{"id":"https://openalex.org/W3090258404","doi":"https://doi.org/10.1109/iscas45731.2020.9180500","title":"An In-Situ Technique for Measuring the Individual Contact Resistance between the Pins of an IC Package and the Board of a Flexible Hybrid Electronic System","display_name":"An In-Situ Technique for Measuring the Individual Contact Resistance between the Pins of an IC Package and the Board of a Flexible Hybrid Electronic System","publication_year":2020,"publication_date":"2020-09-29","ids":{"openalex":"https://openalex.org/W3090258404","doi":"https://doi.org/10.1109/iscas45731.2020.9180500","mag":"3090258404"},"language":"en","primary_location":{"id":"doi:10.1109/iscas45731.2020.9180500","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas45731.2020.9180500","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070318193","display_name":"Rafid Adnan Khan","orcid":"https://orcid.org/0000-0001-6494-0390"},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Rafid Adnan Khan","raw_affiliation_strings":["Department of Electrical and Computer, Engineering, McGill University, Montreal, Canada","Department of Electrical and Computer Engineering, McGill University, Montreal, QC, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer, Engineering, McGill University, Montreal, Canada","institution_ids":["https://openalex.org/I5023651"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McGill University, Montreal, QC, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056719321","display_name":"Mohammad Muhtady Muhaisin","orcid":null},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Mohammad Muhtady Muhaisin","raw_affiliation_strings":["Department of Electrical and Computer, Engineering, McGill University, Montreal, Canada","Department of Electrical and Computer Engineering, McGill University, Montreal, QC, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer, Engineering, McGill University, Montreal, Canada","institution_ids":["https://openalex.org/I5023651"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McGill University, Montreal, QC, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083312864","display_name":"Gordon W. Roberts","orcid":"https://orcid.org/0000-0002-4880-0272"},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Gordon W. Roberts","raw_affiliation_strings":["Department of Electrical and Computer, Engineering, McGill University, Montreal, Canada","Department of Electrical and Computer Engineering, McGill University, Montreal, QC, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer, Engineering, McGill University, Montreal, Canada","institution_ids":["https://openalex.org/I5023651"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McGill University, Montreal, QC, Canada","institution_ids":["https://openalex.org/I5023651"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I5023651"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"54","issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/in-situ","display_name":"In situ","score":0.5802438259124756},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"Contact resistance","score":0.519043505191803},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5026836395263672},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.501610517501831},{"id":"https://openalex.org/keywords/on-board","display_name":"On board","score":0.47919926047325134},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.43592405319213867},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3426806628704071},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.34263768792152405},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33307772874832153},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31390637159347534},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.19287630915641785},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0826452374458313},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.06746691465377808}],"concepts":[{"id":"https://openalex.org/C2777822432","wikidata":"https://www.wikidata.org/wiki/Q216681","display_name":"In situ","level":2,"score":0.5802438259124756},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.519043505191803},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5026836395263672},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.501610517501831},{"id":"https://openalex.org/C3018963415","wikidata":"https://www.wikidata.org/wiki/Q16878425","display_name":"On board","level":2,"score":0.47919926047325134},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.43592405319213867},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3426806628704071},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.34263768792152405},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33307772874832153},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31390637159347534},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.19287630915641785},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0826452374458313},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.06746691465377808},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas45731.2020.9180500","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas45731.2020.9180500","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Responsible consumption and production","id":"https://metadata.un.org/sdg/12","score":0.5099999904632568}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1969382418","https://openalex.org/W2074122171","https://openalex.org/W2084128131","https://openalex.org/W2216956381","https://openalex.org/W2268822069","https://openalex.org/W2485639752","https://openalex.org/W2507774541","https://openalex.org/W2560184703","https://openalex.org/W2791860508","https://openalex.org/W2886337169","https://openalex.org/W2947787582","https://openalex.org/W2982327533"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2352480464","https://openalex.org/W2352622857","https://openalex.org/W2042930481","https://openalex.org/W2157959646","https://openalex.org/W3193290246","https://openalex.org/W4312310074","https://openalex.org/W1915563482","https://openalex.org/W2392091202","https://openalex.org/W2389171185"],"abstract_inverted_index":{"An":[0],"in-situ":[1],"technique":[2,82],"is":[3,54,146],"presented":[4],"for":[5],"measuring":[6],"the":[7,12,28,31,35,38,45,60,84,99,103,108,117,123,128,131,135,180],"individual":[8],"contact":[9,47,100,125,181],"resistance":[10,53,101,106,126,182],"between":[11,127],"pins":[13,129],"of":[14,62,74,107,130,188],"an":[15,90],"IC":[16,36,91,113,132,154],"package":[17,133,155],"and":[18,41,102,134],"a":[19,67,95,141,167,184],"flexible":[20,68],"substrate":[21,29,39,69,164],"used":[22],"in":[23,89],"hybrid":[24],"electronic":[25,63],"systems.":[26],"As":[27],"flexes,":[30],"forces":[32],"that":[33],"adhere":[34],"to":[37,44,56,59,71,93,149,161,166],"change":[40],"cause":[42],"increase":[43],"series":[46,104,124],"resistance;":[48],"sometimes":[49],"catastrophically.":[50],"Tracking":[51],"this":[52],"seen":[55],"be":[57,138,172],"fundamental":[58],"success":[61],"systems":[64],"mounted":[65],"on":[66],"subjected":[70,165],"various":[72],"levels":[73],"bending":[75,169],"throughout":[76],"its":[77],"life":[78],"cycle.":[79],"The":[80,157,174],"measurement":[81],"exploits":[83],"electrostatic":[85],"discharge":[86],"protection":[87],"circuitry":[88],"chip":[92],"create":[94],"circuit":[96,110],"loop":[97],"involving":[98],"incremental":[105],"ESD":[109],"via":[111],"two":[112],"pins,":[114],"one":[115],"being":[116],"GND":[118],"or":[119],"VDD":[120],"pin.":[121],"While":[122],"board":[136],"can":[137],"measured":[139],"with":[140,151,183],"four-point":[142],"Kelvin":[143],"measurement,":[144],"it":[145],"extremely":[147],"difficult":[148],"perform":[150],"small":[152],"surface-mount":[153],"devices.":[156],"experimental":[158],"results":[159],"pertaining":[160],"Kapton":[162],"polyimide":[163],"controlled":[168],"process":[170],"will":[171,178],"described.":[173],"method":[175],"proposed":[176],"here":[177],"determine":[179],"relative":[185],"accuracy":[186],"error":[187],"less":[189],"than":[190],"1%.":[191]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}