{"id":"https://openalex.org/W2062556770","doi":"https://doi.org/10.1109/isqed.2011.5770715","title":"3D Stacked IC layout considering bond pad density and doubling for manufacturing yield improvement","display_name":"3D Stacked IC layout considering bond pad density and doubling for manufacturing yield improvement","publication_year":2011,"publication_date":"2011-03-01","ids":{"openalex":"https://openalex.org/W2062556770","doi":"https://doi.org/10.1109/isqed.2011.5770715","mag":"2062556770"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2011.5770715","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2011.5770715","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 12th International Symposium on Quality Electronic Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084103721","display_name":"Ding-Ming Kwai","orcid":"https://orcid.org/0000-0001-7769-7879"},"institutions":[{"id":"https://openalex.org/I142066694","display_name":"ITRI International","ror":"https://ror.org/04wwsbd59","country_code":"US","type":"facility","lineage":["https://openalex.org/I142066694"]},{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW","US"],"is_corresponding":true,"raw_author_name":"Ding-Ming Kwai","raw_affiliation_strings":["Information and Communications Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan","Information and Communications Research Lab, Industrial Technology Research Institute, Hsinchu, Taiwan#TAB#"],"affiliations":[{"raw_affiliation_string":"Information and Communications Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Information and Communications Research Lab, Industrial Technology Research Institute, Hsinchu, Taiwan#TAB#","institution_ids":["https://openalex.org/I142066694"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110611634","display_name":"Chang\u2010Tzu Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I142066694","display_name":"ITRI International","ror":"https://ror.org/04wwsbd59","country_code":"US","type":"facility","lineage":["https://openalex.org/I142066694"]},{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Chang-Tzu Lin","raw_affiliation_strings":["Information and Communications Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan","Information and Communications Research Lab, Industrial Technology Research Institute, Hsinchu, Taiwan#TAB#"],"affiliations":[{"raw_affiliation_string":"Information and Communications Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Information and Communications Research Lab, Industrial Technology Research Institute, Hsinchu, Taiwan#TAB#","institution_ids":["https://openalex.org/I142066694"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5084103721"],"corresponding_institution_ids":["https://openalex.org/I142066694","https://openalex.org/I4210148468"],"apc_list":null,"apc_paid":null,"fwci":0.5403,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.70885929,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":"7520","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.6366313695907593},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.5669717192649841},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5345664620399475},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.5202264189720154},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5149141550064087},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.49856114387512207},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.49026206135749817},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.4372750222682953},{"id":"https://openalex.org/keywords/manufacturing-cost","display_name":"Manufacturing cost","score":0.4228549003601074},{"id":"https://openalex.org/keywords/routing","display_name":"Routing (electronic design automation)","score":0.4164925515651703},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3741312623023987},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.345833957195282},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.24217849969863892},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2121182084083557},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2002282440662384},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.15817424654960632},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.14886024594306946},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.14039596915245056},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.10795605182647705}],"concepts":[{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.6366313695907593},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5669717192649841},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5345664620399475},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.5202264189720154},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5149141550064087},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.49856114387512207},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.49026206135749817},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.4372750222682953},{"id":"https://openalex.org/C2778337023","wikidata":"https://www.wikidata.org/wiki/Q6753108","display_name":"Manufacturing