{"id":"https://openalex.org/W4410887726","doi":"https://doi.org/10.1109/isqed65160.2025.11014436","title":"Thermal Model Extraction at Chip Boundaries for Thermal Simulation of Chip in a System","display_name":"Thermal Model Extraction at Chip Boundaries for Thermal Simulation of Chip in a System","publication_year":2025,"publication_date":"2025-04-23","ids":{"openalex":"https://openalex.org/W4410887726","doi":"https://doi.org/10.1109/isqed65160.2025.11014436"},"language":"en","primary_location":{"id":"doi:10.1109/isqed65160.2025.11014436","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed65160.2025.11014436","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 26th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5114214805","display_name":"Kai-Xiang Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kai-Xiang Lin","raw_affiliation_strings":["National Yang Ming Chiao Tung University,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Yang Ming Chiao Tung University,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006193680","display_name":"Yu\u2010Min Lee","orcid":"https://orcid.org/0000-0002-4009-924X"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Min Lee","raw_affiliation_strings":["National Yang Ming Chiao Tung University,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Yang Ming Chiao Tung University,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"last","author":{"id":null,"display_name":"Bo-Yi Tsai","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Bo-Yi Tsai","raw_affiliation_strings":["National Yang Ming Chiao Tung University,Hsinchu,Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Yang Ming Chiao Tung University,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I148366613"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.09618709,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9857000112533569,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9857000112533569,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9689000248908997,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6786231994628906},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6627126932144165},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.5695101618766785},{"id":"https://openalex.org/keywords/extraction","display_name":"Extraction (chemistry)","score":0.4996981620788574},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4581455588340759},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.28547990322113037},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08409050107002258},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08307576179504395},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.05921044945716858}],"concepts":[{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6786231994628906},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6627126932144165},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.5695101618766785},{"id":"https://openalex.org/C4725764","wikidata":"https://www.wikidata.org/wiki/Q844704","display_name":"Extraction (chemistry)","level":2,"score":0.4996981620788574},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4581455588340759},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.28547990322113037},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08409050107002258},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08307576179504395},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.05921044945716858},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed65160.2025.11014436","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed65160.2025.11014436","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 26th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1524432767","https://openalex.org/W2050317652","https://openalex.org/W2106904411","https://openalex.org/W3119788609","https://openalex.org/W3156811509","https://openalex.org/W4243494208","https://openalex.org/W4245501382","https://openalex.org/W4313814703","https://openalex.org/W6732342490"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W2065289416","https://openalex.org/W2017236304","https://openalex.org/W2115579119","https://openalex.org/W2136854845"],"abstract_inverted_index":{"With":[0],"the":[1,13,31,38,46,61,70],"development":[2],"of":[3,45],"integrated":[4],"circuits,":[5],"their":[6],"functional-ities":[7],"have":[8],"been":[9],"significantly":[10],"enhanced.":[11],"However,":[12],"increasing":[14],"power":[15],"consumption":[16],"also":[17,59],"leads":[18],"to":[19,42,54],"thermal":[20,28,40,52,63,78,85],"issues.":[21],"This":[22],"work":[23],"efficiently":[24],"extracts":[25],"an":[26],"equivalent":[27],"model":[29,41],"at":[30],"chip":[32,56],"boundaries":[33],"within":[34],"a":[35],"system.":[36],"Attaching":[37],"extracted":[39],"boundary":[43],"surfaces":[44],"chip,":[47],"we":[48],"can":[49],"use":[50],"fewer":[51],"grids":[53],"simulate":[55],"temperatures":[57],"but":[58],"include":[60],"system":[62],"effect.":[64],"The":[65],"experimental":[66],"results":[67],"show":[68],"that":[69],"grid":[71],"reduction":[72],"is":[73],"over":[74,81],"76.38%":[75],"in":[76,83],"steady-state":[77],"simulation":[79],"and":[80],"51.53%":[82],"transient":[84],"simulation.":[86]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}