{"id":"https://openalex.org/W2141647455","doi":"https://doi.org/10.1109/isqed.2011.5770714","title":"Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs","display_name":"Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs","publication_year":2011,"publication_date":"2011-03-01","ids":{"openalex":"https://openalex.org/W2141647455","doi":"https://doi.org/10.1109/isqed.2011.5770714","mag":"2141647455"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2011.5770714","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2011.5770714","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 12th International Symposium on Quality Electronic Design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5032455044","display_name":"Taigon Song","orcid":"https://orcid.org/0000-0001-5243-4132"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Taigon Song","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100353307","display_name":"Chang Liu","orcid":"https://orcid.org/0000-0002-8574-2681"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chang Liu","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100374561","display_name":"Dae Hyun Kim","orcid":"https://orcid.org/0000-0001-8275-5949"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dae Hyun Kim","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074429007","display_name":"Jonghyun Cho","orcid":"https://orcid.org/0000-0003-3277-1072"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jonghyun Cho","raw_affiliation_strings":["School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101923707","display_name":"Joohee Kim","orcid":"https://orcid.org/0000-0002-0294-9565"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joohee Kim","raw_affiliation_strings":["School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108519487","display_name":"Jun So Pak","orcid":null},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jun So Pak","raw_affiliation_strings":["School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058295399","display_name":"Seungyoung Ahn","orcid":"https://orcid.org/0000-0002-0771-7050"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seungyoung Ahn","raw_affiliation_strings":["School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046623632","display_name":"Joungho Kim","orcid":"https://orcid.org/0000-0003-1376-0781"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joungho Kim","raw_affiliation_strings":["School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109981146","display_name":"Ki-Hyun Yoon","orcid":null},"institutions":[{"id":"https://openalex.org/I93085520","display_name":"Silicon Labs (United States)","ror":"https://ror.org/02dyqfb80","country_code":"US","type":"company","lineage":["https://openalex.org/I93085520"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kihyun Yoon","raw_affiliation_strings":["Silicon Image, CA, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Silicon Image, CA, U.S.A","institution_ids":["https://openalex.org/I93085520"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":31,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9929999709129333,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9902999997138977,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7907873392105103},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.7517865896224976},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.7014233469963074},{"id":"https://openalex.org/keywords/crosstalk","display_name":"Crosstalk","score":0.6392281651496887},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.5638107061386108},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5432461500167847},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5212371945381165},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.41849592328071594},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.35545235872268677},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2717500925064087},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25673043727874756},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.20958107709884644},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.06733465194702148}],"concepts":[{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7907873392105103},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.7517865896224976},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.7014233469963074},{"id":"https://openalex.org/C169822122","wikidata":"https://www.wikidata.org/wiki/Q230187","display_name":"Crosstalk","level":2,"score":0.6392281651496887},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.5638107061386108},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5432461500167847},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5212371945381165},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.41849592328071594},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.35545235872268677},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2717500925064087},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25673043727874756},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.20958107709884644},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.06733465194702148}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isqed.2011.5770714","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2011.5770714","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 12th International Symposium on Quality Electronic Design","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.462.1899","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.462.1899","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.gtcad.gatech.edu/www/papers/isqed11b.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2103652526","https://openalex.org/W2108722852","https://openalex.org/W2110024109","https://openalex.org/W2134264906","https://openalex.org/W2159195179","https://openalex.org/W2169219063"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2549021975","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230"],"abstract_inverted_index":{"It":[0],"is":[1,18,22],"widely-known":[2],"that":[3,25,49],"coupling":[4,17,27,38,85,108,125],"exists":[5],"between":[6],"adjacent":[7],"through-silicon":[8],"vias":[9],"(TSVs)":[10],"in":[11,39,52,86,110,126],"3D":[12,40,76,87,127],"ICs.":[13,128],"Since":[14],"this":[15,62,79],"TSV-to-TSV":[16,26,84,107,124],"not":[19,67],"negligible,":[20],"it":[21],"highly":[23],"likely":[24],"affects":[28],"crosstalk":[29],"significantly.":[30],"Although":[31],"a":[32,75,91,96,120],"few":[33],"works":[34],"have":[35],"already":[36],"analyzed":[37],"ICs,":[41],"they":[42],"used":[43],"S-parameter-based":[44],"methods":[45],"under":[46,57],"the":[47],"assumption":[48],"all":[50],"ports":[51,70],"their":[53],"simulation":[54],"structures":[55],"are":[56],"50-\u03a9":[58,63],"termination":[59,64,99],"condition.":[60,100],"However,":[61],"condition":[65],"does":[66],"occur":[68],"at":[69],"(pins)":[71],"of":[72],"gates":[73],"inside":[74],"IC.":[77],"In":[78],"paper,":[80],"therefore,":[81],"we":[82,118],"analyze":[83,103],"ICs":[88],"based":[89],"on":[90,115],"lumped":[92],"circuit":[93],"model":[94],"with":[95],"realistic":[97],"high-impedance":[98],"We":[101],"also":[102],"how":[104],"channel":[105],"affect":[106],"differently":[109],"different":[111],"frequency":[112],"ranges.":[113],"Based":[114],"our":[116],"results,":[117],"propose":[119],"technique":[121],"to":[122],"reduce":[123]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":8},{"year":2014,"cited_by_count":9},{"year":2013,"cited_by_count":5},{"year":2012,"cited_by_count":3}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}