{"id":"https://openalex.org/W2806147564","doi":"https://doi.org/10.1109/isocc.2017.8368842","title":"Building block multi-chip systems using inductive coupling through chip interface","display_name":"Building block multi-chip systems using inductive coupling through chip interface","publication_year":2017,"publication_date":"2017-11-01","ids":{"openalex":"https://openalex.org/W2806147564","doi":"https://doi.org/10.1109/isocc.2017.8368842","mag":"2806147564"},"language":"en","primary_location":{"id":"doi:10.1109/isocc.2017.8368842","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc.2017.8368842","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113742339","display_name":"Hideharu Amano","orcid":null},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hideharu Amano","raw_affiliation_strings":["Keio University","Keio Univesity"],"affiliations":[{"raw_affiliation_string":"Keio University","institution_ids":["https://openalex.org/I203951103"]},{"raw_affiliation_string":"Keio Univesity","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073154009","display_name":"Tadahiro Kuroda","orcid":"https://orcid.org/0000-0003-0617-1057"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tadahiro Kuroda","raw_affiliation_strings":["Keio University","Keio Univesity"],"affiliations":[{"raw_affiliation_string":"Keio University","institution_ids":["https://openalex.org/I203951103"]},{"raw_affiliation_string":"Keio Univesity","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090578339","display_name":"Hiroshi Nakamura","orcid":"https://orcid.org/0009-0005-6505-1903"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hiroshi Nakamura","raw_affiliation_strings":["Univesity of Tokyo"],"affiliations":[{"raw_affiliation_string":"Univesity of Tokyo","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030692253","display_name":"Kimiyoshi Usami","orcid":"https://orcid.org/0000-0002-8911-3313"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kimiyoshi Usami","raw_affiliation_strings":["Shibara Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Shibara Institute of Technology","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103017591","display_name":"Masaaki Kondo","orcid":"https://orcid.org/0000-0002-6025-8738"},"institutions":[{"id":"https://openalex.org/I74801974","display_name":"The University of Tokyo","ror":"https://ror.org/057zh3y96","country_code":"JP","type":"education","lineage":["https://openalex.org/I74801974"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masaaki Kondo","raw_affiliation_strings":["University of Tokyo","Univesity of Tokyo"],"affiliations":[{"raw_affiliation_string":"University of Tokyo","institution_ids":["https://openalex.org/I74801974"]},{"raw_affiliation_string":"Univesity of Tokyo","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041549339","display_name":"Hiroki Matsutani","orcid":"https://orcid.org/0000-0001-9578-3842"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroki Matsutani","raw_affiliation_strings":["Keio University","Keio Univesity"],"affiliations":[{"raw_affiliation_string":"Keio University","institution_ids":["https://openalex.org/I203951103"]},{"raw_affiliation_string":"Keio Univesity","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113856358","display_name":"Mitaro Namiki","orcid":null},"institutions":[{"id":"https://openalex.org/I92614990","display_name":"Tokyo University of Agriculture and Technology","ror":"https://ror.org/00qg0kr10","country_code":"JP","type":"education","lineage":["https://openalex.org/I92614990"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Mitaro Namiki","raw_affiliation_strings":["Tokyo Universtiy of Agriculture and Technology"],"affiliations":[{"raw_affiliation_string":"Tokyo Universtiy of Agriculture and Technology","institution_ids":["https://openalex.org/I92614990"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5113742339"],"corresponding_institution_ids":["https://openalex.org/I203951103"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.21353972,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"152","last_page":"154"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9779999852180481,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9757999777793884,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7652049660682678},{"id":"https://openalex.org/keywords/block","display_name":"Block (permutation group theory)","score":0.6754855513572693},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6043325662612915},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6006336212158203},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.550406277179718},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5350528955459595},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5139017105102539},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4684436619281769},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.46507737040519714},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.45276111364364624},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.43778759241104126},{"id":"https://openalex.org/keywords/inductive-coupling","display_name":"Inductive coupling","score":0.41306644678115845},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.40703344345092773},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.33966976404190063},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26561439037323},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.141708642244339},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08058828115463257}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7652049660682678},{"id":"https://openalex.org/C2777210771","wikidata":"https://www.wikidata.org/wiki/Q4927124","display_name":"Block (permutation group theory)","level":2,"score":0.6754855513572693},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6043325662612915},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6006336212158203},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.550406277179718},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5350528955459595},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5139017105102539},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4684436619281769},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.46507737040519714},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.45276111364364624},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.43778759241104126},{"id":"https://openalex.org/C177872590","wikidata":"https://www.wikidata.org/wiki/Q1498289","display_name":"Inductive coupling","level":2,"score":0.41306644678115845},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40703344345092773},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.33966976404190063},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26561439037323},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.141708642244339},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08058828115463257},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isocc.2017.8368842","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc.2017.8368842","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.4399999976158142}],"awards":[],"funders":[{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W804309389","https://openalex.org/W1978299837","https://openalex.org/W2761767832","https://openalex.org/W2806947028","https://openalex.org/W2807424109","https://openalex.org/W6752087186","https://openalex.org/W6752397452"],"related_works":["https://openalex.org/W4254365700","https://openalex.org/W1604487289","https://openalex.org/W1966285216","https://openalex.org/W2543122780","https://openalex.org/W2742808714","https://openalex.org/W2023632158","https://openalex.org/W196928559","https://openalex.org/W2147178958","https://openalex.org/W2526261315","https://openalex.org/W2000014635"],"abstract_inverted_index":{"A":[0],"building":[1,19,67],"block":[2,68],"computing":[3],"system":[4,80],"is":[5],"consisting":[6],"of":[7,24,33,74],"multiple":[8],"chips":[9],"connecting":[10],"with":[11],"inductive":[12,50],"coupling":[13,51],"wireless":[14,52],"through":[15,53],"chip":[16,54],"interconnect.":[17],"Like":[18],"Lego":[20],"blocks,":[21],"various":[22],"types":[23,32],"systems":[25],"can":[26],"be":[27],"built":[28],"by":[29],"stacking":[30],"different":[31],"chips.":[34],"In":[35],"order":[36],"to":[37],"develop":[38],"such":[39],"systems,":[40],"several":[41],"techniques":[42],"are":[43,81],"investigated":[44],"in":[45],"the":[46,72,75],"project:":[47],"that":[48],"is,":[49],"interface,":[55],"low":[56],"power":[57],"circuit":[58],"technologies,":[59],"autonomous":[60],"interconnection":[61],"network":[62],"architectures,":[63],"thermal":[64],"dissipation":[65],"and":[66,77],"operating":[69],"system.":[70],"Here,":[71],"overview":[73],"project":[76],"a":[78],"prototype":[79],"introduced.":[82]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}