{"id":"https://openalex.org/W2029458782","doi":"https://doi.org/10.1109/isscc.2010.5434011","title":"A wafer-level heterogeneous technology integration for flexible pseudo-SoC","display_name":"A wafer-level heterogeneous technology integration for flexible pseudo-SoC","publication_year":2010,"publication_date":"2010-02-01","ids":{"openalex":"https://openalex.org/W2029458782","doi":"https://doi.org/10.1109/isscc.2010.5434011","mag":"2029458782"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2010.5434011","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2010.5434011","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020096332","display_name":"Hiroshi Yamada","orcid":"https://orcid.org/0000-0001-6678-2701"},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hiroshi Yamada","raw_affiliation_strings":["Toshiba, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Toshiba, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003191933","display_name":"Yutaka Onozuka","orcid":null},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yutaka Onozuka","raw_affiliation_strings":["Toshiba, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Toshiba, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073893781","display_name":"Atsuko Iida","orcid":null},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Atsuko Iida","raw_affiliation_strings":["Toshiba, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Toshiba, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110045173","display_name":"Kazuhiko Itaya","orcid":null},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kazuhiko Itaya","raw_affiliation_strings":["Toshiba, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Toshiba, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111764791","display_name":"Hideyuki Funaki","orcid":null},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hideyuki Funaki","raw_affiliation_strings":["Toshiba, Kawasaki, Japan"],"affiliations":[{"raw_affiliation_string":"Toshiba, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5020096332"],"corresponding_institution_ids":["https://openalex.org/I1292669757"],"apc_list":null,"apc_paid":null,"fwci":0.884,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.76492984,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"146","last_page":"147"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7922235727310181},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.721817135810852},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.6523508429527283},{"id":"https://openalex.org/keywords/system-integration","display_name":"System integration","score":0.49805140495300293},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.49694421887397766},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.49318569898605347},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.49155697226524353},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.47497862577438354},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.46253469586372375},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.45153456926345825},{"id":"https://openalex.org/keywords/process-integration","display_name":"Process integration","score":0.41330739855766296},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3519383668899536},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3233248293399811},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.31801486015319824},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3164355158805847},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22677895426750183},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.15422019362449646},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.0627652108669281}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7922235727310181},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.721817135810852},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.6523508429527283},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.49805140495300293},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.49694421887397766},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.49318569898605347},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.49155697226524353},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.47497862577438354},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.46253469586372375},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.45153456926345825},{"id":"https://openalex.org/C54725748","wikidata":"https://www.wikidata.org/wiki/Q7247277","display_name":"Process integration","level":2,"score":0.41330739855766296},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3519383668899536},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3233248293399811},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.31801486015319824},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3164355158805847},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22677895426750183},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.15422019362449646},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0627652108669281},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2010.5434011","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2010.5434011","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4699999988079071}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2153923914","https://openalex.org/W2511385591","https://openalex.org/W2514942596","https://openalex.org/W6682944299"],"related_works":["https://openalex.org/W2912513337","https://openalex.org/W2263926683","https://openalex.org/W2319086470","https://openalex.org/W2043694425","https://openalex.org/W2089705486","https://openalex.org/W1999811912","https://openalex.org/W2313060948","https://openalex.org/W4234040762","https://openalex.org/W2042694550","https://openalex.org/W1969058128"],"abstract_inverted_index":{"The":[0],"MEMS-LSI":[1,52,108],"integration":[2,53,84,109],"technologies":[3,54],"that":[4,42,88],"have":[5,69],"been":[6,34,70,79],"reported":[7],"are":[8,48],"mainly":[9],"implemented":[10],"for":[11],"monolithic":[12,90],"integrated":[13,91,114],"System":[14,56],"on":[15],"Chip":[16],"(SoC)":[17],"by":[18],"applying":[19,55],"the":[20,40,62,94],"advantages":[21],"of":[22,89,105],"process":[23],"compatibility":[24],"between":[25],"MEMS":[26,43,117],"and":[27,44],"CMOS":[28,46],"LSI":[29],"[1].":[30],"However,":[31,72],"it":[32,76],"has":[33,77],"impossible":[35],"to":[36,65,81,87,111],"integrate":[37],"them":[38],"in":[39,57,101],"case":[41],"standard":[45],"processes":[47],"incompatible.":[49],"Furthermore,":[50],"many":[51],"Package":[58],"(SiP)":[59],"technology":[60,110],"with":[61],"interposer":[63,95],"substrate":[64,96],"realize":[66],"electronics":[67],"devices":[68,118],"reported.":[71],"using":[73],"SiP":[74],"technology,":[75],"not":[78],"possible":[80],"achieve":[82],"high":[83],"density":[85],"comparable":[86],"SoC":[92,115],"because":[93],"occupies":[97],"a":[98],"large":[99],"area":[100],"SiP.":[102],"Accordingly,":[103],"development":[104],"an":[106],"advanced":[107],"realizing":[112],"highly":[113],"incorporating":[116],"is":[119],"required":[120],"[2].":[121]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2012,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}