{"id":"https://openalex.org/W2170530453","doi":"https://doi.org/10.1109/isqed.2004.1283680","title":"Circuit level reliability analysis of Cu interconnects","display_name":"Circuit level reliability analysis of Cu interconnects","publication_year":2004,"publication_date":"2004-05-06","ids":{"openalex":"https://openalex.org/W2170530453","doi":"https://doi.org/10.1109/isqed.2004.1283680","mag":"2170530453"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2004.1283680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283680","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113022729","display_name":"S. M. Alam","orcid":null},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S.M. Alam","raw_affiliation_strings":["Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Gan Chee Lip","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Gan Chee Lip","raw_affiliation_strings":["School of Materials Engineering, Nanyang Technological University, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Engineering, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026389537","display_name":"Carl V. Thompson","orcid":"https://orcid.org/0000-0002-0121-8285"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"C.V. Thompson","raw_affiliation_strings":["School of Materials Engineering, Nanyang Technological University, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Engineering, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5025791255","display_name":"Donald E. Troxel","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"D.E. Troxel","raw_affiliation_strings":["School of Materials Engineering, Nanyang Technological University, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Engineering, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":12.0901,"has_fulltext":false,"cited_by_count":40,"citation_normalized_percentile":{"value":0.99478001,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"238","last_page":"243"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9962999820709229,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.8600866794586182},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.8274875283241272},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6869903206825256},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6052621006965637},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6047000885009766},{"id":"https://openalex.org/keywords/circuit-reliability","display_name":"Circuit reliability","score":0.49439477920532227},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.42555463314056396},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3263903260231018},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18338245153427124},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.14608776569366455},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.13239291310310364},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1251121163368225}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.8600866794586182},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.8274875283241272},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6869903206825256},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6052621006965637},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6047000885009766},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.49439477920532227},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.42555463314056396},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3263903260231018},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18338245153427124},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.14608776569366455},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.13239291310310364},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1251121163368225},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isqed.2004.1283680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283680","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.490.5107","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.490.5107","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www-mtl.mit.edu/researchgroups/reliability/papers/syedisqed04.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1482398762","https://openalex.org/W1884800748","https://openalex.org/W1975930457","https://openalex.org/W1989236684","https://openalex.org/W2035218557","https://openalex.org/W2069576640","https://openalex.org/W2072857924","https://openalex.org/W2083234109","https://openalex.org/W2100796383","https://openalex.org/W2142836951","https://openalex.org/W2157679806","https://openalex.org/W2161222763","https://openalex.org/W2163896657","https://openalex.org/W2170413119"],"related_works":["https://openalex.org/W2136403807","https://openalex.org/W796810817","https://openalex.org/W94455562","https://openalex.org/W2102295724","https://openalex.org/W2007694591","https://openalex.org/W2114942185","https://openalex.org/W2108010191","https://openalex.org/W14579210","https://openalex.org/W2132643932","https://openalex.org/W1729452595"],"abstract_inverted_index":{"Copper":[0],"(Cu)":[1],"based":[2,107],"interconnect":[3,77],"technology":[4,14],"is":[5,88],"expected":[6],"to":[7,28,90,94],"meet":[8],"some":[9],"of":[10,13,19,43,69,82,112,135],"the":[11,17,41,80,91,109,133],"challenges":[12],"scaling":[15],"in":[16,46,75,138],"pursuit":[18],"higher":[20],"performance.":[21],"However,":[22],"Cu":[23,76],"interconnects":[24,45],"are":[25],"still":[26],"susceptible":[27],"electromigration-induced":[29],"failure":[30],"over":[31],"time.":[32],"We":[33,59],"describe":[34],"a":[35,61,67,85,113,127],"new":[36],"hierarchical":[37],"approach":[38],"for":[39,55,98],"predicting":[40],"reliability":[42,96,105,117,122],"Cu-based":[44],"circuit":[47,130],"layouts,":[48],"and":[49,72,115,143],"present":[50],"an":[51,57],"RCAD":[52],"tool,":[53],"SysRel,":[54],"such":[56],"analysis.":[58],"propose":[60],"(jL)":[62],"product":[63],"filtering":[64,81],"algorithm":[65],"with":[66,126],"classification":[68],"separate":[70],"via-above":[71],"via-below":[73],"treatments":[74],"trees.":[78],"After":[79],"immortal":[83],"trees,":[84],"default":[86],"model":[87],"applied":[89],"remaining":[92],"trees":[93],"compute":[95],"figures":[97,118],"individual":[99,120],"units.":[100,123],"SysRel":[101],"utilizes":[102],"joint":[103],"stochastic":[104],"metrics":[106],"on":[108,146],"desired":[110],"lifetime":[111],"chip":[114],"combines":[116],"from":[119],"fundamental":[121],"Simulation":[124],"results":[125],"32-bit":[128],"comparator":[129],"layout":[131],"demonstrate":[132],"significance":[134],"our":[136],"methodology":[137],"selectively":[139],"identifying":[140],"critical":[141],"nets":[142],"their":[144],"impacts":[145],"overall":[147],"reliability.":[148]},"counts_by_year":[{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":3},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":8}],"updated_date":"2026-08-26T07:47:46.906454","created_date":"2025-10-10T00:00:00"}