{"id":"https://openalex.org/W4391183473","doi":"https://doi.org/10.1109/isocc59558.2023.10396233","title":"Signal integrity analysis of heterogeneous integration using Si bridge technology","display_name":"Signal integrity analysis of heterogeneous integration using Si bridge technology","publication_year":2023,"publication_date":"2023-10-25","ids":{"openalex":"https://openalex.org/W4391183473","doi":"https://doi.org/10.1109/isocc59558.2023.10396233"},"language":"en","primary_location":{"id":"doi:10.1109/isocc59558.2023.10396233","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc59558.2023.10396233","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 20th International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113484130","display_name":"Yong-Nam Koh","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147982","display_name":"NHN (South Korea)","ror":"https://ror.org/03x1nzy67","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210147982"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Yong-Nam Koh","raw_affiliation_strings":["HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","institution_ids":["https://openalex.org/I4210147982"]},{"raw_affiliation_string":"HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101543449","display_name":"Ju\u2010Hyung Kim","orcid":"https://orcid.org/0000-0002-0925-3368"},"institutions":[{"id":"https://openalex.org/I4210147982","display_name":"NHN (South Korea)","ror":"https://ror.org/03x1nzy67","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210147982"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ju-Hyung Kim","raw_affiliation_strings":["HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","institution_ids":["https://openalex.org/I4210147982"]},{"raw_affiliation_string":"HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082808752","display_name":"Soo-Jeong Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147982","display_name":"NHN (South Korea)","ror":"https://ror.org/03x1nzy67","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210147982"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Soo-Jeong Kim","raw_affiliation_strings":["HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","institution_ids":["https://openalex.org/I4210147982"]},{"raw_affiliation_string":"HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101296211","display_name":"Ju-Hwan Jang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147982","display_name":"NHN (South Korea)","ror":"https://ror.org/03x1nzy67","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210147982"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ju-Hwan Jang","raw_affiliation_strings":["HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","institution_ids":["https://openalex.org/I4210147982"]},{"raw_affiliation_string":"HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027010503","display_name":"Jaesung Lim","orcid":"https://orcid.org/0000-0003-0080-9398"},"institutions":[{"id":"https://openalex.org/I4210147982","display_name":"NHN (South Korea)","ror":"https://ror.org/03x1nzy67","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210147982"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jae-Sung Lim","raw_affiliation_strings":["HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","institution_ids":["https://openalex.org/I4210147982"]},{"raw_affiliation_string":"HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037419964","display_name":"Jayden Donghyun Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147982","display_name":"NHN (South Korea)","ror":"https://ror.org/03x1nzy67","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210147982"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jayden Donghyun Kim","raw_affiliation_strings":["HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"HANA Micron, Inc.,Seongnam-si,Gyeonggi-do,Korea","institution_ids":["https://openalex.org/I4210147982"]},{"raw_affiliation_string":"HANA Micron, Inc., Seongnam-si, Gyeonggi-do, Korea","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5113484130"],"corresponding_institution_ids":["https://openalex.org/I4210147982"],"apc_list":null,"apc_paid":null,"fwci":0.1339,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.48348969,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"221","last_page":"222"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9879999756813049,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9819999933242798,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bridge","display_name":"Bridge (graph theory)","score":0.5986607670783997},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5822699666023254},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.4914737939834595},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.4557076096534729},{"id":"https://openalex.org/keywords/signal-processing","display_name":"Signal processing","score":0.43891578912734985},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33941206336021423},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2151949405670166},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.16151705384254456},{"id":"https://openalex.org/keywords/digital-signal-processing","display_name":"Digital signal processing","score":0.15737852454185486},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.1075747013092041},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.07109099626541138}],"concepts":[{"id":"https://openalex.org/C100776233","wikidata":"https://www.wikidata.org/wiki/Q2532492","display_name":"Bridge (graph theory)","level":2,"score":0.5986607670783997},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5822699666023254},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.4914737939834595},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4557076096534729},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.43891578912734985},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33941206336021423},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2151949405670166},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.16151705384254456},{"id":"https://openalex.org/C84462506","wikidata":"https://www.wikidata.org/wiki/Q173142","display_name":"Digital signal processing","level":2,"score":0.15737852454185486},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.1075747013092041},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.07109099626541138},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C126322002","wikidata":"https://www.wikidata.org/wiki/Q11180","display_name":"Internal medicine","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isocc59558.2023.10396233","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc59558.2023.10396233","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 20th International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2165428542","https://openalex.org/W2976911658","https://openalex.org/W4380085930","https://openalex.org/W4385525225","https://openalex.org/W4385532381"],"related_works":["https://openalex.org/W2289987414","https://openalex.org/W2386114299","https://openalex.org/W2766876417","https://openalex.org/W2347291799","https://openalex.org/W2350165513","https://openalex.org/W2372709865","https://openalex.org/W2017275349","https://openalex.org/W2378013451","https://openalex.org/W268271086","https://openalex.org/W2152497386"],"abstract_inverted_index":{"As":[0],"Moore\u2019s":[1],"Law":[2],"approaches":[3],"physical":[4],"limitations,":[5],"2.5D":[6,71],"advanced":[7,72],"packaging":[8,73],"technologies":[9],"using":[10,75],"silicon":[11],"(Si)":[12],"interposer,":[13,17],"redistribution":[14],"layers":[15,97],"(RDL)":[16],"and":[18,35],"Si":[19,76,89,99],"bridge,":[20],"which":[21,63],"enable":[22],"high-density":[23],"electrical":[24,102],"connection":[25],"between":[26],"logic":[27],"dies":[28,37],"such":[29,38],"as":[30,39],"Neural":[31],"Processing":[32],"Unit":[33],"(NPU)":[34],"memory":[36],"High":[40],"Bandwidth":[41],"Memory":[42],"(HBM)":[43],"with":[44,88],"IC":[45],"substrate,":[46],"are":[47],"steadily":[48],"being":[49],"developed.":[50],"In":[51],"this":[52],"paper,":[53],"we":[54],"tried":[55],"to":[56,68],"introduce":[57],"Heterogeneously":[58],"Integrated":[59],"Chips":[60],"trademark":[61],"(HIC\u2122)":[62],"is":[64],"our":[65],"own":[66],"platform":[67],"provide":[69],"the":[70,81],"solution":[74,83],"bridge.":[77,90],"HIC\u2122":[78],"can":[79],"offer":[80],"design":[82],"for":[84],"multi-die":[85],"heterogeneous":[86],"integration":[87],"For":[91],"this,":[92],"optimized":[93],"conditions":[94],"of":[95],"wiring":[96],"in":[98],"bridge":[100],"through":[101],"simulation":[103],"was":[104],"studied.":[105]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}