{"id":"https://openalex.org/W2093067299","doi":"https://doi.org/10.1109/isscc.2010.5433876","title":"ES5: Can RF SoCs (Self)test their own RF?","display_name":"ES5: Can RF SoCs (Self)test their own RF?","publication_year":2010,"publication_date":"2010-02-01","ids":{"openalex":"https://openalex.org/W2093067299","doi":"https://doi.org/10.1109/isscc.2010.5433876","mag":"2093067299"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2010.5433876","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2010.5433876","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027017637","display_name":"Robert Bogdan Staszewski","orcid":"https://orcid.org/0000-0001-9848-1129"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":true,"raw_author_name":"R. Bogdan Staszewski","raw_affiliation_strings":["Delft University of Technology, Delft, The Netherlands","Delft University of Technology, The Netherlands;"],"affiliations":[{"raw_affiliation_string":"Delft University of Technology, Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Delft University of Technology, The Netherlands;","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017961591","display_name":"Jacques C. Rudell","orcid":"https://orcid.org/0000-0002-8531-2999"},"institutions":[{"id":"https://openalex.org/I201448701","display_name":"University of Washington","ror":"https://ror.org/00cvxb145","country_code":"US","type":"education","lineage":["https://openalex.org/I201448701"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jacques C. Rudell","raw_affiliation_strings":["University of Washington, Seattle, WA","University of Washington - Seattle, USA"],"affiliations":[{"raw_affiliation_string":"University of Washington, Seattle, WA","institution_ids":["https://openalex.org/I201448701"]},{"raw_affiliation_string":"University of Washington - Seattle, USA","institution_ids":["https://openalex.org/I201448701"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5027017637"],"corresponding_institution_ids":["https://openalex.org/I98358874"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.14654831,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"530","last_page":"531"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9868000149726868,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/radio-frequency","display_name":"Radio frequency","score":0.5877221822738647},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5373308658599854},{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.5117392539978027},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4797707498073578},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.45538970828056335},{"id":"https://openalex.org/keywords/built-in-self-test","display_name":"Built-in self-test","score":0.4357777237892151},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.41894739866256714},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41218653321266174},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.38587987422943115},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3286447525024414},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.32468295097351074},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.14392510056495667}],"concepts":[{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.5877221822738647},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5373308658599854},{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.5117392539978027},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4797707498073578},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.45538970828056335},{"id":"https://openalex.org/C2780980493","wikidata":"https://www.wikidata.org/wiki/Q181142","display_name":"Built-in self-test","level":2,"score":0.4357777237892151},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.41894739866256714},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41218653321266174},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.38587987422943115},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3286447525024414},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32468295097351074},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.14392510056495667}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2010.5433876","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2010.5433876","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1657880117","https://openalex.org/W2595172197","https://openalex.org/W2127970246","https://openalex.org/W2135248929","https://openalex.org/W2092690310","https://openalex.org/W3190662310","https://openalex.org/W2794767707","https://openalex.org/W1507878993","https://openalex.org/W2798440551","https://openalex.org/W2888459714"],"abstract_inverted_index":{"RF":[0,9,30,59,100,104,138,209,223,252,258,276],"testing":[1,28],"is":[2,37,213,248],"an":[3],"increasingly":[4],"critical":[5],"component":[6],"of":[7,33,45,83,116,130,146,164,168,208,235,275,294],"modern":[8],"SoC's.":[10],"While":[11],"digital":[12,133],"logic":[13,134],"and":[14,22,40,57,78,128,201,245,260,279],"memory":[15],"tests":[16,63,163],"have":[17,121,240],"all":[18],"become":[19],"largely":[20],"automated":[21],"inexpensive":[23],"through":[24],"built-in":[25],"self-test":[26],"(BIST),":[27],"for":[29,55,250],"parameter":[31],"compliance":[32],"a":[34,42,295],"wireless":[35],"standard":[36],"time":[38,249],"consuming":[39],"commands":[41],"significant":[43],"fraction":[44],"the":[46,52,65,91,94,109,117,125,131,144,156,179,187,251,273,291],"total":[47],"SoC":[48,66,84],"cost.":[49],"Due":[50],"to":[51,123,135,142,225,254,264,268,290],"conventional":[53],"need":[54,263],"large":[56],"expensive":[58],"test":[60,136,148,181],"equipment,":[61],"these":[62],"limit":[64],"manufacturing":[67],"throughput":[68],"(about":[69],"3":[70],"million":[71],"cell":[72],"phones":[73],"are":[74,96],"manufactured":[75],"per":[76],"day!)":[77],"cannot":[79,283],"accommodate":[80],"other":[81],"parts":[82],"lifecycles,":[85],"such":[86,194],"as":[87,195,287],"on-wafer":[88,196],"testing.":[89],"At":[90],"same":[92],"time,":[93],"stakes":[95],"much":[97],"higher":[98],"in":[99,140],"SoC's:":[101],"A":[102],"failing":[103],"circuit":[105,259],"means":[106],"throwing":[107],"away":[108],"perfectly":[110],"working":[111],"digital/memory":[112],"section":[113],"occupying":[114],"most":[115],"die.":[118],"Recent":[119],"publications":[120],"proposed":[122],"exploit":[124],"increasing":[126],"abundance":[127],"intelligence":[129],"on-die":[132,198],"its":[137],"part":[139],"order":[141],"reduce":[143],"complexity":[145],"external":[147,157],"equipment":[149,158],"or":[150,166,197],"even":[151],"eliminate":[152],"it":[153,184,218,247,282],"entirely.":[154],"With":[155],"bottleneck":[159],"gone,":[160],"massively-":[161],"parallel":[162],"hundreds":[165],"thousands":[167],"IC":[169],"chips":[170],"can":[171,189],"be":[172,284],"carried":[173],"out":[174],"simultaneously,":[175],"thus":[176],"greatly":[177],"reducing":[178],"average":[180],"time.":[182],"Although":[183],"imposes":[185],"limitations,":[186],"self-testing":[188],"open":[190],"up":[191],"new":[192],"avenues,":[193],"(i.e.,":[199,203],"pre-packaging)":[200],"in-field":[202],"during":[204],"customer":[205],"use)":[206],"verification":[207],"performance.":[210],"Since":[211],"RF-BIST":[212],"about":[214],"manipulating":[215],"internal":[216],"signals,":[217],"could":[219],"naturally":[220],"assist":[221],"with":[222],"performance":[224],"improve":[226],"parametric":[227],"yield":[228,232],"so":[229,281],"that":[230,234],"effective":[231],"approaches":[233],"defect":[236],"density.":[237],"Digital":[238],"designers":[239,262],"mastered":[241],"BIST":[242],"long":[243],"ago":[244],"now":[246],"community":[253],"embrace":[255],"similar":[256],"ideas.":[257],"system":[261],"pay":[265],"close":[266],"attention":[267],"it:":[269],"Self-testing":[270],"will":[271],"affect":[272],"selection":[274],"front-end":[277],"circuitry":[278],"architecture":[280],"merely":[285],"viewed":[286],"something":[288],"confined":[289],"back-end":[292],"sections":[293],"modem.":[296]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}