{"id":"https://openalex.org/W4391183327","doi":"https://doi.org/10.1109/isocc59558.2023.10396127","title":"Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect","display_name":"Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect","publication_year":2023,"publication_date":"2023-10-25","ids":{"openalex":"https://openalex.org/W4391183327","doi":"https://doi.org/10.1109/isocc59558.2023.10396127"},"language":"en","primary_location":{"id":"doi:10.1109/isocc59558.2023.10396127","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc59558.2023.10396127","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 20th International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071131442","display_name":"Jiwon Yoon","orcid":"https://orcid.org/0000-0002-0795-0696"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jiwon Yoon","raw_affiliation_strings":["Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I157485424"]},{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100330202","display_name":"Hyunwoo Kim","orcid":"https://orcid.org/0000-0002-5072-5881"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyunwoo Kim","raw_affiliation_strings":["Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I157485424"]},{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069974833","display_name":"Boogyo Sim","orcid":"https://orcid.org/0000-0003-1040-4458"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Boogyo Sim","raw_affiliation_strings":["Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I157485424"]},{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050974621","display_name":"Hyunwook Park","orcid":"https://orcid.org/0000-0001-9356-3635"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hyunwook Park","raw_affiliation_strings":["Missouri University of Science and Technology (MST),EMC Laboratory,Rolla,MO,USA","EMC Laboratory, Missouri University of Science and Technology (MST), Rolla, MO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Missouri University of Science and Technology (MST),EMC Laboratory,Rolla,MO,USA","institution_ids":["https://openalex.org/I20382870"]},{"raw_affiliation_string":"EMC Laboratory, Missouri University of Science and Technology (MST), Rolla, MO, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037452550","display_name":"Yi-Gyeong Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yigyeong Kim","raw_affiliation_strings":["Electronics and Telecommunications Research Institute (ETRI),PIM AI HPU Group,Daejeon,Republic of Korea","PIM AI HPU Group, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute (ETRI),PIM AI HPU Group,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]},{"raw_affiliation_string":"PIM AI HPU Group, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100733406","display_name":"Sujin Park","orcid":"https://orcid.org/0009-0007-7192-3389"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sujin Park","raw_affiliation_strings":["Electronics and Telecommunications Research Institute (ETRI),PIM AI HPU Group,Daejeon,Republic of Korea","PIM AI HPU Group, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute (ETRI),PIM AI HPU Group,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]},{"raw_affiliation_string":"PIM AI HPU Group, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110958951","display_name":"Young-Su Kwon","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youngsu Kwon","raw_affiliation_strings":["Electronics and Telecommunications Research Institute (ETRI),PIM AI HPU Group,Daejeon,Republic of Korea","PIM AI HPU Group, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute (ETRI),PIM AI HPU Group,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]},{"raw_affiliation_string":"PIM AI HPU Group, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5046623632","display_name":"Joungho Kim","orcid":"https://orcid.org/0000-0003-1376-0781"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joungho Kim","raw_affiliation_strings":["Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Advanced Institute of Science and Technology (KAIST),School of Electrical Engineering,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I157485424"]},{"raw_affiliation_string":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I157485424"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"247","last_page":"248"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9937999844551086,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.8462340235710144},{"id":"https://openalex.org/keywords/stripline","display_name":"Stripline","score":0.7200292348861694},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6959264278411865},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5506632924079895},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5300388336181641},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5174313187599182},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.4577062129974365},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.37062931060791016},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.3566151261329651},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.350894570350647},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.32818305492401123},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24325338006019592},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.18514040112495422}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.8462340235710144},{"id":"https://openalex.org/C80587232","wikidata":"https://www.wikidata.org/wiki/Q1976384","display_name":"Stripline","level":2,"score":0.7200292348861694},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6959264278411865},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5506632924079895},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5300388336181641},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5174313187599182},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.4577062129974365},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.37062931060791016},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.3566151261329651},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.350894570350647},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32818305492401123},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24325338006019592},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.18514040112495422},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isocc59558.2023.10396127","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc59558.2023.10396127","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 20th International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2037416628","https://openalex.org/W2073725000","https://openalex.org/W2789752821","https://openalex.org/W2205502757","https://openalex.org/W1480508001","https://openalex.org/W2235483886","https://openalex.org/W2097812662","https://openalex.org/W2887648165","https://openalex.org/W2528892790","https://openalex.org/W2117988687"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"designed":[4],"and":[5,26,44,49,68,83,114],"analyzed":[6,38],"multi-stripline":[7,123],"M1":[8],"redistribution":[9],"layer":[10],"(RDL)":[11],"interposer":[12,35,125],"channel":[13,23],"for":[14],"high":[15,64],"bandwidth":[16],"M2":[17],"memory":[18],"(HBM)":[19],"module":[20],"considering":[21],"full":[22],"routing":[24],"feasibility":[25],"via":[27,113,116],"interconnect":[28],"structure.":[29],"Electrical":[30],"performance":[31,101],"of":[32,41,59],"RDL":[33,80,96,111,124],"M3":[34],"channels":[36],"were":[37],"in":[39],"terms":[40],"insertion":[42,65],"loss":[43,67],"far-M4":[45],"end":[46],"crosstalk":[47],"(FEXT),":[48],"verified":[50],"with":[51],"eye":[52,88],"diagram":[53],"simulation":[54],"based":[55],"on":[56],"driving":[57],"conditions":[58],"HBM3.":[60],"Simulation":[61],"results":[62],"show":[63],"M5":[66],"FEXT":[69],"occurring":[70],"at":[71,79,87],"M4":[72,95],"layer,":[73],"due":[74],"to":[75],"discontinuous":[76],"reference":[77],"plane":[78],"transition":[81,97,112],"via,":[82,98],"increased":[84],"timing":[85],"jitter":[86],"diagram.":[89],"By":[90],"placing":[91],"ground":[92,115],"vias":[93],"near":[94],"overall":[99],"electrical":[100],"was":[102],"significantly":[103],"improved.":[104],"As":[105],"a":[106],"result,":[107],"it":[108],"showed":[109],"that":[110],"placement":[117],"should":[118],"be":[119],"considered":[120],"when":[121],"designing":[122],"channels.":[126]},"counts_by_year":[{"year":2025,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}