{"id":"https://openalex.org/W1967186250","doi":"https://doi.org/10.1109/isqed.2010.5450513","title":"Yield improvement of 3D ICs in the presence of defects in through signal vias","display_name":"Yield improvement of 3D ICs in the presence of defects in through signal vias","publication_year":2010,"publication_date":"2010-03-01","ids":{"openalex":"https://openalex.org/W1967186250","doi":"https://doi.org/10.1109/isqed.2010.5450513","mag":"1967186250"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2010.5450513","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2010.5450513","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 11th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033307188","display_name":"Rajeev K. Nain","orcid":null},"institutions":[{"id":"https://openalex.org/I126345244","display_name":"Portland State University","ror":"https://ror.org/00yn2fy02","country_code":"US","type":"education","lineage":["https://openalex.org/I126345244"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Rajeev K. Nain","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA","Department of Electrical and Computer Engineering, Portland State University, OR, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA","institution_ids":["https://openalex.org/I126345244"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Portland State University, OR, USA","institution_ids":["https://openalex.org/I126345244"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109943841","display_name":"Shantesh Pinge","orcid":null},"institutions":[{"id":"https://openalex.org/I126345244","display_name":"Portland State University","ror":"https://ror.org/00yn2fy02","country_code":"US","type":"education","lineage":["https://openalex.org/I126345244"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shantesh Pinge","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA","Department of Electrical and Computer Engineering, Portland State University, OR, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA","institution_ids":["https://openalex.org/I126345244"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Portland State University, OR, USA","institution_ids":["https://openalex.org/I126345244"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040622659","display_name":"Malgorzata Chrzanowska-Jeske","orcid":"https://orcid.org/0000-0001-5927-1751"},"institutions":[{"id":"https://openalex.org/I126345244","display_name":"Portland State University","ror":"https://ror.org/00yn2fy02","country_code":"US","type":"education","lineage":["https://openalex.org/I126345244"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Malgorzata Chrzanowska-Jeske","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA","Department of Electrical and Computer Engineering, Portland State University, OR, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA","institution_ids":["https://openalex.org/I126345244"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Portland State University, OR, USA","institution_ids":["https://openalex.org/I126345244"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5033307188"],"corresponding_institution_ids":["https://openalex.org/I126345244"],"apc_list":null,"apc_paid":null,"fwci":0.5773,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.69401309,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"598","last_page":"605"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.7113949060440063},{"id":"https://openalex.org/keywords/monte-carlo-method","display_name":"Monte Carlo method","score":0.5533789396286011},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.5454845428466797},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.5364547371864319},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5102946758270264},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.44247299432754517},{"id":"https://openalex.org/keywords/percolation","display_name":"Percolation (cognitive psychology)","score":0.42117932438850403},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3718796968460083},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2678379416465759},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22630402445793152},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12726294994354248},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.08811891078948975}],"concepts":[{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.7113949060440063},{"id":"https://openalex.org/C19499675","wikidata":"https://www.wikidata.org/wiki/Q232207","display_name":"Monte Carlo method","level":2,"score":0.5533789396286011},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.5454845428466797},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.5364547371864319},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5102946758270264},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.44247299432754517},{"id":"https://openalex.org/C2780457167","wikidata":"https://www.wikidata.org/wiki/Q17156484","display_name":"Percolation (cognitive psychology)","level":2,"score":0.42117932438850403},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3718796968460083},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2678379416465759},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22630402445793152},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12726294994354248},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08811891078948975},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C169760540","wikidata":"https://www.wikidata.org/wiki/Q207011","display_name":"Neuroscience","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2010.5450513","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2010.5450513","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 11th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4000000059604645}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1518236483","https://openalex.org/W1556480701","https://openalex.org/W1716878732","https://openalex.org/W1970296212","https://openalex.org/W1971194844","https://openalex.org/W1971322722","https://openalex.org/W2002041333","https://openalex.org/W2028954821","https://openalex.org/W2098161174","https://openalex.org/W2126073857","https://openalex.org/W2137893918","https://openalex.org/W2140574483","https://openalex.org/W2144149750","https://openalex.org/W2146306637","https://openalex.org/W2146630859","https://openalex.org/W2170501415","https://openalex.org/W2533508285","https://openalex.org/W3145025383","https://openalex.org/W4245549415","https://openalex.org/W6633284831"],"related_works":["https://openalex.org/W2393870460","https://openalex.org/W2254578859","https://openalex.org/W4284894156","https://openalex.org/W2161803855","https://openalex.org/W3110774753","https://openalex.org/W2134539662","https://openalex.org/W2059096050","https://openalex.org/W2093391715","https://openalex.org/W1972737581","https://openalex.org/W1976848547"],"abstract_inverted_index":{"Through":[0],"signal":[1,39],"vias":[2,40],"(TSVs)":[3],"in":[4,18,32,37,41,100],"3D":[5,43,57,102],"ICs":[6,58],"suffer":[7],"from":[8],"thermo-mechanical":[9],"stress,":[10],"and":[11,66,82],"may":[12],"fail":[13],"or":[14],"attain":[15],"plasticity":[16],"resulting":[17],"significant":[19],"yield":[20,30,55,65],"loss.":[21],"We":[22],"present":[23,67],"a":[24,68],"novel":[25],"set":[26],"of":[27,35,56,71,74],"strategies":[28,95],"for":[29],"improvement":[31],"the":[33,54,63,72,93],"presence":[34],"defects":[36],"through":[38],"heterogeneous":[42],"system-on-chip.":[44],"Monte-Carlo":[45],"simulation":[46],"results":[47,90],"show":[48],"that":[49,85,92],"our":[50,75],"strategy":[51],"can":[52,86,96],"improve":[53,87],"significantly.":[59],"Furthermore,":[60],"we":[61],"estimate":[62],"parametric":[64],"quantitative":[69],"analysis":[70],"impact":[73],"approach":[76],"on":[77],"chip":[78,83],"area,":[79],"power,":[80],"performance":[81],"revenue":[84],"profitability.":[88],"Our":[89],"suggest":[91],"proposed":[94],"be":[97],"very":[98],"useful":[99],"yield-aware":[101],"design.":[103]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}