{"id":"https://openalex.org/W2137743790","doi":"https://doi.org/10.1109/isqed.2008.4479851","title":"Towards Uniform Temperature Distribution in SOI Circuits Using Carbon Nanotube Based Thermal Interconnect","display_name":"Towards Uniform Temperature Distribution in SOI Circuits Using Carbon Nanotube Based Thermal Interconnect","publication_year":2008,"publication_date":"2008-03-01","ids":{"openalex":"https://openalex.org/W2137743790","doi":"https://doi.org/10.1109/isqed.2008.4479851","mag":"2137743790"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2008.4479851","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2008.4479851","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"9th International Symposium on Quality Electronic Design (isqed 2008)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5056385527","display_name":"Yu Zhou","orcid":"https://orcid.org/0000-0001-7729-4893"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yu Zhou","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, USA","Case Western Reserve University , Cleveland"],"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, USA","institution_ids":["https://openalex.org/I58956616"]},{"raw_affiliation_string":"Case Western Reserve University , Cleveland","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100619726","display_name":"Somnath Paul","orcid":"https://orcid.org/0009-0001-6344-5934"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Somnath Paul","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, USA","Case Western Reserve University , Cleveland"],"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, USA","institution_ids":["https://openalex.org/I58956616"]},{"raw_affiliation_string":"Case Western Reserve University , Cleveland","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039442844","display_name":"Swarup Bhunia","orcid":"https://orcid.org/0000-0001-6082-6961"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Swarup Bhunia","raw_affiliation_strings":["Department of EECS, Case Western Reserve University, USA","Case Western Reserve University , Cleveland"],"affiliations":[{"raw_affiliation_string":"Department of EECS, Case Western Reserve University, USA","institution_ids":["https://openalex.org/I58956616"]},{"raw_affiliation_string":"Case Western Reserve University , Cleveland","institution_ids":["https://openalex.org/I58956616"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5056385527"],"corresponding_institution_ids":["https://openalex.org/I58956616"],"apc_list":null,"apc_paid":null,"fwci":0.1695,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.53832768,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"2","issue":null,"first_page":"861","last_page":"866"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10074","display_name":"Carbon Nanotubes in Composites","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/overheating","display_name":"Overheating (electricity)","score":0.8026460409164429},{"id":"https://openalex.org/keywords/carbon-nanotube","display_name":"Carbon nanotube","score":0.7452267408370972},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7272348999977112},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.6764758825302124},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.6112127304077148},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6012454032897949},{"id":"https://openalex.org/keywords/thermal-conduction","display_name":"Thermal conduction","score":0.5801597237586975},{"id":"https://openalex.org/keywords/hotspot","display_name":"Hotspot (geology)","score":0.5589472651481628},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.5477461814880371},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.4953266680240631},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.49090486764907837},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4849832057952881},{"id":"https://openalex.org/keywords/heat-spreader","display_name":"Heat spreader","score":0.4471453130245209},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.3899807035923004},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3190244436264038},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.26472926139831543},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2584376335144043},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14524176716804504},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.1422279179096222},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10111960768699646},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.08551400899887085}],"concepts":[{"id":"https://openalex.org/C2778284599","wikidata":"https://www.wikidata.org/wiki/Q25340000","display_name":"Overheating (electricity)","level":2,"score":0.8026460409164429},{"id":"https://openalex.org/C513720949","wikidata":"https://www.wikidata.org/wiki/Q1778729","display_name":"Carbon