{"id":"https://openalex.org/W2121831289","doi":"https://doi.org/10.1109/isqed.2009.4810304","title":"Proactive management of X's in scan chains for compression","display_name":"Proactive management of X's in scan chains for compression","publication_year":2009,"publication_date":"2009-03-01","ids":{"openalex":"https://openalex.org/W2121831289","doi":"https://doi.org/10.1109/isqed.2009.4810304","mag":"2121831289"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2009.4810304","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2009.4810304","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 10th International Symposium on Quality of Electronic Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041100073","display_name":"Anshuman Chandra","orcid":"https://orcid.org/0000-0002-2686-3918"},"institutions":[{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]},{"id":"https://openalex.org/I1335490905","display_name":"Synopsys (Switzerland)","ror":"https://ror.org/03mb54f81","country_code":"CH","type":"company","lineage":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"]}],"countries":["CH","US"],"is_corresponding":true,"raw_author_name":"A. Chandra","raw_affiliation_strings":["Synopsys, Inc., Mountain View, CA, USA","Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Synopsys, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210088951"]},{"raw_affiliation_string":"Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA#TAB#","institution_ids":["https://openalex.org/I1335490905"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023215444","display_name":"Yasunari Kanzawa","orcid":null},"institutions":[{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]},{"id":"https://openalex.org/I1335490905","display_name":"Synopsys (Switzerland)","ror":"https://ror.org/03mb54f81","country_code":"CH","type":"company","lineage":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"]}],"countries":["CH","US"],"is_corresponding":false,"raw_author_name":"Y. Kanzawa","raw_affiliation_strings":["Synopsys, Inc., Mountain View, CA, USA","Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Synopsys, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210088951"]},{"raw_affiliation_string":"Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA#TAB#","institution_ids":["https://openalex.org/I1335490905"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113108497","display_name":"R. Kapur","orcid":null},"institutions":[{"id":"https://openalex.org/I1335490905","display_name":"Synopsys (Switzerland)","ror":"https://ror.org/03mb54f81","country_code":"CH","type":"company","lineage":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"]},{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]}],"countries":["CH","US"],"is_corresponding":false,"raw_author_name":"R. Kapur","raw_affiliation_strings":["Synopsys, Inc., Mountain View, CA, USA","Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Synopsys, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210088951"]},{"raw_affiliation_string":"Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, 94043, USA#TAB#","institution_ids":["https://openalex.org/I1335490905"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5041100073"],"corresponding_institution_ids":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"],"apc_list":null,"apc_paid":null,"fwci":0.5276,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.68090775,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"260","last_page":"265"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13293","display_name":"Engineering and Test Systems","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/scan-chain","display_name":"Scan chain","score":0.8336995840072632},{"id":"https://openalex.org/keywords/test-compression","display_name":"Test compression","score":0.7230748534202576},{"id":"https://openalex.org/keywords/data-compression","display_name":"Data compression","score":0.6726514101028442},{"id":"https://openalex.org/keywords/compression","display_name":"Compression (physics)","score":0.6520228981971741},{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.6338536739349365},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6079012155532837},{"id":"https://openalex.org/keywords/compression-ratio","display_name":"Compression ratio","score":0.6075423955917358},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.549872636795044},{"id":"https://openalex.org/keywords/design-for-testing","display_name":"Design for testing","score":0.5468487739562988},{"id":"https://openalex.org/keywords/span","display_name":"Span (engineering)","score":0.5090255737304688},{"id":"https://openalex.org/keywords/gas-compressor","display_name":"Gas compressor","score":0.4545648396015167},{"id":"https://openalex.org/keywords/test-data","display_name":"Test data","score":0.43285804986953735},{"id":"https://openalex.org/keywords/boundary-scan","display_name":"Boundary scan","score":0.42523786425590515},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3279488682746887},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.2413371205329895},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.2010558843612671},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.16261741518974304},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15784266591072083},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.13362783193588257},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.10885599255561829},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.09159490466117859},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.08957028388977051}],"concepts":[{"id":"https://openalex.org/C150012182","wikidata":"https://www.wikidata.org/wiki/Q225990","display_name":"Scan