{"id":"https://openalex.org/W2105083033","doi":"https://doi.org/10.1109/isqed.2004.1283679","title":"A methodology for chip-level electromigration risk assessment and product qualification","display_name":"A methodology for chip-level electromigration risk assessment and product qualification","publication_year":2004,"publication_date":"2004-05-06","ids":{"openalex":"https://openalex.org/W2105083033","doi":"https://doi.org/10.1109/isqed.2004.1283679","mag":"2105083033"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2004.1283679","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283679","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102168885","display_name":"Chanhee Oh","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chanhee Oh","raw_affiliation_strings":["Motorola, Inc., USA","Motorola Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Motorola, Inc., USA","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Motorola Incorporated","institution_ids":["https://openalex.org/I1333370159"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084780593","display_name":"H. Haznedar","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. Haznedar","raw_affiliation_strings":["Motorola, Inc., USA","Motorola Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Motorola, Inc., USA","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Motorola Incorporated","institution_ids":["https://openalex.org/I1333370159"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109086782","display_name":"M. Gall","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Gall","raw_affiliation_strings":["Motorola, Inc., USA","Motorola Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Motorola, Inc., USA","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Motorola Incorporated","institution_ids":["https://openalex.org/I1333370159"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054282980","display_name":"A. Grinshpon","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Grinshpon","raw_affiliation_strings":["Motorola, Inc., USA","Motorola Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Motorola, Inc., USA","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Motorola Incorporated","institution_ids":["https://openalex.org/I1333370159"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102740578","display_name":"V. Zolotov","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V. Zolotov","raw_affiliation_strings":["Motorola, Inc., USA","Motorola Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Motorola, Inc., USA","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Motorola Incorporated","institution_ids":["https://openalex.org/I1333370159"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022695209","display_name":"Pon Ku","orcid":null},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pon Ku","raw_affiliation_strings":["Motorola, Inc., USA","Motorola Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Motorola, Inc., USA","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Motorola Incorporated","institution_ids":["https://openalex.org/I1333370159"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5047921422","display_name":"Rajesh Panda","orcid":"https://orcid.org/0000-0002-7453-1280"},"institutions":[{"id":"https://openalex.org/I1333370159","display_name":"Motorola (United States)","ror":"https://ror.org/01hafxd32","country_code":"US","type":"company","lineage":["https://openalex.org/I1333370159"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Panda","raw_affiliation_strings":["Motorola, Inc., USA","Motorola Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Motorola, Inc., USA","institution_ids":["https://openalex.org/I1333370159"]},{"raw_affiliation_string":"Motorola Incorporated","institution_ids":["https://openalex.org/I1333370159"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4269,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.62094199,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"418","issue":null,"first_page":"232","last_page":"237"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9652031064033508},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7517483830451965},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.7057982683181763},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.7017107009887695},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.618588924407959},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5842642188072205},{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.5516987442970276},{"id":"https://openalex.org/keywords/macro","display_name":"Macro","score":0.5252318382263184},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5028292536735535},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5002021789550781},{"id":"https://openalex.org/keywords/filter","display_name":"Filter (signal processing)","score":0.45992311835289},{"id":"https://openalex.org/keywords/limit","display_name":"Limit (mathematics)","score":0.4572245180606842},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.30356061458587646},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.264678418636322},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2254481017589569},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18961820006370544},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10301798582077026},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.08438876271247864}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9652031064033508},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7517483830451965},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.7057982683181763},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.7017107009887695},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.618588924407959},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5842642188072205},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.5516987442970276},{"id":"https://openalex.org/C166955791","wikidata":"https://www.wikidata.org/wiki/Q629579","display_name":"Macro","level":2,"score":0.5252318382263184},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5028292536735535},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5002021789550781},{"id":"https://openalex.org/C106131492","wikidata":"https://www.wikidata.org/wiki/Q3072260","display_name":"Filter (signal processing)","level":2,"score":0.45992311835289},{"id":"https://openalex.org/C151201525","wikidata":"https://www.wikidata.org/wiki/Q177239","display_name":"Limit (mathematics)","level":2,"score":0.4572245180606842},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.30356061458587646},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.264678418636322},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2254481017589569},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18961820006370544},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10301798582077026},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08438876271247864},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2004.1283679","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283679","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1878706723","https://openalex.org/W1884800748","https://openalex.org/W1996717580","https://openalex.org/W2036537371","https://openalex.org/W2064957549","https://openalex.org/W2067779932","https://openalex.org/W2083090974","https://openalex.org/W2097519580","https://openalex.org/W2123793459","https://openalex.org/W2130459377","https://openalex.org/W2160936920","https://openalex.org/W2163896657","https://openalex.org/W2167232953","https://openalex.org/W6666920523"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2364197307","https://openalex.org/W4381800218","https://openalex.org/W2136403807","https://openalex.org/W796810817","https://openalex.org/W2018755015"],"abstract_inverted_index":{"Even":[0],"after":[1],"the":[2,8,17,33,39,46,80,99,131,180,183],"successful":[3],"introduction":[4,34],"of":[5,16,35,45,59,103,116,133,164,182],"Cu-based":[6],"metallization,":[7],"electromigration":[9],"(EM)":[10],"failure":[11],"risk":[12],"has":[13,88],"remained":[14],"one":[15],"most":[18,23],"important":[19],"reliability":[20,62,97],"concerns":[21],"for":[22,118,137,153,191],"advanced":[24],"process":[25,41],"technologies.":[26],"Ever":[27],"increasing":[28],"operating":[29],"current":[30,65],"densities":[31],"and":[32,166,168,172],"low-k":[36],"materials":[37],"in":[38,74,105,122,156],"back-end":[40],"scheme":[42],"are":[43],"some":[44],"issues":[47],"that":[48],"threaten":[49],"reliable,":[50],"long-term":[51],"operation":[52],"at":[53,79],"elevated":[54],"temperatures.":[55],"The":[56,159],"traditional":[57],"method":[58,148,161],"verifying":[60],"EM":[61,84,96],"only":[63],"through":[64],"density":[66],"limit":[67],"checks":[68],"is":[69,142],"proving":[70],"to":[71,91,129,149,170],"be":[72,109],"inadequate":[73],"general,":[75],"or":[76],"quite":[77],"expensive":[78],"best.":[81],"A":[82],"Statistical":[83],"Budgeting":[85],"(SEB)":[86],"methodology":[87],"been":[89],"proposed":[90,160,184],"assess":[92],"more":[93],"realistic":[94],"chip-level":[95],"from":[98],"complex":[100],"statistical":[101],"distribution":[102],"currents":[104,117,151],"a":[106,123,135,157,187,195],"chip.":[107,124,158],"To":[108],"valuable,":[110],"this":[111],"approach":[112,185],"requires":[113],"accurate":[114],"estimation":[115],"all":[119,154],"interconnect":[120],"segments":[121],"However,":[125],"no":[126],"efficient":[127,147],"technique":[128],"manage":[130],"complexity":[132],"such":[134],"task":[136],"very":[138],"large":[139],"chip":[140],"designs":[141],"known.":[143],"We":[144,178],"present":[145],"an":[146],"estimate":[150],"exhaustively":[152],"interconnects":[155],"uses":[162],"precharacterization":[163],"cells":[165],"macros,":[167],"steps":[169],"identify":[171],"filter":[173],"out":[174],"symmetrically":[175],"bi-directional":[176],"interconnects.":[177],"illustrate":[179],"strength":[181],"using":[186],"high-performance":[188],"microprocessor":[189],"design":[190],"embedded":[192],"applications":[193],"as":[194],"case":[196],"study.":[197]},"counts_by_year":[{"year":2017,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}