nanotube","level":2,"score":0.7452267408370972},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7272348999977112},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.6764758825302124},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.6112127304077148},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6012454032897949},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.5801597237586975},{"id":"https://openalex.org/C146481406","wikidata":"https://www.wikidata.org/wiki/Q105131","display_name":"Hotspot (geology)","level":2,"score":0.5589472651481628},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.5477461814880371},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.4953266680240631},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.49090486764907837},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4849832057952881},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.4471453130245209},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.3899807035923004},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3190244436264038},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.26472926139831543},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2584376335144043},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14524176716804504},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.1422279179096222},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10111960768699646},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.08551400899887085},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2008.4479851","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2008.4479851","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"9th International Symposium on Quality Electronic Design (isqed 2008)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.6700000166893005,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W65564217","https://openalex.org/W1510178332","https://openalex.org/W1972347761","https://openalex.org/W2007199461","https://openalex.org/W2037061839","https://openalex.org/W2044176795","https://openalex.org/W2048839795","https://openalex.org/W2052412866","https://openalex.org/W2053692730","https://openalex.org/W2102545313","https://openalex.org/W2111235106","https://openalex.org/W2130283655","https://openalex.org/W2144282368","https://openalex.org/W2154857344","https://openalex.org/W2162743707","https://openalex.org/W2170116274","https://openalex.org/W2542527983","https://openalex.org/W4235029849","https://openalex.org/W4242709831","https://openalex.org/W6602628681","https://openalex.org/W6661819960","https://openalex.org/W6682624730"],"related_works":["https://openalex.org/W1017676683","https://openalex.org/W2059344729","https://openalex.org/W2363393132","https://openalex.org/W2105641348","https://openalex.org/W4283704898","https://openalex.org/W1970519079","https://openalex.org/W2115443918","https://openalex.org/W1998778412","https://openalex.org/W2152436995","https://openalex.org/W2797447523"],"abstract_inverted_index":{"Increasing":[0],"power":[1],"density":[2],"(due":[3],"to":[4,25,35,62,73,107,133],"faster":[5],"clock":[6],"and":[7,23,154],"high":[8,49],"device":[9],"integration":[10],"density)":[11],"coupled":[12],"with":[13],"limited":[14],"cooling":[15],"capacity":[16],"of":[17,48,64,126,136,164],"the":[18,42,53,99,124,152,162],"package":[19],"causes":[20],"die":[21],"overheating":[22],"leads":[24],"reliability":[26,38],"concerns.":[27],"In":[28],"this":[29],"paper,":[30],"we":[31,140],"present":[32],"a":[33,46,56,134,143],"methodology":[34],"mitigate":[36],"temperature-induced":[37],"problems":[39],"by":[40],"transferring":[41],"heat":[43,83,101,129],"dissipated":[44],"in":[45,55,110,149,159],"region":[47,135],"activity":[50,66,138],"(such":[51,67],"as":[52,68,78,142],"ALU":[54],"processor":[57],"that":[58,98,123],"creates":[59],"localized":[60],"\"hotspot\")":[61],"regions":[63],"lower":[65,137],"on-chip":[69],"cache).":[70],"We":[71,96],"propose":[72],"use":[74,125],"carbon":[75],"nanotubes":[76],"(CNTs)":[77],"\"thermal":[79],"interconnect\"":[80],"for":[81,128],"on-die":[82],"transfer":[84,102],"since":[85],"CNTs":[86,127],"have":[87],"significantly":[88],"higher":[89],"thermal":[90,108,118],"conductivity":[91],"than":[92],"typical":[93],"heat-spreader":[94],"materials.":[95],"note":[97],"proposed":[100],"framework":[103],"is":[104],"particularly":[105],"suitable":[106],"management":[109],"silicon-on-insulator":[111],"(SOI)":[112],"devices,":[113],"which":[114],"suffer":[115],"from":[116,131],"fine-grained":[117],"gradient.":[119],"Simulation":[120],"results":[121],"indicate":[122],"conduction":[130],"hotspot":[132,153],"(which":[139],"denote":[141],"'coolspot'),":[144],"achieves":[145],"13%":[146],"(16degC)":[147],"decrease":[148],"temperature":[150,160],"at":[151,161],"only":[155],"3%":[156],"(1.5degC)":[157],"increase":[158],"coolspot":[163],"an":[165],"alpha":[166],"microprocessor":[167],"model.":[168]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}