{"id":"https://openalex.org/W2564353128","doi":"https://doi.org/10.1109/isocc.2016.7799847","title":"High bandwidth memory(HBM) with TSV technique","display_name":"High bandwidth memory(HBM) with TSV technique","publication_year":2016,"publication_date":"2016-10-01","ids":{"openalex":"https://openalex.org/W2564353128","doi":"https://doi.org/10.1109/isocc.2016.7799847","mag":"2564353128"},"language":"en","primary_location":{"id":"doi:10.1109/isocc.2016.7799847","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc.2016.7799847","pdf_url":null,"source":{"id":"https://openalex.org/S4306420065","display_name":"International SoC Design Conference","issn_l":"2163-9612","issn":["2163-9612"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043743014","display_name":"Jong Chern Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jong Chern Lee","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100451546","display_name":"Jihwan Kim","orcid":"https://orcid.org/0000-0002-8003-2621","observed_orcids":["https://orcid.org/0000-0002-8003-2621","https://orcid.org/0009-0007-2297-151X"]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jihwan Kim","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046854464","display_name":"Kyung Whan Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kyung Whan Kim","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017092235","display_name":"Young Jun Ku","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Young Jun Ku","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081816662","display_name":"Dae Suk Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dae Suk Kim","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039665161","display_name":"Chunseok Jeong","orcid":"https://orcid.org/0009-0004-1666-7878","observed_orcids":["https://orcid.org/0009-0004-1666-7878"]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Chunseok Jeong","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045581018","display_name":"Tae Sik Yun","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Tae Sik Yun","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102965505","display_name":"Hongjung Kim","orcid":"https://orcid.org/0009-0007-2863-3298","observed_orcids":["https://orcid.org/0009-0007-2863-3298"]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hongjung Kim","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057114977","display_name":"Ho Sung Cho","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ho Sung Cho","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072240339","display_name":"Sangmuk Oh","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sangmuk Oh","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109353815","display_name":"Hyun Sung Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyun Sung Lee","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053595140","display_name":"Ki Hun Kwon","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ki Hun Kwon","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028056516","display_name":"Dong Beom Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dong Beom Lee","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056592544","display_name":"Young Jae Choi","orcid":"https://orcid.org/0000-0001-9816-8722","observed_orcids":["https://orcid.org/0000-0001-9816-8722"]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Young Jae Choi","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100767174","display_name":"Jaejin Lee","orcid":"https://orcid.org/0000-0001-7179-6446","observed_orcids":["https://orcid.org/0000-0001-7179-6446"]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaejin Lee","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112049413","display_name":"Hyeon Gon Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyeon Gon Kim","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049311502","display_name":"Jun Hyun Chun","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jun Hyun Chun","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104304335","display_name":"Jonghoon Oh","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jonghoon Oh","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101403407","display_name":"Seok Hee Lee","orcid":"https://orcid.org/0009-0005-8015-1558","observed_orcids":["https://orcid.org/0009-0005-8015-1558"]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seok Hee Lee","raw_affiliation_strings":["HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HBM Design Team, SK Hynix Inc., Icheon, Gyeong-gi, South Korea","institution_ids":["https://openalex.org/I4405272917"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4405272917"],"apc_list":null,"apc_paid":null,"fwci":6.5432,"has_fulltext":false,"cited_by_count":61,"citation_normalized_percentile":{"value":0.97901414,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"181","last_page":"182"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.0,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/high-bandwidth-memory","display_name":"high-bandwidth memory","score":0.972000002861023},{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.8479999899864197},{"id":"https://openalex.org/keywords/tsv-reliability","display_name":"TSV reliability","score":0.996999979019165},{"id":"https://openalex.org/keywords/3d-stacked-dram","display_name":"3D-stacked DRAM","score":0.6549999713897705}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.9350482225418091},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5985693335533142},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5706173777580261},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4847126007080078},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.45139452815055847},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.4193156361579895},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3740464150905609},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.34421372413635254},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23604074120521545},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.18718230724334717},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.11981827020645142},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.07465073466300964},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.04544180631637573},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isocc.2016.7799847","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isocc.2016.7799847","pdf_url":null,"source":{"id":"https://openalex.org/S4306420065","display_name":"International SoC Design Conference","issn_l":"2163-9612","issn":["2163-9612"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International SoC Design Conference (ISOCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[{"score":0.5099999904632568,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2054298969","https://openalex.org/W2114299127","https://openalex.org/W2288290444","https://openalex.org/W6677028997"],"related_works":["https://openalex.org/W3120961607","https://openalex.org/W4401568740","https://openalex.org/W3148568549","https://openalex.org/W2098207691","https://openalex.org/W1648516568","https://openalex.org/W361036515","https://openalex.org/W2161286015","https://openalex.org/W2269474412","https://openalex.org/W2024395993","https://openalex.org/W4214760333"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"HBM":[3,34],"DRAM":[4,37],"with":[5],"TSV":[6,15,21,23,25,31],"technique":[7],"is":[8,41],"introduced.":[9],"This":[10],"paper":[11],"covers":[12],"the":[13,45],"general":[14],"feature":[16],"and":[17,30,47],"techniques":[18],"such":[19],"as":[20],"architecture,":[22],"reliability,":[24],"open":[26],"/":[27],"short":[28],"test,":[29],"repair.":[32],"And":[33],"DRAM,":[35],"representative":[36],"product":[38],"using":[39],"TSV,":[40],"widely":[42],"presented,":[43],"especially":[44],"use":[46],"features.":[48]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":10},{"year":2024,"cited_by_count":12},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":9},{"year":2021,"cited_by_count":7},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":6}],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2025-10-10T00:00:00"}