cost","level":2,"score":0.4228549003601074},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.4164925515651703},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3741312623023987},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.345833957195282},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24217849969863892},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2121182084083557},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2002282440662384},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.15817424654960632},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.14886024594306946},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.14039596915245056},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.10795605182647705},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2011.5770715","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2011.5770715","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 12th International Symposium on Quality Electronic Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.41999998688697815,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W87133106","https://openalex.org/W1916509993","https://openalex.org/W1927844004","https://openalex.org/W2037771006","https://openalex.org/W2038394004","https://openalex.org/W2045396596","https://openalex.org/W2061584132","https://openalex.org/W2145135695","https://openalex.org/W2157327244","https://openalex.org/W2161129061","https://openalex.org/W2170809360","https://openalex.org/W4245035182","https://openalex.org/W6640254734","https://openalex.org/W6660147543","https://openalex.org/W6665846981","https://openalex.org/W6683210785","https://openalex.org/W6685124536"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W3093450488","https://openalex.org/W3163301441","https://openalex.org/W2027159884","https://openalex.org/W2016589506","https://openalex.org/W4300584862","https://openalex.org/W2534942874","https://openalex.org/W2289302158"],"abstract_inverted_index":{"While":[0],"3D":[1,74],"integration":[2],"using":[3],"through-silicon":[4],"vias":[5],"(TSVs)":[6],"offers":[7],"an":[8,179],"opportunity":[9],"to":[10,23,32,40,70,82,99,129,152,160,204,213],"realize":[11],"higher-performance":[12],"subsystems":[13],"than":[14],"conventional":[15],"SOC,":[16],"the":[17,72,87,101,106,115,132,135,141,145,150,156,161,166,173,188,194,205],"potential":[18],"compound":[19],"yield":[20,77,217],"loss":[21],"leads":[22],"worse":[24],"cost":[25],"control,":[26],"which":[27,148],"becomes":[28],"a":[29,65,124],"major":[30],"hindrance":[31],"its":[33],"mass":[34],"production.":[35],"Among":[36],"many":[37],"outstanding":[38],"issues":[39],"be":[41,83,221],"resolved,":[42],"one":[43],"is":[44,127,201,211],"induced":[45],"from":[46,131],"insufficient":[47],"bonding":[48,216],"strength":[49,219],"and":[50,78,104,218],"quality,":[51],"resulting":[52],"in":[53],"unreliable":[54],"or":[55],"even":[56],"failing":[57],"die":[58],"stacking.":[59],"In":[60],"this":[61],"paper,":[62],"we":[63],"present":[64],"bond":[66,110,121,198],"pad":[67,122],"doubling":[68],"approach":[69,175],"enhance":[71,193],"TSV-based":[73],"IC":[75],"manufacturing":[76],"reliability.":[79],"It":[80],"aims":[81],"easily":[84],"incorporated":[85],"into":[86,114],"current":[88],"physical":[89],"design":[90],"flow":[91],"by":[92,137],"leveraging":[93],"mature":[94],"2D":[95],"layout":[96],"tools.":[97],"First,":[98],"maximize":[100],"pattern":[102],"density":[103],"meet":[105],"lower":[107,146],"limit,":[108],"dummy":[109,133],"pads":[111],"are":[112,158],"inserted":[113],"whitespace":[116],"between":[117],"dies.":[118],"Next,":[119],"for":[120],"doubling,":[123],"greedy":[125],"assignment":[126],"applied":[128,203],"select":[130],"at":[134],"neighborhood":[136],"incremental":[138],"routing":[139],"on":[140],"front":[142],"side":[143],"of":[144,165,196],"die,":[147],"connects":[149],"singles":[151],"form":[153],"pairs.":[154],"Finally,":[155],"connections":[157],"copied":[159],"corresponding":[162],"back":[163],"metal":[164],"upper":[167],"die.":[168],"Empirical":[169],"results":[170],"demonstrate":[171],"that":[172],"proposed":[174],"can":[176,220],"promisingly":[177],"achieve":[178],"initial":[180],"success":[181,209],"rate":[182,210],"as":[183,185],"high":[184],"80%":[186],"with":[187],"nearest":[189],"neighbors.":[190],"To":[191],"further":[192],"quality":[195],"results,":[197],"padding":[199],"technique":[200],"also":[202],"work.":[206],"The":[207,215],"final":[208],"up":[212],"95%.":[214],"effectively":[222],"improved.":[223]},"counts_by_year":[{"year":2012,"cited_by_count":2}],"updated_date":"2026-04-08T06:01:36.053099","created_date":"2025-10-10T00:00:00"}