602,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9847000241279602,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9556000232696533,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9402999877929688,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.7161548137664795},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.5191725492477417},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5035642981529236},{"id":"https://openalex.org/keywords/state","display_name":"State (computer science)","score":0.4901729226112366},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.4806167483329773},{"id":"https://openalex.org/keywords/telecommunications-equipment","display_name":"Telecommunications equipment","score":0.46758031845092773},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.4298911690711975},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42037349939346313},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.38312751054763794},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3751735985279083},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.30375581979751587}],"concepts":[{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.7161548137664795},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.5191725492477417},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5035642981529236},{"id":"https://openalex.org/C48103436","wikidata":"https://www.wikidata.org/wiki/Q599031","display_name":"State (computer science)","level":2,"score":0.4901729226112366},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.4806167483329773},{"id":"https://openalex.org/C206034944","wikidata":"https://www.wikidata.org/wiki/Q1780509","display_name":"Telecommunications equipment","level":2,"score":0.46758031845092773},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.4298911690711975},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42037349939346313},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.38312751054763794},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3751735985279083},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.30375581979751587},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2013.6487598","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2013.6487598","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6800000071525574}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4382644535","https://openalex.org/W2522768275","https://openalex.org/W2352938035","https://openalex.org/W2351672553","https://openalex.org/W2373392303","https://openalex.org/W2765894405","https://openalex.org/W1884735063","https://openalex.org/W2372668238","https://openalex.org/W4226126548","https://openalex.org/W2560421750"],"abstract_inverted_index":{"Communications":[0],"inside":[1],"vehicles":[2],"is":[3,26,66,83],"experiencing":[4],"a":[5,84,98],"growing":[6],"demand":[7],"due":[8],"to":[9,87,97,126,135],"emerging":[10],"applications,":[11],"like":[12],"infotainment,":[13],"driver":[14],"assistance,":[15],"safety":[16],"systems":[17],"and":[18,41,72,95,107,112,117,129],"diagnostics,":[19],"requiring":[20],"data-rates":[21],"per":[22,36,47],"channel":[23],"beyond":[24,89],"what":[25,130],"offered":[27],"by":[28,114],"current":[29,91],"solutions.":[30],"The":[31],"number":[32,43],"of":[33,44],"network":[34],"nodes":[35],"car":[37,79,115],"has":[38,54],"steeply":[39],"increased,":[40],"the":[42,51,56,67,73,78,90,122,136],"communication":[45],"ports":[46],"year":[48],"shipped":[49],"for":[50],"automotive":[52],"market":[53],"reached":[55],"650-million":[57],"level":[58],"(Sources:":[59],"IMS,":[60],"SA,":[61],"Gartner).":[62],"Considering":[63],"that":[64],"cabling":[65],"third":[68,74],"highest":[69],"cost":[70],"factor":[71],"heaviest":[75],"component":[76],"in":[77],"(Source:":[80],"IEEE),":[81],"there":[82],"clear":[85],"need":[86],"go":[88],"low":[92],"data-rate":[93,100],"solutions":[94,124],"converge":[96],"high":[99],"backbone":[101],"network.":[102],"Several":[103],"solutions,":[104],"both":[105],"electrical":[106],"optical,":[108],"are":[109,121],"being":[110],"discussed":[111],"proposed":[113],"makers":[116],"silicon":[118],"manufacturers.":[119],"What":[120],"future":[123],"going":[125],"look":[127],"like,":[128],"challenges":[131],"will":[132],"they":[133],"pose":[134],"solid-state":[137],"circuits":[138],"community?":[139]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}