{"id":"https://openalex.org/W2087784683","doi":"https://doi.org/10.1109/isscc.2008.4523312","title":"Balanced SiGe PA Module for Multi-Band and Multi-Mode Cellular-Phone Applications","display_name":"Balanced SiGe PA Module for Multi-Band and Multi-Mode Cellular-Phone Applications","publication_year":2008,"publication_date":"2008-02-01","ids":{"openalex":"https://openalex.org/W2087784683","doi":"https://doi.org/10.1109/isscc.2008.4523312","mag":"2087784683"},"language":"en","primary_location":{"id":"doi:10.1109/isscc.2008.4523312","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2008.4523312","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103296109","display_name":"Antonino Scuderi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CZ","IT"],"is_corresponding":false,"raw_author_name":"Antonino Scuderi","raw_affiliation_strings":["STMicroelectronics, Catania, Italy","STMicroelectronics [Catania]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics [Catania]","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008043706","display_name":"Carmelo Santagati","orcid":null},"institutions":[{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CZ","IT"],"is_corresponding":false,"raw_author_name":"Carmelo Santagati","raw_affiliation_strings":["STMicroelectronics, Catania, Italy","STMicroelectronics [Catania]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics [Catania]","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061456496","display_name":"Michele Vaiana","orcid":"https://orcid.org/0000-0002-6072-281X"},"institutions":[{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CZ","IT"],"is_corresponding":false,"raw_author_name":"Michele Vaiana","raw_affiliation_strings":["STMicroelectronics, Catania, Italy","STMicroelectronics [Catania]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics [Catania]","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069191172","display_name":"Francesco Pidala","orcid":null},"institutions":[{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CZ","IT"],"is_corresponding":false,"raw_author_name":"Francesco Pidala","raw_affiliation_strings":["STMicroelectronics, Catania, Italy","STMicroelectronics [Catania]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics [Catania]","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5021999183","display_name":"M. Paparo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CZ","IT"],"is_corresponding":false,"raw_author_name":"Mario Paparo","raw_affiliation_strings":["STMicroelectronics, Catania, Italy","STMicroelectronics [Catania]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics [Catania]","institution_ids":["https://openalex.org/I4210124177"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.9489,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.69176237,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"572","last_page":"637"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11248","display_name":"Advanced Power Amplifier Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/gsm","display_name":"GSM","score":0.6826705932617188},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5644987225532532},{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.5565584301948547},{"id":"https://openalex.org/keywords/envelope","display_name":"Envelope (radar)","score":0.5482996106147766},{"id":"https://openalex.org/keywords/isolator","display_name":"Isolator","score":0.5380473136901855},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4753037393093109},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.47098657488822937},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.44558703899383545},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4148483872413635},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4111522138118744},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3837689459323883},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3785382807254791},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3745219111442566},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.366233766078949},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.33934319019317627},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.29321354627609253},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1147489845752716}],"concepts":[{"id":"https://openalex.org/C59201141","wikidata":"https://www.wikidata.org/wiki/Q46904","display_name":"GSM","level":2,"score":0.6826705932617188},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5644987225532532},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.5565584301948547},{"id":"https://openalex.org/C65155139","wikidata":"https://www.wikidata.org/wiki/Q5380912","display_name":"Envelope (radar)","level":3,"score":0.5482996106147766},{"id":"https://openalex.org/C54888747","wikidata":"https://www.wikidata.org/wiki/Q962002","display_name":"Isolator","level":2,"score":0.5380473136901855},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4753037393093109},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.47098657488822937},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.44558703899383545},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4148483872413635},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4111522138118744},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3837689459323883},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3785382807254791},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3745219111442566},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.366233766078949},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.33934319019317627},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.29321354627609253},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1147489845752716},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C554190296","wikidata":"https://www.wikidata.org/wiki/Q47528","display_name":"Radar","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isscc.2008.4523312","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isscc.2008.4523312","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7099999785423279,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1502117330","https://openalex.org/W1830261752","https://openalex.org/W1944674657","https://openalex.org/W2125935742","https://openalex.org/W2560891297"],"related_works":["https://openalex.org/W2384049289","https://openalex.org/W2032687465","https://openalex.org/W2388050456","https://openalex.org/W1970906042","https://openalex.org/W2378872781","https://openalex.org/W2384201945","https://openalex.org/W2920294161","https://openalex.org/W2058306924","https://openalex.org/W4321512259","https://openalex.org/W1484668090"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"the":[3],"integration":[4],"of":[5,18],"a":[6,31,40,48],"MM":[7],"(GSM/EDGE/WCDMA)":[8],"MB":[9],"(850/900MHz,":[10],"1800/1900/2100MHz)":[11],"50":[12],"Omega-matched":[13],"isolator-less":[14],"flip-chip":[15],"PAs,":[16],"capable":[17],"envelope":[19],"and":[20,36],"power":[21],"tracking":[22],"operation,":[23],"is":[24,45],"discussed.":[25],"The":[26,43],"PAs":[27],"are":[28,37],"integrated":[29],"in":[30,47],"0.25":[32],"mum":[33],"SiGe":[34],"technology":[35],"soldered":[38],"on":[39],"4-layer":[41],"substrate.":[42],"system":[44],"hosted":[46],"6":[49],"x":[50],"8":[51],"mm2plastic":[52],"module.":[53]},"counts_by_year":[{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}