{"id":"https://openalex.org/W2084830368","doi":"https://doi.org/10.1109/isqed.2015.7085482","title":"Recovery of faulty TSVs in 3D ICs","display_name":"Recovery of faulty TSVs in 3D ICs","publication_year":2015,"publication_date":"2015-03-01","ids":{"openalex":"https://openalex.org/W2084830368","doi":"https://doi.org/10.1109/isqed.2015.7085482","mag":"2084830368"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2015.7085482","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2015.7085482","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sixteenth International Symposium on Quality Electronic Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102740051","display_name":"Surajit Kumar Roy","orcid":"https://orcid.org/0000-0003-3458-6874"},"institutions":[{"id":"https://openalex.org/I98365261","display_name":"Indian Institute of Engineering Science and Technology, Shibpur","ror":"https://ror.org/02ytfzr55","country_code":"IN","type":"education","lineage":["https://openalex.org/I98365261"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Surajit Kumar Roy","raw_affiliation_strings":["Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]},{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082301146","display_name":"Kaustav Roy","orcid":"https://orcid.org/0000-0001-7125-7450"},"institutions":[{"id":"https://openalex.org/I98365261","display_name":"Indian Institute of Engineering Science and Technology, Shibpur","ror":"https://ror.org/02ytfzr55","country_code":"IN","type":"education","lineage":["https://openalex.org/I98365261"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Kaustav Roy","raw_affiliation_strings":["Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]},{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033232210","display_name":"Chandan Giri","orcid":"https://orcid.org/0000-0003-3687-6242"},"institutions":[{"id":"https://openalex.org/I98365261","display_name":"Indian Institute of Engineering Science and Technology, Shibpur","ror":"https://ror.org/02ytfzr55","country_code":"IN","type":"education","lineage":["https://openalex.org/I98365261"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Chandan Giri","raw_affiliation_strings":["Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]},{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5082934529","display_name":"Hafizur Rahaman","orcid":"https://orcid.org/0000-0001-9012-5437"},"institutions":[{"id":"https://openalex.org/I98365261","display_name":"Indian Institute of Engineering Science and Technology, Shibpur","ror":"https://ror.org/02ytfzr55","country_code":"IN","type":"education","lineage":["https://openalex.org/I98365261"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Hafizur Rahaman","raw_affiliation_strings":["Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]},{"raw_affiliation_string":"Dept. of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India","institution_ids":["https://openalex.org/I98365261"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2008,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.59078456,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"45","issue":null,"first_page":"533","last_page":"536"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.9890999794006348,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.7650070190429688},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7337446212768555},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5178706645965576},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4897794723510742},{"id":"https://openalex.org/keywords/heuristic","display_name":"Heuristic","score":0.4696860611438751},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.45756369829177856},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4245140254497528},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.4174725413322449},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3502802848815918},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.32352912425994873},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2787807583808899},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.25957298278808594},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2567884922027588},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.081583172082901},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.05308923125267029}],"concepts":[{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.7650070190429688},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7337446212768555},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5178706645965576},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4897794723510742},{"id":"https://openalex.org/C173801870","wikidata":"https://www.wikidata.org/wiki/Q201413","display_name":"Heuristic","level":2,"score":0.4696860611438751},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.45756369829177856},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4245140254497528},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.4174725413322449},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3502802848815918},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32352912425994873},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2787807583808899},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.25957298278808594},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2567884922027588},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.081583172082901},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.05308923125267029},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2015.7085482","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2015.7085482","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sixteenth International Symposium on Quality Electronic Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.6000000238418579,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1965451131","https://openalex.org/W1987638749","https://openalex.org/W1992796329","https://openalex.org/W2002967711","https://openalex.org/W2010009884","https://openalex.org/W2075111830","https://openalex.org/W2089696629","https://openalex.org/W2105331022","https://openalex.org/W2107304970","https://openalex.org/W2124414146","https://openalex.org/W3136310872","https://openalex.org/W3143398174","https://openalex.org/W4255435342","https://openalex.org/W6678502064"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W2084347051"],"abstract_inverted_index":{"Through-silicon-via":[0],"(TSV)":[1],"based":[2],"three":[3],"dimensional":[4],"(3D)":[5],"integration":[6],"has":[7],"evolved":[8],"as":[9],"a":[10,33,74],"great":[11],"area":[12],"in":[13],"integrated-circuit":[14],"(IC)":[15],"technology.":[16],"TSV":[17,35,52,96],"defects":[18],"may":[19],"happen":[20],"due":[21],"to":[22,41,49,77],"manufacturing":[23],"problem":[24],"3D":[25],"IC":[26],"and":[27,58,85],"the":[28,42,63,79,90],"chip":[29],"is":[30,45,97],"discarded":[31],"for":[32,93],"single":[34],"defect.":[36],"Allocation":[37],"of":[38,56,65,83],"redundant":[39,59,86,95],"TSVs":[40,44,60,87],"faulty":[43,66],"an":[46],"attractive":[47],"solution":[48],"recover":[50],"from":[51],"defects.":[53],"Proper":[54],"grouping":[55,82],"functional":[57,84],"can":[61],"enhance":[62],"recovery":[64],"TSVs.":[67],"In":[68],"this":[69],"paper":[70],"we":[71],"have":[72],"addressed":[73],"heuristic":[75],"approach":[76],"find":[78],"best":[80],"possible":[81],"such":[88],"that":[89],"wire":[91],"length":[92],"rerouting":[94],"minimized.":[98]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}