{"id":"https://openalex.org/W3107404958","doi":"https://doi.org/10.1109/isdcs49393.2020.9262991","title":"Electrical and Thermal Analysis of Cu-CNT Composite TSV and GNR Interconnects","display_name":"Electrical and Thermal Analysis of Cu-CNT Composite TSV and GNR Interconnects","publication_year":2020,"publication_date":"2020-03-04","ids":{"openalex":"https://openalex.org/W3107404958","doi":"https://doi.org/10.1109/isdcs49393.2020.9262991","mag":"3107404958"},"language":"en","primary_location":{"id":"doi:10.1109/isdcs49393.2020.9262991","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isdcs49393.2020.9262991","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 International Symposium on Devices, Circuits and Systems (ISDCS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5031459990","display_name":"Komal Sable","orcid":null},"institutions":[{"id":"https://openalex.org/I189109744","display_name":"Indian Institute of Technology Dhanbad","ror":"https://ror.org/013v3cc28","country_code":"IN","type":"education","lineage":["https://openalex.org/I189109744"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Komal Sable","raw_affiliation_strings":["IIT (ISM), Dhanbad, Jharkhand, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IIT (ISM), Dhanbad, Jharkhand, India","institution_ids":["https://openalex.org/I189109744"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5000341246","display_name":"Manodipan Sahoo","orcid":"https://orcid.org/0000-0001-9800-2773"},"institutions":[{"id":"https://openalex.org/I189109744","display_name":"Indian Institute of Technology Dhanbad","ror":"https://ror.org/013v3cc28","country_code":"IN","type":"education","lineage":["https://openalex.org/I189109744"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Manodipan Sahoo","raw_affiliation_strings":["IIT (ISM), Dhanbad, Jharkhand, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IIT (ISM), Dhanbad, Jharkhand, India","institution_ids":["https://openalex.org/I189109744"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I189109744"],"apc_list":null,"apc_paid":null,"fwci":1.7891,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.84972823,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.8657136559486389},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8591762781143188},{"id":"https://openalex.org/keywords/ampacity","display_name":"Ampacity","score":0.8516429662704468},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.7763614058494568},{"id":"https://openalex.org/keywords/carbon-nanotube","display_name":"Carbon nanotube","score":0.7518265247344971},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.6936438083648682},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5275425910949707},{"id":"https://openalex.org/keywords/graphene","display_name":"Graphene","score":0.5172160863876343},{"id":"https://openalex.org/keywords/electrical-resistivity-and-conductivity","display_name":"Electrical resistivity and conductivity","score":0.4696323871612549},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.457421213388443},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"Contact resistance","score":0.42620614171028137},{"id":"https://openalex.org/keywords/nanomaterials","display_name":"Nanomaterials","score":0.4252098798751831},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.33518314361572266},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.27690666913986206},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.2259959578514099},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.19559651613235474},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.16323912143707275},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.09934002161026001}],"concepts":[{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.8657136559486389},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8591762781143188},{"id":"https://openalex.org/C7943809","wikidata":"https://www.wikidata.org/wiki/Q1977384","display_name":"Ampacity","level":3,"score":0.8516429662704468},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.7763614058494568},{"id":"https://openalex.org/C513720949","wikidata":"https://www.wikidata.org/wiki/Q1778729","display_name":"Carbon nanotube","level":2,"score":0.7518265247344971},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.6936438083648682},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5275425910949707},{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.5172160863876343},{"id":"https://openalex.org/C69990965","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrical resistivity and conductivity","level":2,"score":0.4696323871612549},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.457421213388443},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.42620614171028137},{"id":"https://openalex.org/C138631740","wikidata":"https://www.wikidata.org/wiki/Q967847","display_name":"Nanomaterials","level":2,"score":0.4252098798751831},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.33518314361572266},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.27690666913986206},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.2259959578514099},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.19559651613235474},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.16323912143707275},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09934002161026001},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isdcs49393.2020.9262991","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isdcs49393.2020.9262991","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 International Symposium on Devices, Circuits and Systems (ISDCS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1995762238","https://openalex.org/W2034089924","https://openalex.org/W2048906268","https://openalex.org/W2055512203","https://openalex.org/W2092304832","https://openalex.org/W2106997452","https://openalex.org/W2116658251","https://openalex.org/W2120551433","https://openalex.org/W2130923737","https://openalex.org/W2131395792","https://openalex.org/W2144349509","https://openalex.org/W2160019980","https://openalex.org/W2316234761","https://openalex.org/W2586377472","https://openalex.org/W2762968308","https://openalex.org/W2795341843","https://openalex.org/W2886901617","https://openalex.org/W2902728709","https://openalex.org/W2969157870"],"related_works":["https://openalex.org/W2181505794","https://openalex.org/W3033184681","https://openalex.org/W2393022708","https://openalex.org/W2783643390","https://openalex.org/W2981515857","https://openalex.org/W2363926447","https://openalex.org/W2488424503","https://openalex.org/W4253544573","https://openalex.org/W3198083931","https://openalex.org/W2135932367"],"abstract_inverted_index":{"Modeling":[0],"3D":[1,59],"IC":[2],"structures":[3],"with":[4],"through-silicon":[5],"vias":[6],"(TSVs)":[7],"is":[8,73,81,121],"a":[9,131,138,152],"promising":[10],"technique":[11],"to":[12,25,54,130],"achieve":[13],"\"more":[14],"than":[15,83,110,123,142,148],"Moore\"":[16],"integration.":[17],"Carbon":[18,38],"nanomaterials":[19],"are":[20,52,128],"an":[21],"emerging":[22],"solution":[23],"due":[24],"its":[26,111],"properties":[27],"like":[28],"high":[29],"thermal":[30,115,146],"conductivity":[31,116,141,147],"and":[32,41,46,70,87,94,100,105,144],"better":[33,122,139,145],"ampacity.":[34],"In":[35],"this":[36,76],"paper,":[37],"nanotube":[39],"(CNT)":[40],"copper":[42,95,112,124,149],"composite":[43,72,93,120,136],"as":[44,50],"TSV":[45,158],"Graphene":[47],"nanoribbons":[48],"(GNRs)":[49],"interconnects":[51],"considered":[53],"improve":[55],"the":[56,64,155],"performance":[57],"of":[58,63,67,91],"ICs.":[60],"A":[61],"comparison":[62],"electro-thermal":[65],"behavior":[66],"copper,":[68],"CNT":[69,84,143],"copper-CNT":[71,92,119],"shown":[74],"in":[75,89],"work.":[77],"The":[78,97,114,134],"electrical":[79,140],"resistance":[80,109],"less":[82],"by":[85,118],"57.3%":[86],"72.9%":[88],"case":[90],"respectively.":[96],"CNT/GNR":[98],"interface":[99,102,108],"copper-CNT/GNR":[101],"offers":[103],"80.5%":[104],"64.2%":[106],"lower":[107],"counterpart.":[113],"obtained":[117],"because":[125],"self-heating":[126],"effects":[127],"eliminated":[129],"large":[132],"extent.":[133],"Cu-CNT":[135],"provides":[137],"thus":[150],"providing":[151],"tradeoff":[153],"between":[154],"two":[156],"alternative":[157],"configurations.":[159]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}