{"id":"https://openalex.org/W1905450206","doi":"https://doi.org/10.1109/isqed.2004.1283672","title":"Flip chip advanced package solder joint embrittlement fault isolation using TDR","display_name":"Flip chip advanced package solder joint embrittlement fault isolation using TDR","publication_year":2004,"publication_date":"2004-05-06","ids":{"openalex":"https://openalex.org/W1905450206","doi":"https://doi.org/10.1109/isqed.2004.1283672","mag":"1905450206"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2004.1283672","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283672","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5060081610","display_name":"R.P. Cruz","orcid":null},"institutions":[{"id":"https://openalex.org/I68887363","display_name":"Amkor Technology (United States)","ror":"https://ror.org/04bdj7239","country_code":"US","type":"company","lineage":["https://openalex.org/I68887363"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"R.P. Cruz","raw_affiliation_strings":["Amkor Technology Philippines","Amkor Technology, Philippines"],"affiliations":[{"raw_affiliation_string":"Amkor Technology Philippines","institution_ids":[]},{"raw_affiliation_string":"Amkor Technology, Philippines","institution_ids":["https://openalex.org/I68887363"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5060081610"],"corresponding_institution_ids":["https://openalex.org/I68887363"],"apc_list":null,"apc_paid":null,"fwci":0.6583,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.69613651,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"190","last_page":"195"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/waveform","display_name":"Waveform","score":0.6635543704032898},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.6474961042404175},{"id":"https://openalex.org/keywords/reflectometry","display_name":"Reflectometry","score":0.6346149444580078},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.616226315498352},{"id":"https://openalex.org/keywords/joint","display_name":"Joint (building)","score":0.5469019412994385},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5393099784851074},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.5152764320373535},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4569880962371826},{"id":"https://openalex.org/keywords/embrittlement","display_name":"Embrittlement","score":0.43315377831459045},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.42976728081703186},{"id":"https://openalex.org/keywords/time-domain","display_name":"Time domain","score":0.32177460193634033},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.29688113927841187},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.29071593284606934},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2254096269607544},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.21716010570526123},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.1348353922367096}],"concepts":[{"id":"https://openalex.org/C197424946","wikidata":"https://www.wikidata.org/wiki/Q1165717","display_name":"Waveform","level":3,"score":0.6635543704032898},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.6474961042404175},{"id":"https://openalex.org/C2778925768","wikidata":"https://www.wikidata.org/wiki/Q3454718","display_name":"Reflectometry","level":3,"score":0.6346149444580078},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.616226315498352},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.5469019412994385},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5393099784851074},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.5152764320373535},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4569880962371826},{"id":"https://openalex.org/C142282041","wikidata":"https://www.wikidata.org/wiki/Q2919530","display_name":"Embrittlement","level":2,"score":0.43315377831459045},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42976728081703186},{"id":"https://openalex.org/C103824480","wikidata":"https://www.wikidata.org/wiki/Q185889","display_name":"Time domain","level":2,"score":0.32177460193634033},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29688113927841187},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.29071593284606934},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2254096269607544},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.21716010570526123},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.1348353922367096},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2004.1283672","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283672","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2086209657","https://openalex.org/W1900362976","https://openalex.org/W2971284929","https://openalex.org/W3184095098","https://openalex.org/W4247269142","https://openalex.org/W2396133027","https://openalex.org/W2084522216","https://openalex.org/W2169212713","https://openalex.org/W1965835773","https://openalex.org/W1493885512"],"abstract_inverted_index":{"Time":[0],"Domain":[1],"Reflectometry":[2],"(TDR)":[3],"is":[4,58],"a":[5,22],"non-destructive":[6],"failure":[7,52,104,128],"analysis":[8,114],"technique":[9],"that":[10,24],"identifies":[11],"the":[12,29,33,38,48,51,62,66,87,120,124,127],"location":[13,49],"of":[14,45,50,79,89,126],"an":[15],"open":[16],"or":[17,91,98],"short":[18],"failure.":[19],"It":[20],"utilizes":[21],"system":[23],"sends":[25],"electrical":[26,43],"pulses":[27],"through":[28],"sample":[30],"and":[31,41,123],"measures":[32],"reflected":[34],"signal.":[35],"By":[36,110],"examining":[37],"polarity,":[39],"amplitude,":[40],"other":[42],"signatures":[44],"all":[46],"reflections,":[47],"can":[53,115,129],"be":[54,116,130],"easily":[55],"identified.":[56],"This":[57],"done":[59],"by":[60],"comparing":[61],"waveform":[63],"obtained":[64,72],"from":[65,73],"device":[67],"being":[68],"tested":[69],"with":[70,101],"those":[71],"known-good":[74],"samples.":[75],"The":[76],"recent":[77],"application":[78],"TDR":[80],"on":[81,119],"advanced":[82],"packages":[83],"has":[84],"lead":[85],"to":[86,93],"development":[88],"ways":[90],"methods":[92],"fault":[94],"isolate":[95],"flip":[96],"chip":[97],"BGAs,":[99],"even":[100],"low":[102],"level":[103],"such":[105],"as":[106],"solder":[107],"joint":[108],"embrittlement.":[109],"utilizing":[111],"TDR,":[112],"further":[113],"accurately":[117],"focused":[118],"failing":[121],"spot":[122],"cause":[125],"determined":[131],"efficiently.":[132]},"counts_by_year":[{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}