{"id":"https://openalex.org/W1998348592","doi":"https://doi.org/10.1109/isqed.2012.6187526","title":"A case for 3D stacked analog circuits in high-speed sensing systems","display_name":"A case for 3D stacked analog circuits in high-speed sensing systems","publication_year":2012,"publication_date":"2012-03-01","ids":{"openalex":"https://openalex.org/W1998348592","doi":"https://doi.org/10.1109/isqed.2012.6187526","mag":"1998348592"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2012.6187526","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2012.6187526","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5051502689","display_name":"Mohammad Abdel-Majeed","orcid":"https://orcid.org/0000-0002-0789-4479"},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Mohammad Abdel-Majeed","raw_affiliation_strings":["Electrical Engineering Department, University of Southern California, Los Angeles, CA, USA","Electrical Engineering Department, University of Southern California, Los Angeles, CA 90089"],"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, University of Southern California, Los Angeles, CA, USA","institution_ids":["https://openalex.org/I1174212"]},{"raw_affiliation_string":"Electrical Engineering Department, University of Southern California, Los Angeles, CA 90089","institution_ids":["https://openalex.org/I1174212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075337538","display_name":"Mike Y. Chen","orcid":"https://orcid.org/0000-0001-5410-652X"},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mike Chen","raw_affiliation_strings":["Electrical Engineering Department, University of Southern California, Los Angeles, CA, USA","Electrical Engineering Department, University of Southern California, Los Angeles, CA 90089"],"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, University of Southern California, Los Angeles, CA, USA","institution_ids":["https://openalex.org/I1174212"]},{"raw_affiliation_string":"Electrical Engineering Department, University of Southern California, Los Angeles, CA 90089","institution_ids":["https://openalex.org/I1174212"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5018033573","display_name":"Murali Annavaram","orcid":"https://orcid.org/0000-0002-4633-6867"},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Murali Annavaram","raw_affiliation_strings":["Electrical Engineering Department, University of Southern California, Los Angeles, CA, USA","Electrical Engineering Department, University of Southern California, Los Angeles, CA 90089"],"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, University of Southern California, Los Angeles, CA, USA","institution_ids":["https://openalex.org/I1174212"]},{"raw_affiliation_string":"Electrical Engineering Department, University of Southern California, Los Angeles, CA 90089","institution_ids":["https://openalex.org/I1174212"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5051502689"],"corresponding_institution_ids":["https://openalex.org/I1174212"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07246087,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"412","last_page":"417"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6549645662307739},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5850791335105896},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5158088207244873},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.49784350395202637},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.4845649302005768},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.4759361743927002},{"id":"https://openalex.org/keywords/amplifier","display_name":"Amplifier","score":0.4627283811569214},{"id":"https://openalex.org/keywords/block","display_name":"Block (permutation group theory)","score":0.41242706775665283},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.3964439332485199},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.3818940222263336},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.30658766627311707},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3016827702522278},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10081037878990173}],"concepts":[{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6549645662307739},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5850791335105896},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5158088207244873},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.49784350395202637},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.4845649302005768},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.4759361743927002},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.4627283811569214},{"id":"https://openalex.org/C2777210771","wikidata":"https://www.wikidata.org/wiki/Q4927124","display_name":"Block (permutation group theory)","level":2,"score":0.41242706775665283},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.3964439332485199},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.3818940222263336},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.30658766627311707},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3016827702522278},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10081037878990173},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isqed.2012.6187526","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2012.6187526","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.462.7190","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.462.7190","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.usc.edu/dept/ee/scip/assets/004/82407.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4300000071525574,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1757458251","https://openalex.org/W1977718361","https://openalex.org/W1977873933","https://openalex.org/W2013172269","https://openalex.org/W2098872535","https://openalex.org/W2102081731","https://openalex.org/W2129785295","https://openalex.org/W2132870761","https://openalex.org/W2141500592","https://openalex.org/W2143807959","https://openalex.org/W2155707315","https://openalex.org/W2164767665","https://openalex.org/W3004436853","https://openalex.org/W3143819208","https://openalex.org/W4214503763"],"related_works":["https://openalex.org/W2035329725","https://openalex.org/W4376641153","https://openalex.org/W2050788868","https://openalex.org/W2070875936","https://openalex.org/W4250391473","https://openalex.org/W3045075405","https://openalex.org/W4302292679","https://openalex.org/W2956222435","https://openalex.org/W4241625287","https://openalex.org/W4295885776"],"abstract_inverted_index":{"In":[0,82,134,165],"order":[1,166],"to":[2,26,93,124,167,219],"build":[3,61],"high":[4],"performance":[5,159,172],"real-time":[6,103],"sensing":[7,104],"systems":[8,63],"every":[9],"building":[10,24,40],"block":[11,25],"in":[12,131],"the":[13,53,87,108,129,139,142,158,169,199,212],"system":[14],"should":[15],"be":[16],"built":[17,97],"with":[18],"a":[19,102,132],"technology":[20],"that":[21,23,189],"allows":[22],"achieve":[27],"its":[28],"best":[29,54],"performance.":[30],"Technologies":[31],"like":[32,44],"BJT":[33],"and":[34,47,120,148,162,171,180,194,209,210],"BICMOS":[35],"are":[36,68],"better":[37],"suited":[38],"for":[39,56],"basic":[41],"analog":[42,143,161,193],"blocks":[43,96,119],"input":[45],"buffers":[46],"power":[48,170],"amplifiers,":[49],"while":[50],"CMOS":[51],"is":[52],"choice":[55],"digital":[57,118,126,163],"data":[58],"processing.":[59],"To":[60],"mixed-technology":[62],"traditionally":[64],"system-in-package":[65],"(SiP)":[66],"techniques":[67],"used.":[69],"SiP":[70],"integration":[71],"uses":[72],"bonding":[73,176],"wires":[74],"or":[75,156],"flip":[76,178],"chip":[77],"instead":[78],"of":[79,89,107,141,160,192],"on-chip":[80],"integration.":[81],"this":[83,135],"paper":[84,136],"we":[85,137,174,187],"study":[86,138],"feasibility":[88],"using":[90,98,121],"3D":[91,112,152,190],"stacking":[92,113,153,191],"integrate":[94],"heterogeneous":[95],"different":[99],"technologies":[100],"within":[101],"system.":[105],"Several":[106],"previous":[109],"studies":[110],"on":[111,115],"focused":[114],"integrating":[116],"multiple":[117],"through-silicon-vias":[122],"(TSVs)":[123],"transfer":[125],"signals":[127,144],"between":[128],"layers":[130],"stack.":[133],"behavior":[140],"traversing":[145],"through":[146],"TSVs":[147],"measure":[149],"how":[150],"well":[151],"can":[154,197],"enhance":[155],"limit":[157],"stacking.":[164],"quantify":[168],"characteristics,":[173],"modeled":[175],"wire,":[177],"chip,":[179],"through-silicon-via":[181],"(TSV)":[182],"interfaces.":[183],"Using":[184],"these":[185],"models":[186],"show":[188],"analog/digital":[195],"components":[196],"double":[198],"bandwidth,":[200],"increase":[201],"sampling":[202],"frequency":[203],"by":[204,215],"nearly":[205],"two":[206],"orders":[207],"magnitude":[208],"improve":[211],"signal":[213],"integrity":[214],"3":[216],"dB":[217],"compared":[218],"bond":[220],"wires.":[221]},"counts_by_year":[],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}