{"id":"https://openalex.org/W2145439265","doi":"https://doi.org/10.1109/isqed.2004.1283667","title":"Layout printability optimization using a silicon simulation methodology","display_name":"Layout printability optimization using a silicon simulation methodology","publication_year":2004,"publication_date":"2004-05-06","ids":{"openalex":"https://openalex.org/W2145439265","doi":"https://doi.org/10.1109/isqed.2004.1283667","mag":"2145439265"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2004.1283667","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283667","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061153850","display_name":"Michel C\u00f4t\u00e9","orcid":null},"institutions":[{"id":"https://openalex.org/I1335490905","display_name":"Synopsys (Switzerland)","ror":"https://ror.org/03mb54f81","country_code":"CH","type":"company","lineage":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"]},{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]}],"countries":["CH","US"],"is_corresponding":true,"raw_author_name":"M. Cote","raw_affiliation_strings":["Synopsys, Inc., USA","Synopsys. Inc.#TAB#"],"affiliations":[{"raw_affiliation_string":"Synopsys, Inc., USA","institution_ids":["https://openalex.org/I4210088951"]},{"raw_affiliation_string":"Synopsys. Inc.#TAB#","institution_ids":["https://openalex.org/I1335490905"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5003851618","display_name":"Philippe Hurat","orcid":null},"institutions":[{"id":"https://openalex.org/I1335490905","display_name":"Synopsys (Switzerland)","ror":"https://ror.org/03mb54f81","country_code":"CH","type":"company","lineage":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"]},{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]}],"countries":["CH","US"],"is_corresponding":false,"raw_author_name":"P. Hurat","raw_affiliation_strings":["Synopsys, Inc., USA","Synopsys. Inc.#TAB#"],"affiliations":[{"raw_affiliation_string":"Synopsys, Inc., USA","institution_ids":["https://openalex.org/I4210088951"]},{"raw_affiliation_string":"Synopsys. Inc.#TAB#","institution_ids":["https://openalex.org/I1335490905"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5061153850"],"corresponding_institution_ids":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"],"apc_list":null,"apc_paid":null,"fwci":3.7266,"has_fulltext":false,"cited_by_count":31,"citation_normalized_percentile":{"value":0.93226344,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"159","last_page":"164"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.9372851252555847},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6529536247253418},{"id":"https://openalex.org/keywords/abstraction","display_name":"Abstraction","score":0.6008701324462891},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5426926612854004},{"id":"https://openalex.org/keywords/integrated-circuit-layout","display_name":"Integrated circuit layout","score":0.49993276596069336},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4929163455963135},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.48868492245674133},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3304380774497986},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.2377265989780426},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20473915338516235},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.1314898133277893},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1106087863445282}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.9372851252555847},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6529536247253418},{"id":"https://openalex.org/C124304363","wikidata":"https://www.wikidata.org/wiki/Q673661","display_name":"Abstraction","level":2,"score":0.6008701324462891},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5426926612854004},{"id":"https://openalex.org/C2765594","wikidata":"https://www.wikidata.org/wiki/Q2624187","display_name":"Integrated circuit layout","level":3,"score":0.49993276596069336},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4929163455963135},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.48868492245674133},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3304380774497986},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2377265989780426},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20473915338516235},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1314898133277893},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1106087863445282},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isqed.2004.1283667","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2004.1283667","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.458.691","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.458.691","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.cs.york.ac.uk/rts/docs/SIGDA-Compendium-1994-2004/papers/2004/isqed04/pdffiles/p159.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1981223645","https://openalex.org/W2063284678","https://openalex.org/W2760659898","https://openalex.org/W6645826056","https://openalex.org/W6744708597"],"related_works":["https://openalex.org/W2157255030","https://openalex.org/W2147584640","https://openalex.org/W2048044560","https://openalex.org/W3129613221","https://openalex.org/W3012974818","https://openalex.org/W3146205511","https://openalex.org/W2005047684","https://openalex.org/W1494240561","https://openalex.org/W2467322885","https://openalex.org/W2172251471"],"abstract_inverted_index":{"The":[0,16,89,101],"manufacturing":[1,87],"complexity":[2],"at":[3],"the":[4,14,33,43,77,99],"90":[5],"nm":[6,9],"and":[7,76,115],"65":[8],"technology":[10],"nodes":[11],"severely":[12],"impacts":[13],"design.":[15],"traditional":[17],"use":[18],"of":[19,29,42],"design":[20],"rule":[21],"based":[22,106],"verification":[23],"is":[24,63],"no":[25],"longer":[26],"a":[27,60,85],"guarantee":[28],"high":[30],"yield":[31],"once":[32],"chip":[34],"has":[35],"been":[36],"manufactured.":[37],"This":[38],"paper":[39],"describes":[40],"many":[41],"trends":[44],"behind":[45],"this":[46,66,108],"phenomenon.":[47],"A":[48],"new":[49,67],"approach":[50,58,62],"to":[51,59,94,110],"layout":[52],"that":[53],"moves":[54],"from":[55],"an":[56],"abstraction":[57],"modeling":[61],"proposed.":[64],"In":[65],"methodology,":[68],"layouts":[69,102],"are":[70,79,92,103],"processed":[71],"using":[72,81],"resolution":[73],"enhancement":[74],"techniques":[75],"results":[78,91],"simulated":[80],"lithographical":[82],"models":[83],"for":[84],"specific":[86],"process.":[88],"simulation":[90],"used":[93],"identify":[95],"critical":[96],"regions":[97],"in":[98],"layouts.":[100],"then":[104],"optimized":[105],"on":[107],"analysis":[109],"improve":[111],"their":[112],"printability,":[113],"manufacturability":[114],"yield.":[116]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}