chain","level":3,"score":0.8336995840072632},{"id":"https://openalex.org/C29652920","wikidata":"https://www.wikidata.org/wiki/Q7705757","display_name":"Test compression","level":4,"score":0.7230748534202576},{"id":"https://openalex.org/C78548338","wikidata":"https://www.wikidata.org/wiki/Q2493","display_name":"Data compression","level":2,"score":0.6726514101028442},{"id":"https://openalex.org/C180016635","wikidata":"https://www.wikidata.org/wiki/Q2712821","display_name":"Compression (physics)","level":2,"score":0.6520228981971741},{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.6338536739349365},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6079012155532837},{"id":"https://openalex.org/C25797200","wikidata":"https://www.wikidata.org/wiki/Q828137","display_name":"Compression ratio","level":3,"score":0.6075423955917358},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.549872636795044},{"id":"https://openalex.org/C190874656","wikidata":"https://www.wikidata.org/wiki/Q5264347","display_name":"Design for testing","level":3,"score":0.5468487739562988},{"id":"https://openalex.org/C2778753569","wikidata":"https://www.wikidata.org/wiki/Q1960395","display_name":"Span (engineering)","level":2,"score":0.5090255737304688},{"id":"https://openalex.org/C131097465","wikidata":"https://www.wikidata.org/wiki/Q178898","display_name":"Gas compressor","level":2,"score":0.4545648396015167},{"id":"https://openalex.org/C16910744","wikidata":"https://www.wikidata.org/wiki/Q7705759","display_name":"Test data","level":2,"score":0.43285804986953735},{"id":"https://openalex.org/C992767","wikidata":"https://www.wikidata.org/wiki/Q895156","display_name":"Boundary scan","level":3,"score":0.42523786425590515},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3279488682746887},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.2413371205329895},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.2010558843612671},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.16261741518974304},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15784266591072083},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.13362783193588257},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.10885599255561829},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.09159490466117859},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.08957028388977051},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C511840579","wikidata":"https://www.wikidata.org/wiki/Q12757","display_name":"Internal combustion engine","level":2,"score":0.0},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2009.4810304","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2009.4810304","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 10th International Symposium on Quality of Electronic Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1537947280","https://openalex.org/W1560011026","https://openalex.org/W1590110141","https://openalex.org/W1592824829","https://openalex.org/W1601643892","https://openalex.org/W1844723944","https://openalex.org/W2019631303","https://openalex.org/W2086496477","https://openalex.org/W2087289986","https://openalex.org/W2089307526","https://openalex.org/W2097417935","https://openalex.org/W2120483435","https://openalex.org/W2139009001","https://openalex.org/W2169280266","https://openalex.org/W3172446671","https://openalex.org/W4233616805","https://openalex.org/W4246650320"],"related_works":["https://openalex.org/W2127184179","https://openalex.org/W3088373974","https://openalex.org/W2160753176","https://openalex.org/W1982916741","https://openalex.org/W2049913894","https://openalex.org/W4230966676","https://openalex.org/W2520108610","https://openalex.org/W2111803469","https://openalex.org/W2129020400","https://openalex.org/W2158619360"],"abstract_inverted_index":{"Scan":[0,35],"Compression":[1,36],"has":[2],"become":[3],"an":[4],"integral":[5],"part":[6],"of":[7,27],"today's":[8],"design-for-test":[9],"(DFT)":[10],"methodology":[11],"for":[12,54],"achieving":[13],"high":[14,76],"quality":[15],"test":[16,106],"at":[17],"lower":[18,105],"costs.":[19],"Just":[20],"as":[21],"scan":[22,47,51,60],"matured":[23],"over":[24],"a":[25],"span":[26],"40":[28],"years":[29],"we":[30,41],"are":[31],"going":[32],"to":[33,46,72,88],"see":[34],"improve.":[37],"In":[38],"this":[39,97],"paper":[40],"present":[42],"one":[43],"such":[44],"improvement":[45],"compression.":[48],"An":[49],"intelligent":[50],"chain":[52],"design":[53],"proactively":[55],"managing":[56],"the":[57,82],"Xs":[58],"in":[59],"compression":[61,102],"architectures":[62],"is":[63,70],"presented.":[64],"In-depth":[65],"analysis":[66],"via":[67],"experimental":[68],"data":[69,107],"used":[71],"show":[73,95],"that":[74,96],"very":[75],"X-tolerance":[77],"can":[78],"be":[79],"achieved":[80],"using":[81],"proposed":[83],"technique":[84],"without":[85],"any":[86],"changes":[87],"ATPG":[89],"or":[90],"compressor":[91],"architecture.":[92],"We":[93],"also":[94],"eventually":[98],"translates":[99],"into":[100],"higher":[101],"ratio":[103],"and":[104],"volume.":[108]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}