{"id":"https://openalex.org/W3159537059","doi":"https://doi.org/10.1109/iscas51556.2021.9401245","title":"Monolithic 3D SRAM Cell with Stacked Two-Dimensional Materials Based FETs at 2nm Node","display_name":"Monolithic 3D SRAM Cell with Stacked Two-Dimensional Materials Based FETs at 2nm Node","publication_year":2021,"publication_date":"2021-04-27","ids":{"openalex":"https://openalex.org/W3159537059","doi":"https://doi.org/10.1109/iscas51556.2021.9401245","mag":"3159537059"},"language":"en","primary_location":{"id":"doi:10.1109/iscas51556.2021.9401245","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas51556.2021.9401245","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083596674","display_name":"Vita Pi\u2010Ho Hu","orcid":"https://orcid.org/0000-0002-6216-214X"},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Vita Pi-Ho Hu","raw_affiliation_strings":["Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043281010","display_name":"Chengwei Su","orcid":"https://orcid.org/0000-0003-1492-723X"},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Wei Su","raw_affiliation_strings":["Department of Electrical Engineering, National Central University, Taoyuan, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Central University, Taoyuan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109967919","display_name":"Chun-Chi Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Chi Yu","raw_affiliation_strings":["Department of Electrical Engineering, National Central University, Taoyuan, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Central University, Taoyuan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042494441","display_name":"Changju Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chang-Ju Liu","raw_affiliation_strings":["Department of Electrical Engineering, National Central University, Taoyuan, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Central University, Taoyuan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5004811526","display_name":"Cheng-Yang Weng","orcid":null},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Yang Weng","raw_affiliation_strings":["Department of Electrical Engineering, National Central University, Taoyuan, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Central University, Taoyuan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5083596674"],"corresponding_institution_ids":["https://openalex.org/I16733864"],"apc_list":null,"apc_paid":null,"fwci":0.2024,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.49422306,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.7449170351028442},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.6665018796920776},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6250101327896118},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5640532374382019},{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.5053694844245911},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4426414370536804},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.39231184124946594},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.38006123900413513},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.13556337356567383},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.11565428972244263}],"concepts":[{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.7449170351028442},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.6665018796920776},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6250101327896118},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5640532374382019},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.5053694844245911},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4426414370536804},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39231184124946594},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38006123900413513},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.13556337356567383},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.11565428972244263},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas51556.2021.9401245","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas51556.2021.9401245","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8899999856948853}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322108","display_name":"Ministry of Science and Technology","ror":"https://ror.org/032e49973"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1560609009","https://openalex.org/W2004230919","https://openalex.org/W2246485199","https://openalex.org/W2274496440","https://openalex.org/W2335202810","https://openalex.org/W2335685603","https://openalex.org/W2524623661","https://openalex.org/W2585733367","https://openalex.org/W2789659455","https://openalex.org/W2789777840","https://openalex.org/W2804762466","https://openalex.org/W2888978925","https://openalex.org/W2893994549","https://openalex.org/W2921026208","https://openalex.org/W2948537294","https://openalex.org/W2955393539","https://openalex.org/W2995998068","https://openalex.org/W3082732228","https://openalex.org/W6651351994"],"related_works":["https://openalex.org/W4392590355","https://openalex.org/W3151633427","https://openalex.org/W2212894501","https://openalex.org/W2793465010","https://openalex.org/W3024050170","https://openalex.org/W2109451123","https://openalex.org/W4378977321","https://openalex.org/W1976168335","https://openalex.org/W4308090481","https://openalex.org/W3211992815"],"abstract_inverted_index":{"Continued":[0],"scaling":[1],"of":[2,14,41],"the":[3,7,12,39,46,51,93],"interconnect":[4],"geometry":[5],"increases":[6],"metal":[8,42],"resistance":[9],"which":[10],"degrades":[11],"performance":[13],"SRAM":[15,28,54,87],"in":[16,64,69,76],"advanced":[17],"technology":[18],"nodes.":[19],"We":[20],"propose":[21],"an":[22],"energy-efficient":[23],"multi-tiers":[24],"monolithic":[25],"3D":[26],"(M3D)":[27],"cell":[29,55,65,88],"design":[30,49],"with":[31,56],"stacked":[32,57],"2D":[33],"material":[34],"nanosheet":[35],"FETs":[36,59],"to":[37],"release":[38],"impact":[40],"line":[43],"resistance.":[44],"Considering":[45],"2nm":[47],"node":[48],"rules,":[50],"3-tier":[52],"M3D":[53,86],"MoS2":[58],"shows":[60],"a":[61],"42%":[62],"reduction":[63],"area,":[66],"49%":[67],"improvement":[68,75],"read":[70],"access":[71],"time,":[72],"and":[73,81,95],"68%":[74],"energy-delay":[77],"product.":[78],"The":[79],"energy-":[80],"area-efficient":[82],"high-performance":[83],"3-":[84],"tier":[85],"enables":[89],"intelligent":[90],"functionalities":[91],"for":[92],"area":[94],"energy-constrained":[96],"edge":[97],"computing":[98],"devices.":[99]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":3},{"year":2022,"cited_by_count":2}],"updated_date":"2026-03-27T14:29:43.386196","created_date":"2025-10-10T00:00:00"}
