{"id":"https://openalex.org/W2141178222","doi":"https://doi.org/10.1109/isqed.2013.6523649","title":"CPDI: Cross-power-domain interface circuit design in monolithic 3D technology","display_name":"CPDI: Cross-power-domain interface circuit design in monolithic 3D technology","publication_year":2013,"publication_date":"2013-03-01","ids":{"openalex":"https://openalex.org/W2141178222","doi":"https://doi.org/10.1109/isqed.2013.6523649","mag":"2141178222"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2013.6523649","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2013.6523649","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064910584","display_name":"Jing Xie","orcid":"https://orcid.org/0000-0003-4363-8744"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jing Xie","raw_affiliation_strings":["Pennsylvania State University, University Park, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pennsylvania State University, University Park, USA","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058197553","display_name":"Yang Du","orcid":"https://orcid.org/0000-0003-2254-778X"},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yang Du","raw_affiliation_strings":["Qualcomm Corporation Research and Development, San Diego, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Qualcomm Corporation Research and Development, San Diego, USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100385338","display_name":"Yuan Xie","orcid":"https://orcid.org/0000-0003-3803-0929"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]},{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuan Xie","raw_affiliation_strings":["AMD Research, Advanced Micro Devices, Inc, USA","Pennsylvania State University, University Park, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AMD Research, Advanced Micro Devices, Inc, USA","institution_ids":["https://openalex.org/I4210137977"]},{"raw_affiliation_string":"Pennsylvania State University, University Park, USA","institution_ids":["https://openalex.org/I130769515"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.6343,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.72037547,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":"16","issue":null,"first_page":"442","last_page":"447"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/power-domains","display_name":"Power domains","score":0.7567448616027832},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.601375937461853},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.5912646651268005},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.51931232213974},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4775848388671875},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.47752490639686584},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.47696101665496826},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.4698046147823334},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.4651222229003906},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.43362051248550415},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.34004586935043335},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3155699372291565},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.28590670228004456},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.253046452999115}],"concepts":[{"id":"https://openalex.org/C16021271","wikidata":"https://www.wikidata.org/wiki/Q17152552","display_name":"Power domains","level":3,"score":0.7567448616027832},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.601375937461853},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.5912646651268005},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.51931232213974},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4775848388671875},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47752490639686584},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.47696101665496826},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.4698046147823334},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.4651222229003906},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.43362051248550415},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.34004586935043335},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3155699372291565},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28590670228004456},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.253046452999115},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isqed.2013.6523649","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2013.6523649","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-133567","is_oa":false,"landing_page_url":"http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1948-3295&rft.volume=&rft.issue=&rft.date=2013&rft.spage=442&rft.aulast=Xie&rft.aufirst=Jing&rft.atitle=CPDI%3A+Cross-power-domain+interface+circuit+design+in+monolithic+3D+technology&rft.title=Proceedings+-+International+Symposium+on+Quality+Electronic+Design%2C+ISQED","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.9100000262260437}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W108989492","https://openalex.org/W1969237862","https://openalex.org/W1984711740","https://openalex.org/W1989073365","https://openalex.org/W2006312753","https://openalex.org/W2104304150","https://openalex.org/W2116175063","https://openalex.org/W2116966184","https://openalex.org/W2146478807","https://openalex.org/W2146704626","https://openalex.org/W2158305111","https://openalex.org/W2160130898","https://openalex.org/W2162517322","https://openalex.org/W2163742724","https://openalex.org/W2169278276","https://openalex.org/W2566444836","https://openalex.org/W6675685769"],"related_works":["https://openalex.org/W1993210935","https://openalex.org/W2383563100","https://openalex.org/W2393658466","https://openalex.org/W4248234938","https://openalex.org/W1981084410","https://openalex.org/W2078506771","https://openalex.org/W2914442136","https://openalex.org/W2368652795","https://openalex.org/W2391880898","https://openalex.org/W2744948163"],"abstract_inverted_index":{"Optimizing":[0],"energy":[1,120],"consumption":[2],"for":[3,18],"electronic":[4],"systems":[5],"has":[6],"been":[7],"an":[8],"important":[9],"design":[10,14,86,96,102,129],"focus.":[11],"Multi-power":[12],"domain":[13,34,82],"is":[15,103],"widely":[16],"used":[17],"low":[19,108],"power":[20,28,33,46,81,88,109],"and":[21,53,74,98,118],"high":[22],"performance":[23,54],"applications.":[24],"Data":[25],"transfer":[26],"between":[27],"domains":[29],"needs":[30],"a":[31,61,72,106],"cross":[32],"interface":[35,69],"(CPDI).":[36],"The":[37,101,127],"existing":[38,124],"level-conversion":[39],"flip-flop":[40,73],"(LCFF)":[41],"structures":[42],"all":[43],"need":[44],"dual":[45],"rails,":[47],"which":[48],"leads":[49],"to":[50,83,116],"large":[51],"area":[52,99],"overhead.":[55],"In":[56],"this":[57],"paper,":[58],"we":[59],"propose":[60],"CPDI":[62],"circuit":[63],"utilizing":[64],"monolithic":[65],"3D":[66],"technology.":[67,110],"This":[68],"functions":[70],"as":[71],"provides":[75],"reliable":[76],"data":[77],"conversion":[78],"from":[79],"one":[80],"another.":[84],"Our":[85],"separates":[87],"rails":[89],"in":[90,105],"each":[91],"tier,":[92],"substantially":[93],"reducing":[94],"physical":[95],"complexity":[97],"penalty.":[100],"implemented":[104],"45nm":[107],"It":[111],"shows":[112,131],"20%-35%":[113],"smaller":[114],"clock":[115],"Q":[117],"30%":[119],"saving":[121],"comparing":[122],"with":[123,134],"LCFF":[125],"designs.":[126],"proposed":[128],"also":[130],"better":[132],"robustness":[133],"\u00b110%":[135],"voltage":[136],"variation.":[137]},"counts_by_year":[{"year":2014,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}