{"id":"https://openalex.org/W2757315724","doi":"https://doi.org/10.1109/iscas.2017.8050912","title":"Layout decomposition for hybrid E-beam and DSA double patterning lithography","display_name":"Layout decomposition for hybrid E-beam and DSA double patterning lithography","publication_year":2017,"publication_date":"2017-05-01","ids":{"openalex":"https://openalex.org/W2757315724","doi":"https://doi.org/10.1109/iscas.2017.8050912","mag":"2757315724"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2017.8050912","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2017.8050912","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011507499","display_name":"Yunfeng Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yunfeng Yang","raw_affiliation_strings":["Microelectronics Dept., Fudan University, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Dept., Fudan University, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045464812","display_name":"Fan Yang","orcid":"https://orcid.org/0000-0003-2164-8175"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fan Yang","raw_affiliation_strings":["Microelectronics Dept., Fudan University, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Dept., Fudan University, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109302065","display_name":"Wai-Shing Luk","orcid":"https://orcid.org/0009-0006-8322-8079"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wai-Shing Luk","raw_affiliation_strings":["Microelectronics Dept., Fudan University, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Dept., Fudan University, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037328458","display_name":"Changhao Yan","orcid":"https://orcid.org/0000-0002-8936-3945"},"institutions":[{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]},{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Changhao Yan","raw_affiliation_strings":["Microelectronics Dept., Fudan University, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Dept., Fudan University, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064213921","display_name":"Xuan Zeng","orcid":"https://orcid.org/0000-0002-8097-4053"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuan Zeng","raw_affiliation_strings":["Microelectronics Dept., Fudan University, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Dept., Fudan University, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103814584","display_name":"Xiangdong Hu","orcid":"https://orcid.org/0000-0003-4841-4264"},"institutions":[{"id":"https://openalex.org/I2802974365","display_name":"Shanghai Innovative Research Center of Traditional Chinese Medicine","ror":"https://ror.org/01gnagj68","country_code":"CN","type":"facility","lineage":["https://openalex.org/I2802974365"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiangdong Hu","raw_affiliation_strings":["Shanghai High-Performance Integrated-Circuit Design Center, China"],"affiliations":[{"raw_affiliation_string":"Shanghai High-Performance Integrated-Circuit Design Center, China","institution_ids":["https://openalex.org/I2802974365"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5011507499"],"corresponding_institution_ids":["https://openalex.org/I24943067","https://openalex.org/I4210132426"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.12112501,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"31","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.7291696071624756},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.7020409107208252},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5794338583946228},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5206250548362732},{"id":"https://openalex.org/keywords/decomposition","display_name":"Decomposition","score":0.4711650311946869},{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.44642847776412964},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4416255056858063},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.4266129434108734},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.3915979266166687},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.3872414827346802},{"id":"https://openalex.org/keywords/mathematical-optimization","display_name":"Mathematical optimization","score":0.3415217995643616},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2875053882598877},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.23464363813400269},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17894664406776428},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.1359311044216156},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.0936046838760376}],"concepts":[{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.7291696071624756},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7020409107208252},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5794338583946228},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5206250548362732},{"id":"https://openalex.org/C124681953","wikidata":"https://www.wikidata.org/wiki/Q339062","display_name":"Decomposition","level":2,"score":0.4711650311946869},{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.44642847776412964},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4416255056858063},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.4266129434108734},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3915979266166687},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.3872414827346802},{"id":"https://openalex.org/C126255220","wikidata":"https://www.wikidata.org/wiki/Q141495","display_name":"Mathematical optimization","level":1,"score":0.3415217995643616},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2875053882598877},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.23464363813400269},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17894664406776428},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1359311044216156},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0936046838760376},{"id":"https://openalex.org/C18903297","wikidata":"https://www.wikidata.org/wiki/Q7150","display_name":"Ecology","level":1,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2017.8050912","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2017.8050912","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4099999964237213,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1544515183","https://openalex.org/W1995865561","https://openalex.org/W2025251804","https://openalex.org/W2025304056","https://openalex.org/W2034249953","https://openalex.org/W2035821057","https://openalex.org/W2053242939","https://openalex.org/W2053913299","https://openalex.org/W2069323107","https://openalex.org/W2084145289","https://openalex.org/W2118752641","https://openalex.org/W2130949902","https://openalex.org/W2292988356","https://openalex.org/W2293915858","https://openalex.org/W2342679249","https://openalex.org/W3149318025","https://openalex.org/W4254569978","https://openalex.org/W4255985149","https://openalex.org/W6632396972","https://openalex.org/W6656856322","https://openalex.org/W6679374087"],"related_works":["https://openalex.org/W4226323632","https://openalex.org/W4321454142","https://openalex.org/W2376495194","https://openalex.org/W3144174107","https://openalex.org/W2062151620","https://openalex.org/W2026197969","https://openalex.org/W3033444048","https://openalex.org/W2023258188","https://openalex.org/W2022535683","https://openalex.org/W4307818291"],"abstract_inverted_index":{"The":[0,76],"printability":[1],"problem":[2,78,103],"of":[3],"chip":[4],"making":[5],"becomes":[6],"challenging":[7],"in":[8],"advanced":[9],"process":[10],"nodes.":[11],"At":[12],"present,":[13],"various":[14],"lithography":[15],"technologies":[16],"such":[17],"as":[18,87],"multiple":[19],"patterning":[20,82],"(MP),":[21],"directed":[22],"self-assembly":[23],"(DSA),":[24],"electron":[25],"beam":[26],"(e-beam),":[27],"and":[28,55,122],"their":[29],"combinations":[30],"are":[31,45],"being":[32],"considered.":[33],"In":[34,47],"this":[35],"paper,":[36],"the":[37,51,102],"corresponding":[38],"layout":[39],"decomposition":[40],"problems":[41],"for":[42,79,100],"contact/via":[43],"generation":[44],"studied.":[46],"particular,":[48],"we":[49,60],"investigate":[50],"simultaneous":[52],"DSA":[53,80],"template":[54,124],"e-beam":[56,84],"throughput":[57,120],"optimization.":[58],"First,":[59],"present":[61],"an":[62,67],"exact":[63],"method":[64,115],"based":[65,95],"on":[66],"ILP":[68],"formulation.":[69],"Then,":[70],"a":[71,88,111],"graph-based":[72],"algorithm":[73,96],"is":[74,85,97],"developed.":[75],"co-optimization":[77],"double":[81],"with":[83,110],"formulated":[86],"minimum":[89],"hitting":[90],"set":[91],"problem.":[92],"A":[93],"primal-dual":[94],"then":[98],"derived":[99],"solving":[101],"effectively.":[104],"Experimental":[105],"results":[106],"show":[107],"that":[108],"compared":[109],"two-stage":[112],"method,":[113],"our":[114],"can":[116],"achieve":[117],"around":[118],"20.6%":[119],"improvement":[121],"18.7%":[123],"cost":[125],"reduction.":[126]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}