{"id":"https://openalex.org/W4410887298","doi":"https://doi.org/10.1109/isqed65160.2025.11014362","title":"Analysis of Short and Aging Faults in TSVs at the Physical Level with Parametric Variation","display_name":"Analysis of Short and Aging Faults in TSVs at the Physical Level with Parametric Variation","publication_year":2025,"publication_date":"2025-04-23","ids":{"openalex":"https://openalex.org/W4410887298","doi":"https://doi.org/10.1109/isqed65160.2025.11014362"},"language":"en","primary_location":{"id":"doi:10.1109/isqed65160.2025.11014362","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed65160.2025.11014362","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 26th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5107490589","display_name":"Prosen Kirtonia","orcid":"https://orcid.org/0000-0002-7944-0804"},"institutions":[{"id":"https://openalex.org/I79516672","display_name":"University of Louisiana at Lafayette","ror":"https://ror.org/01x8rc503","country_code":"US","type":"education","lineage":["https://openalex.org/I2799628689","https://openalex.org/I79516672"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Prosen Kirtonia","raw_affiliation_strings":["University of Louisiana at Lafayette,Dept. of Electrical and Computer Engr.,Lafayette,LA,USA,70504"],"affiliations":[{"raw_affiliation_string":"University of Louisiana at Lafayette,Dept. of Electrical and Computer Engr.,Lafayette,LA,USA,70504","institution_ids":["https://openalex.org/I79516672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047955697","display_name":"Shelby Williams","orcid":"https://orcid.org/0000-0001-7134-9339"},"institutions":[{"id":"https://openalex.org/I79516672","display_name":"University of Louisiana at Lafayette","ror":"https://ror.org/01x8rc503","country_code":"US","type":"education","lineage":["https://openalex.org/I2799628689","https://openalex.org/I79516672"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shelby Williams","raw_affiliation_strings":["Univ. of Louisiana at Lafayette,Center for Advanced Computer Studies,Lafayette,LA,USA,70504"],"affiliations":[{"raw_affiliation_string":"Univ. of Louisiana at Lafayette,Center for Advanced Computer Studies,Lafayette,LA,USA,70504","institution_ids":["https://openalex.org/I79516672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116057587","display_name":"Prasanna Kawatkar","orcid":null},"institutions":[{"id":"https://openalex.org/I79516672","display_name":"University of Louisiana at Lafayette","ror":"https://ror.org/01x8rc503","country_code":"US","type":"education","lineage":["https://openalex.org/I2799628689","https://openalex.org/I79516672"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Prasanna Kawatkar","raw_affiliation_strings":["Univ. of Louisiana at Lafayette,Center for Advanced Computer Studies,Lafayette,LA,USA,70504"],"affiliations":[{"raw_affiliation_string":"Univ. of Louisiana at Lafayette,Center for Advanced Computer Studies,Lafayette,LA,USA,70504","institution_ids":["https://openalex.org/I79516672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014459964","display_name":"Kasem Khalil","orcid":"https://orcid.org/0000-0002-9659-8566"},"institutions":[{"id":"https://openalex.org/I368840534","display_name":"University of Mississippi","ror":"https://ror.org/02teq1165","country_code":"US","type":"education","lineage":["https://openalex.org/I368840534","https://openalex.org/I4210141039"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kasem Khalil","raw_affiliation_strings":["Univ. of Mississippi,Department of Electrical and Computer Engineering,Oxford,MS,USA,38677"],"affiliations":[{"raw_affiliation_string":"Univ. of Mississippi,Department of Electrical and Computer Engineering,Oxford,MS,USA,38677","institution_ids":["https://openalex.org/I368840534"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5010023744","display_name":"Magdy Bayoumi","orcid":"https://orcid.org/0000-0002-0630-5273"},"institutions":[{"id":"https://openalex.org/I79516672","display_name":"University of Louisiana at Lafayette","ror":"https://ror.org/01x8rc503","country_code":"US","type":"education","lineage":["https://openalex.org/I2799628689","https://openalex.org/I79516672"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Magdy Bayoumi","raw_affiliation_strings":["University of Louisiana at Lafayette,Dept. of Electrical and Computer Engr.,Lafayette,LA,USA,70504"],"affiliations":[{"raw_affiliation_string":"University of Louisiana at Lafayette,Dept. of Electrical and Computer Engr.,Lafayette,LA,USA,70504","institution_ids":["https://openalex.org/I79516672"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5107490589"],"corresponding_institution_ids":["https://openalex.org/I79516672"],"apc_list":null,"apc_paid":null,"fwci":1.4935,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.83173708,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.7414383888244629},{"id":"https://openalex.org/keywords/variation","display_name":"Variation (astronomy)","score":0.7120997905731201},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.46579039096832275},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3468700647354126},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21136674284934998},{"id":"https://openalex.org/keywords/statistics","display_name":"Statistics","score":0.14958873391151428},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.13003316521644592},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06448185443878174}],"concepts":[{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.7414383888244629},{"id":"https://openalex.org/C2778334786","wikidata":"https://www.wikidata.org/wiki/Q1586270","display_name":"Variation (astronomy)","level":2,"score":0.7120997905731201},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46579039096832275},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3468700647354126},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21136674284934998},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.14958873391151428},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.13003316521644592},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06448185443878174},{"id":"https://openalex.org/C44870925","wikidata":"https://www.wikidata.org/wiki/Q37547","display_name":"Astrophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed65160.2025.11014362","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed65160.2025.11014362","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 26th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.699999988079071,"id":"https://metadata.un.org/sdg/13","display_name":"Climate action"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W1978117563","https://openalex.org/W2006312753","https://openalex.org/W2013868039","https://openalex.org/W2023264348","https://openalex.org/W2025516544","https://openalex.org/W2033330932","https://openalex.org/W2038509324","https://openalex.org/W2090694109","https://openalex.org/W2155707315","https://openalex.org/W2163262984","https://openalex.org/W2168732909","https://openalex.org/W2203888028","https://openalex.org/W2254450385","https://openalex.org/W2297067673","https://openalex.org/W2554709039","https://openalex.org/W2620632672","https://openalex.org/W2769815858","https://openalex.org/W2920789675","https://openalex.org/W2937642001","https://openalex.org/W2981065280","https://openalex.org/W3126803614","https://openalex.org/W3172709289","https://openalex.org/W3211067428","https://openalex.org/W4200591822","https://openalex.org/W4206614341","https://openalex.org/W4282966480","https://openalex.org/W4378806021","https://openalex.org/W4386921531","https://openalex.org/W4392084458","https://openalex.org/W4401164574","https://openalex.org/W4401416605"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2386430105","https://openalex.org/W2356521405","https://openalex.org/W2038534795","https://openalex.org/W2384358604","https://openalex.org/W1567829292","https://openalex.org/W3001063351","https://openalex.org/W3196905815"],"abstract_inverted_index":{"The":[0,55,94],"importance":[1],"of":[2,15,25,58,114,141,168],"using":[3],"chiplets":[4],"and":[5,18,27,38,127,158,185,190,213],"3D":[6,30],"ICs":[7,31],"is":[8,61,97,147,161,208],"growing":[9],"rapidly,":[10],"driven":[11],"by":[12,163],"the":[13,19,67,88,91,150,180,216],"slowing":[14],"Moore's":[16],"Law":[17],"benefits":[20],"they":[21],"offer.":[22],"Advanced":[23],"packaging":[24],"chiplets,":[26],"interconnects":[28],"in":[29,149],"are":[32,177],"crucial":[33],"for":[34,110,165,204,219],"enhancing":[35],"computing":[36],"performance":[37,73],"power":[39],"efficiency.":[40],"Hence,":[41],"Through-Silicon":[42],"Vias":[43],"(TSVs)":[44],"serve":[45],"as":[46],"prominent":[47],"vertical":[48],"conduits":[49],"to":[50,62,70,86,105,153,171,182,210],"ensure":[51],"efficient":[52],"chip-to-chip":[53],"communication.":[54],"primary":[56],"objective":[57],"this":[59],"work":[60],"model":[63],"TSV":[64,89],"faults":[65,170,214],"at":[66,90,188,215],"material":[68],"level":[69,218],"observe":[71,106],"transmission":[72],"deviations":[74],"alongside":[75],"other":[76],"parametric":[77],"analyses.":[78],"We":[79],"employ":[80],"Ansys":[81],"High-Frequency":[82],"Structure":[83],"Simulator":[84],"(HFSS)":[85],"design":[87,181],"physical":[92,217],"level.":[93],"reflection":[95],"coefficient":[96],"measured":[98],"over":[99],"a":[100,111,139,155,220],"0.1-30":[101],"GHz":[102],"frequency":[103],"band":[104],"\u221215":[107],"dB":[108],"bandwidth":[109],"wide":[112],"range":[113],"lengths":[115],"<tex":[116,122,130,142,191],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[117,123,131,143,192],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$(30-200":[118],"\\mu":[119,125,133,145,194],"m)$</tex>,":[120,126,134],"radius":[121],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$(4-50":[124],"insulator":[128],"thickness":[129],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$(0.2-1.5":[132],"considering":[135],"distinct":[136],"densities.":[137],"Furthermore,":[138],"crack":[140],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$5-15":[144],"m$</tex>":[146,195],"introduced":[148],"dielectric":[151],"layer":[152],"implement":[154],"short":[156],"fault,":[157],"copper":[159],"conductance":[160],"reduced":[162],"5-30%":[164],"different":[166],"stages":[167],"aging":[169],"evaluate":[172],"anomalies.":[173],"Finally,":[174],"multiple":[175],"TSVs":[176],"incorporated":[178],"into":[179],"assess":[183],"near-end":[184],"far-end":[186],"cross-talk":[187],"15":[189],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$30":[193],"pitch.":[196],"Therefore,":[197],"before":[198],"developing":[199],"an":[200],"equivalent":[201],"R-L-C":[202],"circuit":[203],"fault":[205],"detection,":[206],"it":[207],"essential":[209],"investigate":[211],"functionality":[212],"more":[221],"comprehensive":[222],"understanding.":[223]},"counts_by_year":[{"year":2025,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}